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81.
The relative phase in this case is defined as the shift in the wavenumber from the vacuum value integrated over the interaction length. The relative phase is studied from the standpoint of the linear stability analysis in both the high- and low-gain regimes, and the qualitative implications in each of these regimes of the relative phase on the refractive guiding of the signal are identical. Specifically, the relative phase is found to be negative at the low-frequency end of the gain band. The relative phase increases with increasing frequency over this band until it turns positive at a frequency approximately 10% below the frequency of peak gain. Thus optical guiding is indicated over a large portion, but not all, of the gain band. The specific example of interest involves the low-gain regime prior to saturation. In this case, it is shown that the analytic result is in substantial agreement with the calculation of the relative phase 相似文献
82.
Chang C.-R. Steer M.B. Martin S. Reese E. Jr. 《Microwave Theory and Techniques》1991,39(10):1735-1745
The authors present a newly developed free-running steady-state oscillator analysis algorithm suited to large-signal oscillator analysis. Kurokawa's oscillation condition is coupled with the modified nodal admittance form of the circuit equations to avoid degenerate solutions. The algorithm was implemented by using both harmonic balance and frequency-domain spectral balance techniques. It was used in the simulation of monolithically integrated varactor-tuned MESFET oscillator. Good agreement between simulated power and oscillation frequency results was obtained 相似文献
83.
On the capacity of a cellular CDMA system 总被引:37,自引:0,他引:37
Gilhousen K.S. Jacobs I.M. Padovani R. Viterbi A.J. Weaver L.A. Jr. Wheatley C.E. III 《Vehicular Technology, IEEE Transactions on》1991,40(2):303-312
It is shown that, particularly for terrestrial cellular telephony, the interference-suppression feature of CDMA (code division multiple access) can result in a many-fold increase in capacity over analog and even over competing digital techniques. A single-cell system, such as a hubbed satellite network, is addressed, and the basic expression for capacity is developed. The corresponding expressions for a multiple-cell system are derived. and the distribution on the number of users supportable per cell is determined. It is concluded that properly augmented and power-controlled multiple-cell CDMA promises a quantum increase in current cellular capacity 相似文献
84.
Vanderby R. Jr. Masters G.P. Bowers J.R. Graf B.K. 《IEEE transactions on bio-medical engineering》1991,38(10):1040-1042
A device has been designed and fabricated to measure the cross-sectional area of soft connective tissues ex vivo. It consists of two displacement transducers; one sensing tissue thickness and the other sensing width. Outputs are recorded (via an analog to digital interface) using a personal computer. Numerical integration of a thickness versus width plot computes cross-sectional area. This plot also provides a quality check of acquired data. This device has been successfully used in biomechanical studies of rabbit patellar tendons, rat medial collateral ligaments, and dissected specimens of human fascia. 相似文献
85.
Feld S.A. Beyette F.R. Jr. Hafich M.J. Lee H.Y. Robinson G.Y. Wilmsen C.W. 《Electron Devices, IEEE Transactions on》1991,38(11):2452-2459
A circuit model for optical and electrical feedback has been developed to investigate the cause of negative differential resistance (NDR) switching in a series connected heterojunction phototransistor (HPT) light-emitting diode (LED) device. The model considers optical feedback from the light generated in the LED, electrical feedback from the holes thermally emitted over the LED cladding layer, nonlinear gain of the HPT, the Early effect, and leakage resistance. The analysis shows that either electrical or optical feedback can be the dominant cause for the NDR, depending upon their relative strengths. The NDR observed in the devices was caused primarily by electrical feedback since the optical feedback is weak. For low input power, avalanche breakdown appears to initiate the NDR in the devices although avalanching alone cannot cause NDR 相似文献
86.
William E Acree Jr Michael H Abraham 《Journal of chemical technology and biotechnology (Oxford, Oxfordshire : 1986)》2006,81(8):1441-1446
The contentions made in an earlier paper [J Chem Technol Biotechnol 80 : 133–137 (2005)] that the coefficients of the Abraham solvation equation do not provide meaningful information on the molecular properties of ionic liquid solvents is refuted. The objections noted in the earlier paper disappear when the solvation equation model is correctly applied to the experimental data. It is further shown that the coefficients of the Abraham solvation equations can be used to characterize ionic liquids and can be used to select solvents for the solubility of gaseous solutes. Copyright © 2006 Society of Chemical Industry 相似文献
87.
The 320C30 is a fast processor with a large memory space and floating-point-arithmetic capabilities. The authors describe the 320C30 architecture in detail, discussing both the internal organization of the device and the external interfaces. They also explain the pipeline structure, addressing software-related issues and constructs, and examine the development tools and support. Finally, they present examples of applications. Some of the major features of the 320C30 are: a 60-ns cycle time that results in execution of over 16 million instructions per second (MIPS) and over 33 million floating-point operations per second (Mflops); 32-bit data buses and 24-bit address buses for a 16M-word overall memory space; dual-access, 4 K×32-bit on-chip ROM and 2 K×32-bit on-chip RAM; a 64×32-bit program cache; a 32-bit integer/40-bit floating-point multiplier and ALU; eight extended-precision registers, eight auxiliary registers, and 23 control and status registers; generally single-cycle instructions; integer, floating-point, and logical operation; two- and three-operand instructions; an on-chip DMA controller; and fabrication in 1-μm CMOS technology and packaging in a 180-pin package. These facilitate FIR (finite impulse response) and IIR (infinite impulse response) filtering, telecommunications and speech applications, and graphics and image processing applications 相似文献
88.
89.
With the recent advent of accurate orbital volume assessment by computed tomography, a retrospective analysis was made of 31 patients with 'pure' blowout fracture of the orbital floor, managed either surgically or conservatively, to determine whether orbital volume measurement could provide an additional parameter of use in the management of such fractures. There was a significant difference in orbital volume discrepancy between patients managed surgically or conservatively suggesting that this investigation may be of use in decision making on surgical intervention in patients with orbital blowout fractures. 相似文献
90.
Demir H.V. Jun-Fei Zheng Sabnis V.A. Fidaner O. Hanberg J. Harris J.S. Jr. Miller D.A.B. 《Semiconductor Manufacturing, IEEE Transactions on》2005,18(1):182-189
This work reports an easy planarization and passivation approach for the integration of III-V semiconductor devices. Vertically etched III-V semiconductor devices typically require sidewall passivation to suppress leakage currents and planarization of the passivation material for metal interconnection and device integration. It is, however, challenging to planarize all devices at once. This technique offers wafer-scale passivation and planarization that is automatically leveled to the device top in the 1-3-/spl mu/m vicinity surrounding each device. In this method, a dielectric hard mask is used to define the device area. An undercut structure is intentionally created below the hard mask, which is retained during the subsequent polymer spinning and anisotropic polymer etch back. The spin-on polymer that fills in the undercut seals the sidewalls for all the devices across the wafer. After the polymer etch back, the dielectric mask is removed leaving the polymer surrounding each device level with its device top to atomic scale flatness. This integration method is robust and is insensitive to spin-on polymer thickness, polymer etch nonuniformity, and device height difference. It prevents the polymer under the hard mask from etch-induced damage and creates a polymer-free device surface for metallization upon removal of the dielectric mask. We applied this integration technique in fabricating an InP-based photonic switch that consists of a mesa photodiode and a quantum-well waveguide modulator using benzocyclobutene (BCB) polymer. We demonstrated functional integrated photonic switches with high process yield of >90%, high breakdown voltage of >25 V, and low ohmic contact resistance of /spl sim/10 /spl Omega/. To the best of our knowledge, such an integration of a surface-normal photodiode and a lumped electroabsorption modulator with the use of BCB is the first to be implemented on a single substrate. 相似文献