A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate

In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology.     

RSView32软件平台的应用及扩展

概述了RSView32工控软件的特点和使用方法 ,并通过贵溪冶炼厂的一个液位自动控制系统的人机界面设计说明了如何在控制系统中使用RSView32软件。文章特别介绍了如何用VBA程序设计来扩展其功能     

A Distributed State Estimator Utilizing Synchronized Phasor Measurements

With the creation of balancing authorities by the North American Reliability Council that span large portions of the North American interconnection, and stringent requirements for real time monitoring of power system evolution, faster and more accurate state estimation algorithms that can efficiently handle systems of very large sizes are needed in the present environment. This paper presents a distributed state estimation algorithm suitable for large-scale power systems. Synchronized phasor measurements are applied to aggregate the voltage phase angles of each decomposed subsystem in the distributed state estimation solution. The aggregated state estimation solution is obtained from the distributed solution using a sensitivity analysis based update at chosen boundary buses. Placement of synchronized phasor measurements in the decomposed subsystems is also investigated in this paper. Test results on the IEEE 118-bus test bed are provided     

In-Situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy

in-situ transmission electron microscopy (TEM) tensile tests on as-cast and aged 63Sn37Pb solder alloys were conducted, and the fracture behavior in nanometer scale ahead of the crack tip was inspected and discussed. Results show that the fracture was completed by connecting the discontinuous cracks or voids. Dislocation behavior was concentrated along the grain boundaries for as-cast samples, and displayed mainly as dislocation climb. The crack was intergranular dominated under the lower strain rate. While remarkable mutual dislocation emission was detected in the aged solder. Transgranular cracks were dominant in the fractured area, and they propagated by linking up with the nanometer scale cracks ahead of the crack tips under the effective promotion of the inverse dislocation emission. At the same time, the partial interphase or intergranular cracks in the thinned area were also found. Under this condition, a new critical stress intensity factor K _c ^′ to define the mutual dislocation emission was proposed.