偶联剂对地砖用PVC填充材料相态结构和力学性能的影响

研究了钛酸酯类偶联剂和硅烷类偶联剂对钙矿、硅酸盐填充的PVC填允材料力学性能、相态结构、密度、热失重率及吸水伸长率和耐热阻燃性能的影响。结果表明,偶联剂可改善填充PVC的抗冲性能,降低其拉伸强度,扫描电镜分析表明,填料越细,分散越均匀,越易被PVC树脂所包覆,力学性能越好,研究得到了比重大、热失重率低、吸水伸长率小、阻燃耐烧灼性好的高填充PVC硬质塑料地板砖。     

纤维素衍生物液晶相转变和织态结构

本文综述了纤维素衍生物液晶态相转变和织态结构。描述了纤维素衍生物从各向同性态向液晶态的转变过程和液晶态的织构特征。讨论了溶液浓度和温度对液晶相织构的影响。探讨了各种因素,如溶剂、取代基含量、外加力场和外加磁场等对液晶相的形成及织态结构的影响。     

聚丙烯结构壁管专用料的开发

阐述了塑料结构壁管的基本情况和国内外现状．重点就扬子石油化工股份有限公司研究院研制的聚丙烯结构壁管专用料的情况进行了介绍。     

纤维素科学与技术研究进展

本文综述纤维素科学与技术的研究进展。阐述了纤维素结构、纤维素的合成、纤维素液晶、功能纤维素、纤维素溶剂、纤维素裂解和纤维素的废物利用等的最新动态。     

运动发酵单胞原生质球的形成和再生

运动发酵单胞(Zymomonas mobilis)ATCC29191菌株在含1～3g/L甘氨酸的液体培育12小时的菌体,用含20g/L的溶菌酶溶液处理12小时,可以稳定得到80％～90％的原生质球。原生质球稀释后在底层再生培养基上涂布,上面复盖一层半固体培养基,30℃培养5～7小时,再生率可达10~(-2)水平。     

乙烯分离技术分析

从技术先进性、能耗、流程复杂性和运行稳定性等诸多方面对占据乙烯市场的三大分离技术进行了分析。并认为用户在选择分离技术时应综合考虑各方面因素，把握重点，选择出适合的技术。     

纤维素酶的固体发酵

从来自国内外11株菌株的初步比较,筛选出酶活较高的康氏木霉N_2—78和瑞热埃木霉QM6a。对康氏木霉P_2和土曲霉3.3935所作的纤维素碳源试验中,发现木质纤维素较纯纤维素好,未经处理的木质纤维素比经处理的好。麸皮和稀土对康氏木霉P_2产酶作用影响较大,而对土曲霉3.3935则无明显的影响。     

Possible Energy Network with polygeneration system and CCS for China

On basis of adopting polygeneration systems for power and alternative fuels,capturing CO2 with near zero energy penalties,and storing CO2 on sites,a new kind of Energy Network can integrate energy utilization,CO2 capture,transportation and storage synthetically.Techno-economic analysis of this solution focusing on Inner Mongolia and the Yangtze River Delta districts had been carried with comparison to the chain method for energy utilization and CO2 sequestration.This solution can save 21.5% of energy,and re...     

Analysis of junction temperatures in high-power GaN-based LEDs

We presented the analysis of the incomplete conduction in bonding medium in high power GaN-based light-emitting diode (LED) packages. A numerical study was carried out with parametric model to understand the junction temperature variation due to bonding medium defects. Transient thermal measurement was performed to evaluate LED’s junction temperature. Thermal resistance from chip to lead frame was 20 K/W in our sample LED. It was suggested that only 60% of the surface area of the bonding medium was involved...