多带抗噪声语音识别算法研究

根据Flether等人的研究,基于感知独立性假设的子带识别方法被用于抗噪声鲁棒语音识别。本文拓展子带方法,采用基于噪声污染假定的多带框架来减少噪声影响。论文不仅从理论上分析了噪声污染假定多带框架在识别性能上的潜在优势,而且提出了多带环境下的鲁棒语音识别算法。研究表明：多带框架不仅回避了独立感知假设要求,而且与子带方法相比,多带方法能更好的减少噪声影响,提高系统识别性能。     

我国水权交易博弈定价决策机理

结合水权交易双方的效用函数，基于博弈原理及方法分别建立了水权交易准市场阶段和水市场阶段的水权交易博弈定价模型，并对水市场定价模型的纳什均衡解进行了探讨；基于定价相关要素间关系的探讨，解析了准市场阶段和水市场阶段水权交易定价决策机理，结果认为水权交易双方存在利益冲突，并且准市场阶段水权交易定价相对较低，水市场阶段水权交易定价相对较高。     

四川盆地及邻区上二叠统一下三叠统海槽的深水沉积特征

四川盆地及邻区广元-旺苍、城口-鄂西、开江-梁平海槽是上二叠统一下三叠统飞仙关组（P3-T1f）的深水碳酸盐沉积区。该区上二叠统上部大隆组是硅质岩、硅质泥岩、硅质灰岩组合，含放射虫、有孔虫等化石，厚125—29．0m，为海槽裂陷期凝缩沉积。三叠系飞仙关组下部为远洋沉积的暗色泥岩、微晶碎屑灰岩和重力流沉积的浊积岩、角砾灰岩组成的深水碳酸盐沉积，厚50．0～300．0m，是裂陷期后的海槽充填沉积。海槽相区沉积在晚二叠统世末达到最大海泛面沉积了大隆组。海平面缓慢下降期沉积了补偿充填性质的飞仙关组深水碳酸盐岩。海槽相区上二叠统一下三叠统飞仙关组构成了一个完整的三级层序。深水沉积物的有机碳平均值高达6．21％，是良好的烃源岩。但在海槽相区上二叠统不发育生物礁，飞仙关组缺乏鲕粒岩。     

蜕变——中国气象局华风影视大楼

华风气象影视大楼总面积4万平方米，根据空间功能不同分为办公大楼和商务写字楼两部分，办公大楼是集演播室、制作机房、办公室为一体的九层综合性建筑。设计师杨宇在刚接触到这个项目的时候，面对的是一个既成事实的建筑。     

一种零知识证明协议的安全分析与改进

论文指出了文献[1]中的零知识证明协议在公钥参数选取上的安全漏洞,并从求解离散对数的角度进行了分析证明。然后吸取了DSA数字签名算法中安全密钥选取高效简单的优点,提出了一种比Schnorr身份识别方案快1／3的简单、安全、高效的零知识证明身份识别方案。     

正确区别教师的职业道德与违法行为

从师德和法律这两个不同的概念入手,剖析现实教学中存在的种种负面行为,这些行为中有违反 道德和违反法律之分.在加强师德教育的同时,应该加强法治教育,应该知道遵守法律是每个公民应尽的义 务,你首先是个好公民,你才可能是个好教师.从这个意义上说,加强师德教育,守法是基础.     

层序单元体系域划分及勘探意义

体系域是层序地层学理论体系中的重要概念，在隐蔽油气藏的勘探中，勘探家们极为重视低位体系域。但体系域的成因意义、是否有不同级别层序的体系域以及如何划分，在实际工作中认识不一致。结合勃海湾盆地的勘探实例，分析体系域的成因机制、组合特征和勘探规律，认为：体系域是基准面变化等因素作用的产物，不同级别的层序都发育着与其对应的体系域：一般情况下，三级层序对应的体系域单元与含油气层的规模相匹配，但四级层序对应的体系域才是隐蔽油气藏赋存的有利部位。图5参6。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

改性乳化沥青的发展和应用概况

综述了改性乳化沥青的发展及应用概况,重点讨论了改性乳化沥青的生产、制备工艺、稳定性影响因素,并对国内外改性乳化沥青的应用情况加以概述。     

Routing Correlated Data with Fusion Cost in Wireless Sensor Networks

In this paper, we propose a routing algorithm called minimum fusion Steiner tree (MFST) for energy efficient data gathering with aggregation (fusion) in wireless sensor networks. Different from existing schemes, MFST not only optimizes over the data transmission cost, but also incorporates the cost for data fusion, which can be significant for emerging sensor networks with vectorial data and/or security requirements. By employing a randomized algorithm that allows fusion points to be chosen according to the nodes' data amounts, MFST achieves an approximation ratio of 5/4log(k + 1), where k denotes the number of source nodes, to the optimal solution for extremely general system setups, provided that fusion cost and data aggregation are nondecreasing against the total input data. Consequently, in contrast to algorithms that only excel in full or nonaggregation scenarios without considering fusion cost, MFST can thrive in a wide range of applications