炼油厂全流程优化建模方法研究

为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点，在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上，将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量，约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究，结果表明该全流程模型能有效处理全厂优化问题，所得利润在线性规划的基础上提高4．5％。     

H型丝光沸石催化剂催化甲苯与叔丁醇的烷基化反应

针对合成对叔丁基甲苯传统工艺中存在的缺点,采用环境友好、可重复利用的H型丝光沸石催化剂(以下简称催化剂)进行了甲苯与叔丁醇的烷基化反应,并用X射线衍射和氨程序升温脱附等方法对不同焙烧温度下得到的催化剂的物相结构和酸性质进行了表征,研究了各种反应条件对催化剂的催化性能的影响。实验结果发现,在适宜的操作条件下,即催化剂的焙烧温度823K、反应温度180℃、反应时间3h、初始压力1.0MPa、原料与催化剂的质量比为8、叔丁醇与甲苯的摩尔比为4、溶剂环己烷与甲苯的摩尔比为5时,甲苯转化率达42.73%,叔丁基甲苯的选择性为96.30%,对叔丁基甲苯的选择性为80.37%。     

Laterally coupled buried heterostructure high-Q ring resonators

All-buried InP-InGaAsP ring resonators laterally coupled to bus waveguides are demonstrated. The buried configurations offer a lower built-in refractive index step along the resonator periphery, which affords enhanced optical coupling coefficients between the waveguides and reduced scattering losses caused by the resonator sidewall imperfections. Very low optical intensity attenuations of 0.4 cm/sup -1/ and coupling-limited quality factors of greater than 10/sup 5/ are observed from 200-/spl mu/m-radii ring resonators. The measured spectral linewidth is as narrow as 0.0145 nm.     

Spectral shape tunable band-rejection filter using a long-period fiber grating with divided coil heaters

We have developed a new type of tunable band rejection filter, which provides high spectral-shaping flexibility in a wide tuning range. The filter consists of a long-period fiber grating (LPFG) with divided coil heaters. Each of the divided coil heaters is controlled individually to adjust a temperature distribution along the LPFG and to modify the spectral shape of the LPFG filter. The tunable band rejection filter is demonstrated to function properly when applied as an erbium-doped fiber amplifier gain-flattening filter.     

设计管理信息系统的提出及其面临的问题

从管理和设计的两个方面出发，通过对现代企业产品设计管理信息系统的探讨，阐明了设计管理信息系统的概念和结构；并对其实施的条件及面临的困难进行了系统的分析。     

Studies on high density polyethylene (HDPE) functionalized by ultraviolet irradiation and its application

The structure and properties of high density polyethylene (HDPE) functionalized by ultraviolet irradiation at different light intensities in air were studied by electron analysis, FTIR spectroscopy, contact angle with water, differential scanning calorimetry and mechanical properties measurement. The results show that oxygen‐containing groups such as C?O, C—O and C(?O)O were introduced onto the molecular chain of HDPE following irradiation, and the rate and efficiency of HDPE functionalization increased with enhancement of irradiation intensity. After irradiation, the melting temperature, contact angle with water and notched impact strength of HDPE decreased, the degree of crystallinity increased, and their variation amplitude increased with irradiation intensity. Compared with HDPE, the yield strength of HDPE irradiated at lower light intensity (32 W m^?2 and 45 W m^?2) increases monotonically with irradiation time, and the yield strength of HDPE irradiated at higher light intensity (78 W m^?2) increases up to 48 h and then decreased with further increase in irradiation time. The irradiated HDPE behaved as a compatibilizer in HDPE/polycarbonate (PC) blends, and the interface bonding between HDPE and PC was ameliorated. After adding 20 wt% HDPE irradiated at 78 W m^?2 irradiation intensity for 24 h to HDPE/PC blends, the tensile yield strength and notched Izod impact strength of the blend were increased from 26.3 MPa and 51 J m^?1 to 30.2 MPa and 158 J m^?1, respectively. Copyright © 2003 Society of Chemical Industry     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

FCC汽油叠合生产柴油的研究——(Ⅰ)叠合催化剂的研制

采用中孔γ-Al2O3为载体，以非贵金属Ni为活性金属组分，以金属Sn为助剂组分，制备了FCC汽油叠合生产柴油的催化剂。在实验室小型连续流动式固定床装置上，以FCC汽油为原料，考察了主活性金属负载量、助催化剂、催化剂制备条件对催化剂性能的影响。研究结果表明，在活性金属Ni质量分数为8％，助催化剂Sn质量分数为1％，浸渍时间6h，焙烧温度500℃，焙烧时间4h的条件下，制备的叠合催化剂的催化性能最好。并对催化剂进行了1500h的稳定性试验和再生性能考察，结果表明该叠合催化剂具有良好的稳定性和再生性能。     

农村通信如何"突围"

农村通信作为农村地区信息化的基础，对于全面建设小康具有特殊的重要地位。介绍了我国农村通信的发展现状，分析了农村通信发展的困难压其原因，最后对农村压边远、欠发达地区通信的均衡震展提出了一些建议。