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11.
Vu Hoa T. Nguyen Manh B. Vu Tan M. Le Giang H. Pham Trang T. T. Nguyen Trinh Duy Vu Tuan A. 《Topics in Catalysis》2020,63(11-14):1046-1055
Topics in Catalysis - Nano Fe-BTC/graphene oxide (GO) composites were successfully synthesized by hydrothermal treatment with a microwave-assisted method. Samples were characterized by X-ray... 相似文献
12.
Research funding has been seen as one of the most important resource in the reward system of science. And usage of publications denotes an interesting perspective of user behavior in scientific communication. This study aims to address the relationship between funding and Usage Count, which is a new metrics item established on the platform of Web of Science. Full records of 300,010 articles published in 2013 were downloaded in October 2015, and divided into six disciplines, including information science library science, education educational research, economics, computer science, materials science, and chemistry. Seven indicators were proposed to measure the impact, including Funding rate, Citation per paper, Usage rate, Usage per paper, Citation difference, Usage difference, and Conversion rate. It concluded funding has impact on usage and citation, and funded papers attract more usage, but varying in different disciplines. Usage Count can be used in the extension of citation metrics but with limits. This study originally engages with usage metrics and detected that there is positive correlation between usage and funding. 相似文献
13.
De-rui Tan 《中国铸造》2018,(5)
正Five Dynasties and Ten Kingdoms Period (963 A.D. and 967 A.D.)The western tower was damaged and is now incomplete. The eastern tower is 7.7 m high.There are two towers, called the eastern tower and the western tower, which were built in 963 A.D. and 967 A.D.,respectively, and are the earliest extant iron towers. There are 1,024 Buddha statues cast on each side of the tower body.The whole tower is made up of 17 castings, which are stacked layer by layer, and each casting is made to be a single 相似文献
14.
In this paper, we study scheduling games under mixed coordination mechanisms on hierarchical machines. The two scheduling policies involved are ‐ and ‐, where ‐ (resp., ‐) policy sequences jobs in nondecreasing order of their hierarchies, and jobs of the same hierarchy in nonincreasing (resp., nondecreasing) order of their processing times. We first show the existence of a Nash equilibrium. Then we present the price of anarchy and the price of stability for the games with social costs of minimizing the makespan and maximizing the minimum machine load. All the bounds given in this paper are tight. 相似文献
15.
Ye Wan Jun Tan Guangling Song Chuanwei Yan 《Metallurgical and Materials Transactions A》2006,37(7):2313-2316
The focused ion beam technique was employed to investigate the atmospheric corrosion morphology of AZ91D. It was found that
the α matrix of the alloy was preferentially corroded in the areas adjacent to intermetallic phases. The most interesting
finding was that the corrosion products in corrosion cavities were pelletlike, which has never been reported before. 相似文献
16.
P(DBF-VA)型柴油低温流动性改进剂的研制 总被引:1,自引:1,他引:0
针对新疆地产柴油蜡含量较高的特点,以游离基聚合法合成了富马酸双链混合酯和醋酸乙烯酯共聚物型[P(DBF-VA)]柴油低温流动改进剂,利用正交实验研究了单体配比,引发剂用量,溶剂用量,聚合温度对聚合物降冷滤效果的影响。共聚物用IR进行表征,利用XRD初步探讨了该降凝剂的降凝机理。结果表明:该剂能使吐哈—10~#、0~#柴油冷滤点降低10℃和7℃;使独山子0~#柴油冷滤点下降12℃;使石化0~#柴油冷滤点下降8℃;使克拉玛依0~#柴油的冷滤点下降8℃。 相似文献
17.
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19.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
20.
R. Murgan F. Razak D. R. Tilley T. Y. Tan J. Osman M. N. A. Halif 《Computational Materials Science》2004,30(3-4):468-473
We derive an expression for transmittivity (TSHG) of second harmonic generation (SHG) signals from a ferroelectric (FE) film. Intensities of up and down fields in the medium are investigated in relation to TSHG. The derivations are made based on undepletion of input fields and nonlinear wave equation derived from the Maxwell equations. We present two cases: film without mirrors and with partial mirrors. Expressions for the newly derived nonlinear susceptibility coefficients of SHG for real crystal symmetry [J. Opt. Soc. Am. B 19 (2002) 2007] are used to get more realistic results. Variations in TSHG with respect to film thickness are illustrated. 相似文献