The Main Progress of Perovskite Solar Cells in 2020–2021

Perovskite solar cells (PSCs) emerging as a promising photovoltaic technology with high efficiency and low manufacturing cost have attracted the attention from ...     

The influence of dopant species on thermal stability of NiSi film

We investigated the relationship between thermal stability of NiSi films and the implanted dopant species on Si substrates. The most stable NiSi layer appeared on Boron-implanted Si substrate, where the formation of pseudo-epitaxial transrotational structure was observed, just in case that the dose of boron is more than 5e15 atoms/cm². This unique crystallographic orientation of NiSi film on Boron-implanted substrate is a key role of thermal stability because thermal stress at grain boundary can be diminished by peculiar arrangement of transrotational domains, owing to the anisotropy in coefficient of thermal expansion (CTE) of NiSi.     

Vacuum seal for a rectangular flange

A new vacuum seal for a rectangular flange used in r.f. equipments, was developed. The vacuum seal consists of a recess with a flat surface, machined into a rectangular flange, a rectangular metal gasket with a raised projection on one face, and a mating flange with a recess and raised projection. No leak greater than 1 × 10⁻¹⁰ Pa m³/s was found in leak tests, before and after baking cycles (100 °C, 12 h).     

Examination of the Mode II fracture behaviour of wood with a short crack in an asymmetric four-point bending test

Asymmetric four-point bending tests of agathis specimens with a short crack along the neutral axis in a tangential–longitudinal system were conducted onto analyse the failure behaviour of wood with a short crack. The nominal shear strength and Mode II critical stress intensity factors of the specimens with various crack lengths were measured, and the influence of crack length on these properties was examined. The nominal shear strength of the cracked specimens was significantly lower than the strength of a crack-free specimen, even when the crack was extremely short. This finding suggests that the fracture mechanics theory is effective for analysing the failure behaviour of wood with a very short crack in this loading condition. However, the Mode II critical stress intensity factor still depends on the crack length. When the crack length was corrected with considering the formation of fracture process zone ahead of the crack tip, the critical intensity factor could be predicted effectively as well as the nominal shear strength.     

Effect of different copper fillers on the electrical resistivity of conductive adhesives

The effects of different copper fillers with different morphology and particle size have been studied in terms of electrical resistivity and thermal stability on the electrically conductive adhesives. The copper fillers used in this study were prepared by wet chemical reduction, electrolytic and gas atomization method, respectively. The as cured ECAs filled with different type of Cu fillers showed significant difference in electrical resistivity. Cu filler with smaller particle size showed higher packing density and larger surface area, which would enhance formation of conductive channels and increased conductive network in the ECAs, leading to a lower electrical resistivity. In addition, thermal stability of the ECAs were investigated under high temperature exposure at 125 °C and high humidity aging at 85 °C/85% RH for 1,000 h. Results showed that ECAs with Cu fillers of relatively small particle size and rough particle surface have excellent thermal stability due to enhanced adhesion and contact area between Cu fillers and the polymer matrix. A very low resistivity at an order of magnitude of 10^?4 ?? cm could be maintained for these ECAs after 1,000 h at 125 and 85 °C/85% RH.     

New technique for bonding hydroxyapatite ceramics and magnesium alloy by hydrothermal hot-pressing method

The solidification of hydroxyapatite (HA:Ca₁₀(PO₄)₆(OH)₂) and its bonding with Magnesium (Mg) alloys (AZ31; Mg–3Al–1Zn) were achieved simultaneously by using a hydrothermal hot-pressing method at a low temperature as low as 150 °C with no special surface treatment of Mg alloy. A mixture of calcium hydrogen phosphate dihydrate and calcium hydroxide was used as a starting powder material for solidifying HA. 3-point bending tests were conducted to obtain an estimate of the fracture toughness for the HA/Mg interface as well as for the HA ceramics only. The fracture toughness tests showed that the induced crack from the pre-crack tip deviated from the HA/Mg interface and propagated into the HA. The fracture toughness determined on the bonded HA/Mg specimen was close to that of the HA ceramics only (0.30 MPam^1/2).     

Investigation of electron trapping behavior in n-channel organic thin-film transistors with ultrathin polymer passivation on SiO2 gate insulator

Electron trapping behavior at the interface between N,N′-ditridecyl-3,4,9,10-perylene tetracarboxylic diimide (PTCDI-C13) film and thermal SiO₂ was investigated by utilizing ultrathin poly(methyl methacrylate) (PMMA) gate passivation layers. From the capacitance–voltage analysis for the PTCDI-C13/PMMA/SiO₂ interface, it is found that the electron tunneling appeared with PMMA thinner than 0.8 nm, and that the thickness of the gate passivation layer should be at least 1 nm for preventing injection-type hysteresis in the capacitance–voltage curve. The effective electron mobility of organic thin-film transistors (OTFTs) based on PTCDI-C13 with SiO₂ gate insulator was increased by suppressing shallow-level interface traps on SiO₂ with the PMMA layer, which can be partially accounted for by the multiple trap and release model. In this work, the thickness and the density of the PMMA layers were precisely controlled with a simple spin-coating process. Even 1.3-nm thick PMMA layer caused the improvements of the electron mobility and the air stability of the n-channel conduction.     

Mechanism of Magnetite Seam Formation and its Role for FeO Scale Transformation

The phase transformation behavior of a thermally grown oxide scale of FeO on pure-Fe and an Fe–2wt%Au alloy was investigated. Particular attention was paid to formation of a magnetite seam, which is the Fe₃O₄ layer formed at the FeO/alloy interface at an initial stage of the phase transformation, since it has important effects on the overall phase transformation of FeO scale. A thin Au(Fe) layer was found to develop on the Fe–Au alloy at the FeO/alloy interface after 32 min of oxidation at 750 °C in air. This Au(Fe) layer prevented formation of a magnetite seam and accelerated the FeO eutectoid reaction. The Au(Fe) layer acted as a “chemical diffusion barrier” for inward diffusion of Fe from the FeO to the alloy substrate across the FeO/alloy interface and prevented magnetite seam formation.