3-D boundary element method for cracks in a plate

New fundamental solutions which automatically satisfy boundary conditions at the interfaces of an elastic plate perfectly bonded to two elastic halfspaces are implemented in a 3-D boundary element method (BEM) for crack problems. The BEM features a new integration scheme for highly singular kernels. The capability is achieved through a part analytic and part numerical integration procedure, such that the analytic part of the integration is similar for all slip/opening variations, ‘Part-through’ elliptic cracks in an elastic plate with traction-free surfaces are analysed and the stress intensity factor (SIF) values along the crack front are found to compare favourably with widely accepted numerically obtained SIF results by Raju and Newman.¹     

A network management architecture for robust packet routing in meshoptical access networks

We describe an architecture for an optical local area network (LAN) or metropolitan area network (MAN) access. The architecture allows for bandwidth sharing within a wavelength and is robust to both link and node failures. The architecture can be utilized with an arbitrary, link-redundant mesh network (node-redundancy is necessary only to handle all node failures), and assumes neither the use of a star topology nor the ability to embed such a topology within the physical mesh. Reservation of, bandwidth is performed in a centralized fashion at a (replicated) head end node, simplifying the implementation of complex sharing policies relative to implementation on a distributed set of routers. Unlike a router, however, the head end does not take any action on individual packets and, in particular, does not buffer packets. The architecture thus avoids the difficulties of processing packets in the optical domain while allowing for packetized shared access of wavelengths. We describe the route construction scheme and prove its ability to recover from single link and single node failures, outline a flexible medium access protocol and discuss the implications for implementing specific policies, and propose a simple implementation of the recovery protocol in terms of state machines for per-link devices     

用硫酸铁铵容量法测定钛精矿中二氧化钛含量

样品在过氧化钠熔融、水浸取及盐酸酸化后，在盐酸和硫酸介质中，隔绝空气，用金属铝将钛(Ⅳ)还原至钛(Ⅲ)，以硫氰酸盐为指示剂，用硫酸铁铵标准溶液滴定。     

首钢外购焦炭质量恶化后的高炉生产实践

针对焦炭质量劣化的状况，高炉操作以活跃炉缸为主，从上下部调剂入手，采取疏导煤气、控制合理的实际风速和鼓风动能、缓解焦炭在高温区的粉化等措施，有效地改善了高炉的顺行状况，并逐步恢复高炉指标。     

尿素解吸废液及甲醇残液联合处理工艺的应用

安阳化学工业集团公司(以下简称安化集团)现有2套200 kt/a尿素装置及1套60 kt/a甲醇装置.尿素及甲醇装置在生产过程中会产生大量的尿素解吸废液和甲醇残液,废液中的氨氮(NH3-N)含量和化学需氧量(CODCr)较高,给该公司废水的达标排放带来很大压力.     

卫生陶瓷贴牌（OEM）加工问题的探讨

前言 近20年来,随着改革开放和国民经济的飞速发展,我国建筑卫生陶瓷行业也得到快速发展,产量连年增长,成为世界上建筑卫生陶瓷的最大生产国和消费国,也是出口大国.2007年全国卫生陶瓷的产量达到15 000万件,占世界产量的40%,出口量达到5 525万件,占产量的40%.     

椭圆型偏微分方程的加法Schwarz方法

1.引 言 古典加法Schwarz方法(ASM)对于一般问题收敛很慢,在大多数情况下, ASM只能作为预条件子.另一方面,ASM的并行性能非常好,尤其适合大规模粗粒度并行计算,近年来随着并行机系统及并行计算的兴起,ASM重新受到重视.许多学者研究了怎样提高ASM的收敛速度[1,2,4].他们发现加法Schwarz方法之所以收敛慢是由于在内边界上采用     

Cooling and Solidification of Melted Drops in an Immiscible Cooling Medium

The cooling and solidification of melted drops during their movement in an immiscible cooling medium is widely employed for granulation in the chemical industry, and a study of these processes to provides a basis for the design of the granulation tower height and the temperature of the cooling medium is reported. A physical model of the cooling and solidification of the drop is established and the numerical calculation is performed. The influences of the key factors in the solidification, i.e., Bi number, drop diameter, temperature of the cooling medium, etc. are presented. The cooling and solidification during wax granulation in a water‐cooling tower and during urea granulation in an air‐cooling tower (spraying tower) are described in detail. Characteristics of the solidification and temperature distribution within the particle at different times are shown. The model and calculations can be used for structure design of the granulation tower and optimization of the operation parameters.     

Structure and properties of CE/CTBN/EP blends: II. Effect of EP on the mechanical properties and thermostability of the CE/CTBN system

Carboxyl‐terminated butadiene‐acrylonitrile rubber (CTBN) has often been used to improve the toughness of cyanate ester (CE) resin while sacrificing modulus and thermostability. In this paper, the addition of the appropriate amount of epoxy resin (EP) to the CE/CTBN system is shown to not only increase the modulus and thermostability of the blend, but also improve the toughness. The values of impact strength showed a maximum for the CE/CTBN/EP 100/5/5 blend. The temperature of 10 % weight loss (T₁₀) improves from 376 °C for CE/CTBN 100/5 to 407 °C for the CE/CTBN/EP 100/5/2.5 blend. It is proposed that addition of the appropriate amount of EP can decrease the mobility and increase the stability of CTBN via the reaction between the terminal carboxyl group of CTBN and the hydroxyl group of EP. But a very high EP concentration will decrease the crosslinking density of CE, consequently reducing the mechanical properties and thermostability of the blends. Copyright © 2004 Society of Chemical Industry     

Facile modifications of polyimide via chloromethylation: II. Synthesis and characterization of thermocurable transparent polyimide having methylene acrylate side groups

From chloromethylated polyimide, a useful starting material for modification of aromatic polyimides, a thermocurable transparent polyimide having acrylate side groups was prepared. In the presence of 1,8‐diazabicyclo[5,4,0]undec‐7‐ene, chloromethylated polyimide was esterified with acrylic acid to synthesize poly(imide methylene acrylate). The polymer was soluble in organic solvent, which makes it possible to prepare a planar film by spin coating. The polymer film became insoluble after thermal treatment at 230 °C for 30 min. Optical transparency of the film at 400 nm (for 1 µm thickness) was higher than 98 % and not affected by further heating at 230 °C for 250 min. Adhesion properties measured by the ASTM D3359‐B method ranged from 4B to 5B. Preliminary results of planarization testing showed a high degree of planarization (DOP) value (>0.53). These properties demonstrate that poly(imide methylene acrylate) could be utilized as a thermocurable transparent material in fabricating display devices such as TFT‐LCD. Copyright © 2004 Society of Chemical Industry