Polyetherimide substrates for future high density optical data storage

Polyetherimide (PEI) substrate for next‐generation high density optical data storage is fabricated and characterized. Cover‐layer incident or first‐surface recording configurations do not require optical properties of the substrate, which are the prerequisite conditions for the conventional material of polycarbonate (PC). Instead of the optical properties, good mechanical properties with a sufficient transcribability are required. Even though PEI has higher glass transition temperature than that of PC, a microscopic transcribability of PEI is comparable with PC by laminating a thermal insulation layer on the backside of a stamper to retard the heat flow. A macroscopic warpage of PEI substrate is smaller than that of PC substrates, which reduces tilt and servo burden. The lowest critical speed coupled with the flutter of PEI substrate is larger than that of PC substrate because of the mechanical properties of PEI. POLYM. ENG. SCI., 48:97–101, 2008. © 2007 Society of Plastics Engineers     

新型水泥浆实心减轻材料FXW在固井中的应用研究

低密度水泥浆常用泡沫和漂珠作为减轻材料，但泡沫和漂珠的一个共同缺陷是承压能力有限。在现场使用时，地面密度和井下密度是不一致的，这将打破注水泥压力平衡，给固井施工带来一定的风险。为此，通过大量实验，根据颗粒紧密堆积原则，以粉煤灰、改性橡胶粉、微硅、石灰类矿物等为原料，复配出一种新型实心耐压减轻材料 FXW 。由于FXW为实心减轻材料，能够承受压力，因而能够适应井下高压条件。实验表明，FXW低密度水泥浆强度高，韧性好，可更好地满足油气井后期开发需求。     

土卡河水电站施工导截流设计

针对土卡河水电站枢纽布置、河道的水文气象条件及坝址区河谷地形等综合因素,介绍土卡河水电站施工导流方案、导流标准以及导流程序设计。根据现场交通条件和实际情况,进行截流设计,并将实际截流发生情况与设计进行比较。     

基于光敏自组装多层膜的液晶光控取向膜

采用layer-by-layer(LBL)的方法，将基板依次在具有光敏双键的季铵盐水溶液和聚乙烯基苯磺酸钠水溶液中浸泡，石英基板表面形成了自组装多层沉积膜。经线性偏振紫外光辐照后，LBL多层膜表现出明显的紫外吸收各向异性。将两片带有各向异性薄膜的基板做成平行液晶器件。在正交的偏光显微镜下观察，发现取得均一、稳定的取向效果。该种光控取向膜有望用作LCoS微显示的取向层。     

基于非均匀星座的改进ARQ方案及其性能分析

本文针对调制阶数大于4的MPSK和MQAM调制，在重传中采用非均匀星座图和符号比特重新排序，提出了一种改进的ARQ方案。通过对AWGN信道下ARQ方案进行理论分析和数值仿真，表明基于非均匀星座的新方案在信道条件较差时能有效地提高重要比特的可靠性，若重传中结合符号比特重排和分组合并，则可使接收端解调合并后的比特可靠性趋于均匀且总体得到提高，从而有效地减少重传次数，提高系统的吞吐率。由于本文所提方案并不改变调制解调规则和数据分组长度，故容易实现和控制。     

基于滑窗结构的软输出维特比算法的实现

文章在对软输出维特比算法(SOVA)进行推导的基础上，分析了软信息的提取过程。同时从硬件实现的角度考虑，提出了一种基于滑动窗1：3结构的SOVA算法实现方案，该算法大大降低了算法实现复杂度和译码延迟，同时通过调整滑窗参数，可以取得与非滑窗SOVA算法几乎相同的性能。     

Verification of submodeling technique in thermomechanical reliability assessment of flip-chip package assembly

In this paper we verified the submodeling technique applied in the thermomechanical reliability assessment of a flip-chip BGA under accelerated thermal cycling test conditions. Since the steady-state creep model was implemented for the solder bump to better represent its realistic mechanical behavior, submodeling procedures developed specifically for path-dependent thermomechanical problems were considered. A detailed global model for the flip-chip BGA was built up to verify submodeling solutions. This model also served as a benchmark to examine solution discrepancies caused by different simplifications of the global model.