Preparation of colloidal Sb2O55 and its stability

Colloidal antimony pentoxide was prepared by oxidation of antimony trioxide with hydrogen peroxide as oxidant and phosphoric acid as stabilizer. Effects of stabilizer, oxidant amount and reaction temperature on the diameter of colloidal particles and their size distribution were discussed, And static electricity effects on colloidal stability were studied by measurement of Zeta potential. Results show that Zeta potential of colloidal Sb2O5 moves from -30mV to -56. 8mV with the addition of H3PO4 as the stabilizer, zero point of charge of colloidal H3 PO4-Sb2O5 moves from pH=1.85 to more acidic regions, and colloidal H3PO4-Sb2O5 is stable in wider pH range. The stable time of colloidal H3PO4-Sb2O5 particles without coagulation is more than six months. The size of colloidal particles is smaller and their distribution is narrower by adding H3PO4 as the stabilizer and decreasing reaction temperature, and theaverage diameter of H3 PO4-Sb2O5 particles prepared is 30nm.     

电沉积工艺参数对铁-钴合金箔组成与结构的影响

研究了电流密度、温度和pH等工艺条件对钛板上电镀Fe-Co 合金箔组成、阴极电流效率、表面形貌和微观结构的影响,电解液配方为:FeSO<,4>·7H<,2>O 40 g/L,COSO<,4>·7H<,2>O 30 g/L,COCl<,2>·6H<,2>O 10 g/L,硼酸30 g/L,柠檬酸三钠40 g,L,抗坏血酸...     

Preparation of salt-based colloid palladium of high concentration

A kind of salt-based colloid palladium of high concentration was prepared, with concentration up to 3.6g/L on amount of PdCl2. The optimal preparation conditions of the salt-based colloid palladium were that the PdCl2 and NaCl concentrations were respectively 3.6 g/L and 175 g/L, mole ratio of Sn to Pd was 50:1, reaction temperature was 20 -35℃, with urea, ascorbic acid and vanillin added in a proper amount. The test results of optimal condition show that the time of starting hydrogen-deposition is 9 s, the time of completely coating copper on a test substrate is 2 min, the stability time of colloid palladium is 98 h after it is diluted into 0. 1 g/L(on amount of PdCl2)when the solution temperature is 20 *C, the backlight lever of electroless copper plating layer is 10th grade of 10 grade system, the adhesion force of the copper layer is up to GB5270--85 of China, and the average particle size of the colloid palladium is 81 nm measured by Master Sizer.     

从硫酸溶液中还原制取金属碲粉

采用SO2作还原剂从含碲的硫酸溶液中制取碲粉,并确定了SO2从硫酸溶液中还原碲的最佳条件:反应温度80℃,NaCl浓度1.2 mol/L,SO2流量0.1 m3/h,反应时间40 min,碲的还原率达到99.63%。还原所得粗碲粉经亚硫酸钠脱硒,盐酸酸洗除杂处理,硒、砷、锡、铜的脱出率分别达到99%、93%、80%、87.5%,得到含碲99.669%的金属碲粉。XRD和SEM表征表明还原碲粉的形态为针状晶体。     

脉冲电沉积纳米晶镍—铁—铬合金（I）——电沉积工艺

在恒电位脉冲的条件下,pH控制在0.8～1,阴极电流密度为12～20A·dm-2,周期为25ms,占空比为0.3,镀液温度维持在20～30℃,采用循环镀液的方法以避免二价铬离子的干扰,从含三价铬离子的镀液中电沉积出镍 铁 铬合金。X射线衍射结果表明沉积的镀层为晶体结构,存在较强的(111)织构。能谱和扫描电镜的结果显示电沉积出的镍 铁 铬合金镀层中含有少量的硫,其晶粒尺寸小于100nm。通过这种方法可以获得厚镀层。电化学分析表明随着电流密度的增大,镀层的耐蚀性相应增强。     

高着色力氧化铁黑颜料的制备

采用氧化沉淀法制备铁黑颜料。研究了柠檬酸、十二烷基硫酸钠、硝酸铵和聚乙二醇4种添加剂对铁黑颜料的着色力、颜色和粒径的影响。结果表明：柠檬酸作添加剂，可以制得粒径小、粒径分布窄、着色力好的氧化铁黑颜料，聚乙二醇的效果其次，硝酸铵的效果最差；颜料粒径是影响其着色力的主要因素，粒径越小，着色力越高。     

不同载体表面负载TiO2薄膜的离子掺杂研究

TiO₂薄膜是解决TiO₂回收的有效方法，缺点是TiO₂活性低，寻找合适的载体以及提高TiO₂薄膜的光催化活性,是TiO₂负载薄膜技术需要解决的核心问题。研究了13种离子对负载在釉面瓷砖、玻璃、陶瓷、钛片、铝片和不锈钢片6种载体上TiO₂薄膜的掺杂，并从界面材料结构、双电层结构等方面讨论了离子掺杂与载体对TiO₂薄膜光催化活性的影响。结果表明，TiO₂薄膜的离子掺杂效果不仅和离子掺杂浓度、种类有关，而且还与载体类型有关。TiO₂薄膜和非金属载体主要形成复合半导体结构，改善掺杂离子对载流子的捕获能力。金属载体与TiO₂薄膜之间主要形成肖特基势垒，有利于电子与空穴的分离。载体与TiO₂薄膜之间形成的界面双电层结构能改变离子捕获中心与TiO₂半导体费米能级间的相对位置，从而提高或降低离子对载流子的捕获能力。     

电沉积Fe-Ni合金箔的工艺和性能研究

用电沉积的方法,在N iSO4及FeSO4电解质体系中成功制得了铁的质量分数为23.2%~63%,厚度为23~43μm的Fe-N i纳米晶合金箔。镀层光亮平滑,内应力小,有优良的韧性和耐腐蚀性。镀层中铁含量及电流效率随着电流密度、pH、温度的变化而变化。电流密度、溶液温度和pH影响合金箔的沉积速度和硬度;合金箔中的Fe含量影响合金箔的耐腐蚀性。应用X-射线衍射来测量晶格常数和晶粒粒径的大小,用扫描电镜观测镀层的表面形貌。硬度为16.8~19.5HR 30T,抗拉强度和延伸率分别为779.66 M Pa和1%,电阻率为29.56~62.99(μΩ.cm)。     

石英晶体微天平对硫辛酸自组装成膜动力学的研究

用石英晶体微天平 (QCM)在线监测了硫辛酸 (TA)在金电极上自组装成膜动力学过程。探讨了温度、浓度对成膜过程的影响及 TA膜在不同 p H值下的稳定性 ,给出了有关自组装成膜动力学信息。结果表明 :成膜动力学过程符合 Langmuir吸附速率方程 ,TA膜在 p H值为 5 .4～ 7.6间比较稳定。     

电镀Fe-Ni-Cr合金的现状和发展

概述电镀Fe-Ni-Cr合金的发展进程,从电沉积Fe-Ni-Cr合金的基本条件、镀液体系、电镀的类型以及镀层晶体结构类型等几个方面对电镀Fe-Ni-Cr合金的特点进行阐述.综述了影响电沉积Fe-Ni-Ce合金镀层质量的因素,并指出电镀Fe-Ni-Cr合金目前存在的问题和今后的发展方向.