Transient response of cylindrical shells to localized heat sources

An exact analysis of the dynamic problem on the thermal displacements and stresses of cylindrical shells subjected to instantaneous heating is carried out. Equations of motion for cylindrical shells, including the thermal effects, are reduced and solved by using the Fourier and Laplace transformation methods, after obtaining the temperature distribution determined from the nonstationary equation of heat conduction for a shell under a prescribed temperature field. Numerical results are presented for the thermal displacement and stresses due to the time variation together with the quasistatic ones.     

Studies on synthesis and permeability of special polymer membranes

Summary The permeation characteristics of polymer blend membranes from poly(vinylidene fluoride) and poly-(ethylene glycol) to aqueous polymer solution were investigated under carefully controlled conditions. The permeation characteristics were influenced significantly by the blend ratio, the temperature and time of heat treatment, which changed the structure of the resulting membranes.     

Random-coiled conformation of polypeptide chains

Summary Random-coiled conformation of poly(L-leucine), which has -branched side-chain, was theoretically analyzed by a conformational energy calculation based on intra-residue interactions. Calculated characteristic ratio 7.62 was obtained by using the transformation matrix statistically averaged over the entire side-chain conformational space of L-Leu residue. This value is smaller than those of poly(L-phenylalanine) (11.24) and poly(L-tyrosine) (12.33) which have -branched side-chain.     

Stress corrosion cracking of pure copper in dilute ammoniacal solutions

Studies of the stress corrosion cracking (SCC) of 99.999% copper and Cu-Zn alloys containing up to 10 wt%Zn in NH₄OH solution were made with varying concentrations (0.03–0.07 M) and temperatures (40–70°C). Stress corrosion cracking occurs on pure copper and all of the alloys under the condition in which thick tarnish film (Cu₂O oxide film) forms. The path of cracking is transgranular for pure copper and alloys containing < 1.3 wt%Zn, but intergranular for alloys containing > 1.3 wt%Zn. Crack propagation rates and times-to-failure estimated by the tarnish rupture theory, utilizing experimentally determined values of the fracture strain of film and the creep rate of specimens during SCC tests, are in good agreement with those observed under constant load.     

The kinetics of hydrolytic polymerization of ε-caprolactam. II. Determination of the kinetic and thermodynamic constants by least-squares curve fitting

The kinetic and thermodynamic constants of the hydrolytic polymerization of ?-caprolactam were determined by least-squares curve fitting. The calculations were carried out using observed kinetic data such as concentration of ?-caprolactam ([CL]), endgroup ([EG]), and ?-aminocaproic acid ([ACA]) and time derivatives of each concentration (rates) ?[CL]/?t, ?[EG]/?t, and ?[ACA]/?t. The sets of the converged constants are obtained for the initial water concentrations of 0.42, 0.82, and 1.18 mole/kg. An averaged set of the constants applicable for this range of the initial composition was also evaluated. The compatibility between observed and calculated concentration and rate curves was improved by the use of the newly developed sets of the constants. The mechanism of the polycondensation reaction is also discussed, based on the rate and kinetic constants obtained by this work.     

Low temperature deposition of hexagonal BN films by chemical vapour deposition

Transparent hexagonal BN films were deposited onto copper substrates from the reactant gas BCl₃-NH₃-H₂ at temperatures in the range 250–700°C. The lowest deposition temperature of the films was about 250°C. The films deposited at temperatures below 450°C were unstable in moist atmosphere and devitrified; a 20%–30% decrease in weight was observed when these films were heated above 600°C in an argon atmosphere. In contrast, the films deposited at temperatures above 600°C were very stable, decreased in weight by 1%–2% on heating and were stable in air at temperatures below 750°C.     

Occurrence,horizontal transfer and degeneration of VDE intein family in Saccharomycete yeasts

VDE is a homing endonuclease gene originally discovered as an intervening element in VMA1s of Saccharomyces cerevisiae. There have been two independent subfamilies of VDE, one from S. cerevisiae strain X2180-1A and the other from Saccharomyces sp. DH1-1A in the host VMA1 gene, and they share the identity of 96.3%. In order to search the occurrence, intra/interspecies transfer and molecular degeneration of VDE, complete sequences of VMA1 in 10 strains of S. cerevisiae, eight species of saccharomycete yeasts, Candida glabrata and Kluyveromyces lactis were determined. We found that six of 10 S. cerevisiae strains contain VDEs 99.7-100% identical to that of the strain X2180-1A, one has no VDE, whereas the other three harbour VDEs 100% identical to that of the strain DH1-1A. S. carlsbergensis has two VMA1s, one being 99.8% identical to that of the strain X2180-1A with VDE 100% identical to that of the strain DH1-1A and the other containing the same VMA1 in S. pastorianus with no VDE. This and other evidence indicates that intra/interspecies transmissions of VDEs have occurred among saccharomycete yeasts. Phylogenetic analyses of VMA1 and VDE suggest that the S. cerevisiae VDEs had branched earlier than other VDEs from an ancestral VDE and had invaded into the host loci as relatively late events. The two VDEs seemed to degenerate in individual host loci, retaining their splicing capacity intact. The degeneration of the endonuclease domains was distinct and, if compared, its apparent rate was much faster than that of the protein-splicing domains.