轴承座锻造工艺与模具设计

本方介绍了一种薄形锻件的锻造工艺及模具设计,解决锻件产品合格率和材料利用率低等各种技术问题,降低生产制造成本。利用金属塑性成形仿真软件DEFORM-3D,对工艺进行仿真分析．仿真结果有效的验证了工艺方案。用基于模拟验证的工艺和设计的模具进行生产试制。轴承座锻件产品的尺寸及性能完全达到了设计要求。     

搅拌摩擦焊接全过程热力耦合有限元模型

利用ALE网格自适应技术及相应边界条件处理,建立搅拌摩擦焊接全过程(下压阶段和稳定焊接阶段)热力耦合有限元模型。采用6061铝合金焊件验证模型。结果表明:整个焊接过程温度场最高温度在463℃左右,低于材料熔点;稳定焊接6s后,焊件后方横截面上等效塑性应变区近似呈"V"形分布,前进边侧变形程度较返回边侧剧烈,变形范围更大。     

再生废AC去除印染废水中的CODcr

针对印染废水经二级处理后CODcr和色度不达标的难题,本文采用"以废治废"的方法,即采用制药厂的废弃AC,简单再生后深度处理经过二级生物处理的印染废水.研究结果表明,再生后的废AC进一步去除CODcr和色度的效果显著.     

Microstructures and properties of SnZn-xEr lead-free solders

The Sn9Zn eutectic alloy is the nontoxic lead-free solders alternative having a melting temperature which is closest to that of the eutectic SnPb alloy. In order to improve the properties of SnZn lead-free solders, 0-0.5 wt.% of rare earth Er was added to the base alloys, and the microstructures were studied. Results showed that the addition of rare earth Er could enhance the wettability of SnZn solders, with 0.08%Er addition, the spreading area gave an 19.1% increase. And based on the mechanical testing, it was found that the tensile force and shear force of SnZn-xEr solder joints could be improved significantly. Moreover, the oxidation resistance of SnZn0.08Er solder was better than that of SnZn solder. In addition, it was found that trace amounts of rare earth Er could refine the microstructures of SnZn solders, especially for Zn-rich phases, and excessive amount of rare earth Er led to a coarse microstructure.