Low temperature wafer direct bonding

A pronounced increase of interface energy of room temperature bonded hydrophilic Si/Si, Si/SiO₂, and SiO₂/SiO ₂ wafers after storage in air at room temperature, 150°C for 10-400 h has been observed. The increased number of OH groups due to a reaction between water and the strained oxide and/or silicon at the interface at temperatures below 110°C and the formation of stronger siloxane bonds above 110°C appear to be the main mechanisms responsible for the increase in the interface energy. After prolonged storage, interface bubbles are detectable by an infrared camera at the Si/Si bonding seam. Desorbed hydrocarbons as well as hydrogen generated by a reaction of water with silicon appear to be the major contents in the bubbles. Design guidelines for low temperature wafer direct bonding technology are proposed     

The design, fabrication, and testing of corrugated silicon nitridediaphragms

Silicon nitride corrugated diaphragms of 2 mm×2 mm×1 μm have been fabricated with 8 circular corrugations, having depths of 4, 10, or 14 μm. The diaphragms with 4-μm-deep corrugations show a measured mechanical sensitivity (increase in the deflection over the increase in the applied pressure) which is 25 times larger than the mechanical sensitivity of flat diaphragms of equal size and thickness. Since this gain in sensitivity is due to reduction of the initial stress, the sensitivity can only increase in the case of diaphragms with initial stress. A simple analytical model has been proposed that takes the influence of initial tensile stress into account. The model predicts that the presence of corrugations increases the sensitivity of the diaphragms, because the initial diaphragm stress is reduced. The model also predicts that for corrugations with a larger depth the sensitivity decreases, because the bending stiffness of the corrugations then becomes dominant. These predictions have been confirmed by experiments. The application of corrugated diaphragms offers the possibility to control the sensitivity of thin diaphragms by geometrical parameters, thus eliminating the effect of variations in the initial stress, due to variations in the diaphragm deposition process and/or the influence of temperature changes and packaging stress     

Capacitive microphone with a surface micromachined backplate usingelectroplating technology

A technology for surface micromachining of free-standing metal microstructures using metal electrodeposition on a sacrificial photoresist layer has been applied to a condenser microphone. Electroplating technology has been used to implement a suspended and perforated 15-μm-thick microstructure in copper, which serves as backplate electrode in the condenser microphone. The 1.8×1.8 mm ² large microphone diaphragm is in monocrystalline silicon and is fabricated with anisotropic etching of the substrate wafer. The realized prototypes have a measured sensitivity of 1.4 mV/Pa using a bias voltage of 28 V. The bandwidth is limited by an anti-resonance at 14 kHz which is due to the semi-rigid backplate. The resonance behavior of the backplate structure has been analyzed with finite element modeling with results in good agreement with measured data     

NETWORKING WITH A HUMAN FACE Mentoring as a Career Strategy

Mentoring has been around for ages, often masquerading as the management club or the fast track. Among successful business unit managers, mentoring is a well-understood practice, and it's a career development strategy today's IS professional would be wise to consider.     

GUIDELINES FOR DESIGNING EIS INTERFACES Meeting Executives' Information Needs

For users of an executive information system (EIS), the EIS interface is the system and is crucial to the EIS's success. These guidelines for designing EIS interfaces are based on studies of actual EIS interfaces that meet the unique information needs of executives.     

ENHANCING THE CREATIVITY OF REENGINEERING Techniques for Making IS More Creative

Industries in the US continue to lose ground in international competition. If IS is to help change that trend, it will have to become more creative. Creativity improvement programs are being introduced in other areas of the company— now is the time for IS organizations to follow suit.     

MEETING THE IT CHALLENGES OF BUSINESS The Changing Mandate for MBAs

What is the implication for business when information technology (IT) changes in the workplace without a commensurate change in the composition of business programs educating tomorrow's employees? A survey of MBA graduates forms the basis of this article on the IT skills needed in the marketplace.     

REENGINEERING DONE RIGHT Intermediate Solutions That Are Cost-Effective

Effective systems development techniques attract a lot of attention, but little has been done to effectively address systems maintenance. This article describes an effective, proven approach to resurrecting existing systems and Increasing their useful life, using a system that employs both software tools and a rigorous methodology.     

UTEC and Ferut: the University of Toronto's computation centre

Although not well known, the University of Toronto had a very early computer-development program and in 1952 was one of the first few institutions with an operable computer in North America. This article describes the university's initial attempt to build the UTEC computer and how it acquired the pioneering Ferut machine