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In this study, in vitro digestion and fermentation of Flammulina velutipes -derived polysaccharides (FVP) were investigated. It was found that FVP mainly consisted of 48.45% glucose, 15.40% mannose, 14.60% xylose, 11.80% fucose and 9.90% galactose. The -human saliva, simulated gastric and small intestinal juices conditions did not break down the FVP. Based on in vitro fermentation tests, FVP modulated the composition of gut microbiota by elevating the amounts of Bifidobacteriaceae and Bacteroidaceae and reducing the numbers of genera Lachnospiraceae and Enterococcaceae. Meanwhile, FVP affected the synthesis of short-chain fatty acids derived from gut microbiota.  相似文献   
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The principles and design of “active” self‐propelling particles that can convert energy, move directionally on their own, and perform a certain function is an emerging multidisciplinary research field, with high potential for future technologies. A simple and effective technique is presented for on‐demand steering of self‐propelling microdiodes that move electroosmotically on water surface, while supplied with energy by an external alternating (AC) field. It is demonstrated how one can control remotely the direction of diode locomotion by electronically modifying the applied AC signal. The swimming diodes change their direction of motion when a wave asymmetry (equivalent to a DC offset) is introduced into the signal. The data analysis shows that the ability to control and reverse the direction of motion is a result of the electrostatic torque between the asymmetrically polarized diodes and the ionic charges redistributed in the vessel. This novel principle of electrical signal‐coded steering of active functional devices, such as diodes and microcircuits, can find applications in motile sensors, MEMs, and microrobotics.  相似文献   
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Tian  J. Y.  Xu  G.  Hu  H. J.  Zhou  M. X. 《Strength of Materials》2019,51(3):439-449
Strength of Materials - A metallographic method, dilatometry, and X-ray diffraction were applied to investigate the effects of undercooling and holding time on bainitic transformation,...  相似文献   
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Mobile Networks and Applications - Public cloud system offers Infrastructure-as-a-Service (IaaS) to deliver the computational resources on demand. Resource requirements of a cloud environment are...  相似文献   
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Thermosetting materials are widely used as encapsulation in the electrical packaging to protect the core electronic components from external force, moisture, dust, and other factors. However, the spreading and curing behaviors of such kind of fluid on a heated surface have been rarely explored. In this study, we experimentally and numerically investigated the spreading and curing behaviors of the silicone(OE6550 A/B, which is widely used in the light-emitting diode packaging) droplet with diameter of ~2.2 mm on a heated surface with temperature ranging from 25 ℃ to 250 ℃. For the experiments, we established a setup with high-speed camera and heating unit to capture the fast spreading process of the silicone droplet on the heated surface. For the numerical simulation, we built a viscosity model of the silicone by using the Kiuna's model and combined the viscosity model with the Volume of Fluid(VOF) model by the User Defined Function(UDF) method. The results show that the surface temperature significantly affected the spreading behaviors of the silicone droplet since it determines the temperature and viscosity distribution inside the droplet. For surface temperature varied from 25 ℃ to 250 ℃, the final contact radius changed from ~2.95 mm to ~1.78 mm and the total spreading time changed from ~511 s to ~0.15 s. By further analyzing the viscosity evolution of the droplet, we found that the decreasing of the total spreading time was caused by the decrease of the viscosity under high surface temperature at initial spreading stage, while the reduction of the final contact radius was caused by the curing of the precursor film. This study supplies a strategy to tuning the spreading and curing behavior of silicone by imposing high surface temperature, which is of great importance to the electronic packaging.  相似文献   
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