Electrospun PEDOT:PSS/PVP nanofibers as the chemiresistor in chemical vapour sensing

Herein, PEDOT:PSS/PVP nanofibers were produced by electrospinning. The presence of PEDOT:PSS in the nanofibers was confirmed by FT-Raman spectroscopy. The applied voltage-dependent diameter of PEDOT:PSS/PVP nanofibers was observed. Also, sensing behaviors of electrospun PEDOT:PSS/PVP nanofibers were explored by measuring its response upon cyclic exposure to organic vapours such as ethanol, methanol, THF, and acetone at room temperature. When PEDOT:PSS/PVP nanofibers were exposed to each solvent, the protic and aprotic solvents resulted in opposite electrical responses. These findings exhibit that electrospun PEDOT:PSS/PVP nanofibers are the promising candidate for the organic vapour sensing material.     

High speed SOI CMOS image sensor with pinned photodiode on handle wafer

We have fabricated SOI CMOS active pixel image sensor with pinned photodiode on handle wafer. The structure of one pixel is a four-transistor type active pixel image sensor, which consists of a reset and a source follower transistor on seed wafer, and is comprised of a photodiode, a transfer gate, and a floating diffusion on handle wafer. The photodiode could be optimized for better quantum efficiency and low dark currents because the process of a photodiode on handle wafer is independent of that of transistors on seed wafer. Most of the wavelengths are absorbed within the visible range, because the optimized photodiode is located on the handle wafer. The response time of SOI CMOS active pixel sensor was about 2 times faster than that of bulk CMOS active pixel image sensor.     

Fabrication and performance of parallel-addressed InGaN micro-LED arrays

High-performance, two-dimensional arrays of parallel-addressed InGaN blue micro-light-emitting diodes (LEDs) with individual element diameters of 8, 12, and 20 /spl mu/m, respectively, and overall dimensions 490 /spl times/490 /spl mu/m, have been fabricated. In order to overcome the difficulty of interconnecting multiple device elements with sufficient step-height coverage for contact metallization, a novel scheme involving the etching of sloped-sidewalls has been developed. The devices have current-voltage (I-V) characteristics approaching those of broad-area reference LEDs fabricated from the same wafer, and give comparable (3-mW) light output in the forward direction to the reference LEDs, despite much lower active area. The external efficiencies of the micro-LED arrays improve as the dimensions of the individual elements are scaled down. This is attributed to scattering at the etched sidewalls of in-plane propagating photons into the forward direction.     

Over GHz electrical circuit model of a high-density multiple line grid array (MLGA) interposer

The multiple line grid array (MLGA) interposer was recently introduced as a future high-density high-speed bonding method. In this paper, we introduce an electrical model and high-frequency characteristics of the MLGA interposer. The high-frequency electrical model was extracted from microwave S-parameter measurements up to 20 GHz as well as from fundamental microwave network analysis. For the parameter fitting process during model extraction, an optimization method was used. Several different types of MLGA interposers were designed, assembled and tested. The test vehicles contained coplanar waveguides, probing pads and an MLGA interposer structure. The height of the MLGA, the conductor shape inside the MLGA, and the dielectric insulator of the MLGA were varied. From the model, an MLGA with a height of 0.4 mm and a polymer dielectric insulator was found to have 203 pH of self inductance, 49 pH of mutual inductance with the nearest ground conductor line, and 186 fF of mutual capacitance. By reducing the height of the MLGA and by using an insulator with a lower dielectric constant, parasitic inductance and capacitance is further reduced. TDR/TDT simulation and measurement showed the validity of the extracted model parameters of the MLGA interposer. Circuit simulation based on the extracted model revealed that the MLGA interposer could be successfully used for microwave device packages up to 20 GHz and for high-speed digital device packages with a clock cycle up to 5 GHz.     

Adaptive contour smoothing based on inter-region contrast

An adaptive contour smoothing algorithm designed as a preprocessor for shape coders is presented. In the method, the degree of the adaptive smoothing is controlled based on the significance of each contour point, which is quantified according to inter-region contrast in an intensity image. The actual smoothing consists of an expansion operator and a thinning algorithm.     

Spectrally stable Er-fiber laser for application in phase-sensitive optical time-domain reflectometry

A high degree of frequency stability in an Er-fiber laser with the Fabry-Perot configuration was achieved using a long (25-km) optical-feedback loop. The frequency-drift rate was determined to be <1 MHz/min by observing temporal fringes in an unbalanced Mach-Zehnder interferometer. Instantaneous linewidth measured with a delayed self-heterodyne interferometer was less than the 3-kHz resolution limit. The laser was utilized in an optical time-domain reflectometry experiment to detect and locate a time-varying phase perturbation applied to an optical fiber.     

Adaptive viewpoints for co-browsing on heterogeneous devices

Co-browsing is an activity in which a group of users navigate their way through of a set of Web pages together for a shared purpose. Effective co-browsing among users with different device capabilities requires a shared understanding of those Web pages. This paper demonstrates the concept of shared viewpoints (SVPs), and personal viewpoints (PVPs), for co-browsing, before detailing a framework for implementing these concepts. Finally, the effectiveness of the framework is presented through a perceptual experiment.     

Inside Front Cover: The Elastic Properties and Plastic Behavior of Two‐Dimensional Polymer Structures Fabricated by Laser Interference Lithography (Adv. Funct. Mater. 10/2006)

The probing of the micromechanical properties within a two‐dimensional polymer structure with sixfold symmetry fabricated via interference lithography reveals a nonuniform spatial distribution in the elastic modulus “imprinted” with an interference pattern in work reported by Tsukruk, Thomas, and co‐workers on p. 1324. The image prepared by M. Lemieux and T. Gorishnyy shows how the interference pattern is formed by three laser beams and is transferred to the solid polymer structure. The elastic and plastic properties within a two‐dimensional polymer (SU8) structure with sixfold symmetry fabricated via interference lithography are presented. There is a nonuniform spatial distribution in the elastic modulus, with a higher elastic modulus obtained for nodes (brightest regions in the laser interference pattern) and a lower elastic modulus for beams (darkest regions in the laser interference pattern) of the photopatterned films. We suggest that such a nonuniformity and unusual plastic behavior are related to the variable material properties “imprinted” by the interference pattern.     

A Novel Lattice Reduction Precoding Method

In this work, a novel lattice reduction (LR) precoding method is proposed. The technique combines conventional LR precoding with a method of reducing the singular value coefficients of the LR-reduced basis matrix. The performance of the new technique was comparable to that of sphere encoding, while its complexity was lower than that of other sub-optimal methods.