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241.
242.
The cracks in the workpiece specimens can reduce the fatigue life of any machine components. Since the residual stress has a considerable amount of influence on determining crack formation over the machined surface, it is very essential to analyze the residual stress developed in any machining process. However, it is a very tedious process to compute the residual stress over the machined surface. In the present study, an endeavor has been made to measure and analyze the residual stress of machined silicon steel as a workpiece using the EDM process with different energy distribution. The nano-indentation method was used to compute the residual stress produced over the machined surface. From the experimental results, it was found that the uniform energy distribution has produced higher compressive residual stress owing to the tiny and uniform spark energy distribution. It has also been observed that the tool electrode has a considerable amount of influence on determining development of residual stress in the EDM process. 相似文献
243.
S.K. Vimala Bharathi M. Maria Leena J.A. Moses C. Anandharamakrishnan 《International Journal of Food Science & Technology》2020,55(3):1238-1245
The usage of cling wraps is emerging as an easy and cost-effective approach to protect fresh-cut fruits and vegetables from dust, whilst improving visual appeal on retail counters. This study focused on developing an alternate, protein-based packaging material as a food grade cling wrap for food packaging applications. Zein-based cling wraps were produced, and their physical and mechanical characteristics were evaluated and compared with conventionally used chitosan biopolymer films and commercial synthetic polymer films. Antioxidant potential of the prepared films was studied, and the effectiveness of the developed films as anti-browning cling wraps was evaluated using studies conducted on fresh-cut apple slices at ambient conditions. Anti-browning effects were in par with polymeric counterparts; however, zein cling wraps could better prevent weight loss in apple slices. Zein-based films can be adopted as biodegradable food grade cling wraps as an alternative to chitosan and synthetic polymeric materials. 相似文献
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246.
Amer Ibrahim Al-Omari Ibrahim M. Almanjahie Amal S. Hassan Heba F. Nagy 《计算机、材料和连续体(英文)》2020,64(2):835-857
In reliability analysis, the stress-strength model is often used to describe the life of
a component which has a random strength (X) and is subjected to a random stress (Y). In this
paper, we considered the problem of estimating the reliability R=P [Y<X] when the
distributions of both stress and strength are independent and follow exponentiated Pareto
distribution. The maximum likelihood estimator of the stress strength reliability is calculated
under simple random sample, ranked set sampling and median ranked set sampling methods.
Four different reliability estimators under median ranked set sampling are derived. Two
estimators are obtained when both strength and stress have an odd or an even set size. The
two other estimators are obtained when the strength has an odd size and the stress has an
even set size and vice versa. The performances of the suggested estimators are compared
with their competitors under simple random sample via a simulation study. The simulation
study revealed that the stress strength reliability estimates based on ranked set sampling and
median ranked set sampling are more efficient than their competitors via simple random
sample. In general, the stress strength reliability estimates based on median ranked set
sampling are smaller than the corresponding estimates under ranked set sampling and simple
random sample methods. 相似文献
247.
Low-Temperature Growth of the CdS Cubic Phase by Atomic-Layer Deposition on SiC/Si Hybrid Substrates
Kukushkin S. A. Osipov A. V. Romanychev A. I. Kasatkin I. A. Loshachenko A. S. 《Technical Physics Letters》2020,46(11):1049-1052
Technical Physics Letters - A new method for epitaxial growth of cadmium sulfide (CdS) films in the metastable cubic phase by atomic-layer deposition on silicon substrates with a buffer layer of... 相似文献
248.
Shchelkunov E. B. Vinogradov S. V. Shchelkunova M. E. Pronin A. I. Buravitsyn D. A. 《Russian Engineering Research》2020,40(5):367-371
Russian Engineering Research - The theoretically possible reconfigurable parallel mechanisms are classified, in terms of the layout of guides on the base. Formulas are derived for the... 相似文献
249.
Crespo Juan-José Sánchez José L. Alfaro-Cortés Francisco J. Flich José Duato José 《The Journal of supercomputing》2021,77(11):12826-12856
The Journal of Supercomputing - Deadlock-free dynamic network reconfiguration process is usually studied from the routing algorithm restrictions and resource reservation perspective. The dynamic... 相似文献
250.
Wireless Personal Communications - This paper considers half-duplex cooperative spectrum sharing scheme where both primary and secondary systems mutually cooperate with each other to exploit... 相似文献