古建筑木结构透榫节点力学模型研究

为研究古建筑木结构透榫节点的M-θ力学模型，在分析透榫节点构造特征与受力机理的基础上，建立其数值模型，用透榫节点的试验数据验证了该数值模型的正确性，并分析了节点缝隙、木材横纹弹性模量和大榫头长度对透榫节点受弯承载力的影响。根据受力分析结果，建立以弹性点、屈服点与极限点为特征点的三折线多参数M-θ力学模型，其结果与多数的试验结果基本吻合，并将该力学模型应用于木构架的受力分析。研究结果表明：透榫节点的滞回耗能能力强，节点的变形主要集中在榫头处。当榫头与卯口之间的缝隙增大时，节点的受弯承载力降低。随木材横纹弹性模量的提高和大榫头长度的增加，节点的受弯承载力有一定提高。文章建立的M-θ力学模型能较好反映透榫节点的受力过程，适用于木构架的受力分析，其荷载 位移骨架曲线与试验结果基本吻合。研究成果可为古建筑木结构的维修与保护提供参考。     

Headspace fingerprinting approach to identify the major pathway influencing volatile patterns of vinasse-cured duck processed by high pressure,as well as its impact on physicochemical and sensory attributes

As a decisive attribute, flavour could be influenced by HP treatments through multiple physical and chemical pathways within the high pressure (HP)-assisted meat curing process. This investigation aimed to identify the major pathway influencing volatile flavour patterns of two representative vinasse-cured duck (VCD) products with HP treatments (150–300 MPa/15 min), including wet and dry types, by employing headspace fingerprinting as an untargeted approach. Results suggested that HP treatments greatly lowered moisture contents and increased Warner-Bratzler shear force and thiobarbituric acid reactive substances of the cured samples. According to multivariate models, the volatile flavour patterns of the HP-processed VCD could be clearly separated from the unprocessed samples, but the VCD pressurised at different intensities represented similar volatile fingerprinting, which was validated by e-nose analysis. The discriminant analysis (OPLS-DA) model outlined vinasse-derived ethanol, acetic acid, 3-methyl-1-butanol, 2-methyl-1-butanol, phenethyl alcohol and 2-methyl-3-octanone as the major discriminant aromas across the unpressurised and pressurised samples.     

含煤盆地深层“超饱和”煤层气形成条件

中国深层煤层气资源丰富，但总体勘探和认识程度较低，尚未形成较为系统的深层煤层气地质理论。通过解剖分析准噶尔盆地白家海凸起和鄂尔多斯盆地临兴区块深层"超饱和"煤层气井的试气/生产动态，估算原地游离气的含气量，分析了深层"超饱和"煤层气的形成条件。研究表明：①深层"超饱和"煤层气储层中除吸附气外，还含有原地游离气，用常规试气方法可直接获得气流，煤层气的产出不明显依赖于排水降压；②埋藏超过一定深度，在煤阶和温度的综合作用下，煤的吸附能力将随埋深的继续增加而降低，煤层中吸附气的饱和度有增加的趋势，在达到吸附饱和后，出现原地游离气并形成"超饱和"煤层气，盆地深层具有"超饱和"煤层气形成的优势条件；③由于地温梯度和压力梯度的不同，不同盆地"超饱和"煤层气出现的临界深度不同，异常高压和异常高热流可以降低深层"超饱和"煤层气形成的临界深度；④深层"超饱和"煤层气开发具有大大缩短见气时间、充分利用地层能量和累积产水量低等优势，有望成为未来煤层气勘探开发的一个重要领域。     

Computational Fluid Dynamics Study on a Top-Blown Smelting Process with Lance Failure in an Isa Furnace

JOM - The Isa/Ausmelt smelting technology with a top submerged lance (TSL) has been extensively used in copper smelting processes. However, the TSL is extremely vulnerable to damage and failure...     

炼油达标污水回用处理试验研究

采用曝气生物滤池、多介质过滤、超滤、反渗透工艺,对炼油达标外排污水进行回用处理中试试验。结果表明,曝气生物滤池对油、COD和浊度去除效果良好,超滤、反渗透膜化学清洗周期达到 2个月以上,脱盐率稳定在98％以上,产水品质达到回用要求。     

管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

智能动态网络资源分配系统

通过对解决GSM移动通信网络热点区域话务拥塞问题的研究，提出了利用可控功分器实现智能动态网络资源的分配，解决不同种类的话务拥塞问题，并着重讨论了该系统目前的成功运用及前景。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported