电子文档防扩散体系建设研究

本文针对目前日益凸显的电子文档泄漏问题,对国内电子文档保护现状和存在的问题进行了分析,从原理和实现方式等方面对比了主流文档保护产品,总结了在建立电子文档防扩散体系时应确定的防护原则,并对管理和技术要点进行了分析,为电子文档防扩散系统的建设提供了建议。     

A conditional classification recurrent RBM for improved series mid-term forecasting

In the context of human-robot and robot-robot interactions, the better cooperation can be achieved by predicting the other party’s subsequent actions based on the current action of the other party. The time duration for adjustment is not sufficient provided by short term forecasting models to robots. A longer duration can by achieved by mid-term forecasting. But the mid-term forecasting models introduce the previous errors into the follow-up forecasting and amplified gradually, eventually invalidating the forecasting. A new mid-term forecasting with error suppression based on restricted Boltzmann machine(RBM) is proposed in this paper. The proposed model can suppress the error amplification by replacing the previous inputs with their features, which are retrieved by a deep belief network(DBN). Furthermore, a new mechanism is proposed to decide whether the forecasting result is accepted or not. The model is evaluated with several datasets. The reported experiments demonstrate the superior performance of the proposed model compared to the state-of-the-art approaches.

     

适用于复杂环境下的实时目标跟踪技术

针对复杂环境下目标跟踪过程中目标存在旋转、视角、尺度等变化以及噪声干扰的问题,提出了一种基于尺度不变特征与快速模板匹配相结合的目标跟踪技术;该技术通过分别提取预先存储模板和实时采集图像的尺度不变特征,建立初始模板;采用菱形搜索策略对模板的低分辨率子图和待跟踪图像的低分辨率子图进行快速互相关检测,根据检测结果在该帧高分辨率图像中建立紧凑ROI,在此区域内进行模板匹配,对目标进行精确定位;在目标跟踪的过程中采用自适应模板更新策略,以保证在目标发生变化时跟踪的稳定性;实验结果表明,该技术在稳定性、准确性和实时性等方面均优于传统方法。     

中职学校提高《数字电路》课程教学质量的探讨

《数字电路》是中职电类专业的一门专业基础课程。结合目前中职学校教学现状中存在的问题,如何让学生把这门课学好,笔者从精选教材、课堂导入、教学手段、考核评价等方面进行了探讨。指出了只有充分激发起学生的学习兴趣和学习积极性,才是提高教学质量的关键。     

3D Printing Conductive Composites with Poly(ionic liquid) as a Noncovalent Intermedia to Fabricate Carbon Circuits

In this study, a kind of imidazole type poly(ionic liquid) ([PEP-MIM]Cl) is synthesized, which can disperse carbon effectively. [PEP-MIM]Cl is used as an intermediate to coat carbon on the poly(acrylic acid)(PAA-co-MBA) via ion exchange to obtain conductive polymer composite (CPC). A series of characterizations are performed. Experiments show that carbon can be coated on the PAA-co-MBA uniformly, and compared with using carbon as filler, this method requires less carbon to achieve good conductive performance. The carbon layer on the polymer's surface is enriched via the swelling-shrinking properties of PAA-co-MBA according to the SEM images. Furthermore, in combination with 3D printing technology, PAA-co-MBA can be designed into different shapes to achieve various functions such as pressure-sensing element. Finally, a new type of CPC named carbon clad polymeric laminate (CCPL) is prepared by using the carbon coating method and 3D printing technology. It has the potential to replace copper clad laminate (CCL) and printed circuit board (PCB), to a certain extent. This technology expands the preparation method and application of the CPC such as flexible and wearable conductive fabrics.     

Effects of Ultrasonic Vibration on Material Flow and Thermal Cycles in Friction Stir Welding of Dissimilar Al/Mg Alloys

Comparative experiments are performed in friction stir welding (FSW) of dissimilar Al/Mg alloys with and without assistance of ultrasonic vibration. Metallographic characterization of the welds at transverse cross sections reveals that ultrasonic vibration induces differences in plastic material flow in two conditions. In FSW, the plastic material in the peripheral area of shoulder-affected zone (SAZ) tends to flow downward because of the weakening of the driving force of the shoulder, and a plastic material insulation layer is formed at the SAZ edge. When ultrasonic vibration is exerted, the stirred zone is divided into the inner and outer shear layers, the downward material flow trend of the inner shear layer disappears and tends to flow upward, and the onion-ring structure caused by the swirl motion is avoided in the pin-affected zone. By improving the flow behavior of plastic materials in the stirred zone, ultrasonic vibration reduces the heat generation, accelerates the heat dissipation in nugget zone and changes the thermal cycles, thus inhibiting the formation of intermetallic compound layers.

     

SBTV铁电材料的制备和微观组织结构

采用固相反应法合成了SrBi2Ta2O9(简称SBT)和V掺杂SrBi2Ta2O9(简称SBTV)陶瓷,通过TG-DTA、XRD、SEM、TEM等技术手段研究了材料的烧结工艺、相组成和微观组织结构.研究表明V2O5是一种很好的助烧剂,掺杂后材料的烧结温度可降低200℃烧结后纯SBT均为单一的钙钛矿相SBT;掺杂后2种成型工艺所制备的SBTV除了生成少量Bi4(V2O11)外,仍主要由钙钛矿相组成;同时所有的材料都发生了一定程度的择优取向.掺杂后材料的晶粒形态发生变化棒状转化为片状.同时V掺杂后引起了晶格畸变,产生应变,SBTV材料在透射中观察到具有α-边界特征的90°畴.     

Effect of temperature on anodic behavior of 13Cr martensitic steel in CO2 environment

The corrosion behavior of 13Cr martensitic stainless steel in a CO₂ environment in a stimulated oilfield was studied with potentiodynamic polarization and the impedance spectra technique. The results showed that the microstructure of the surface scale clearly changed with temperature. This decreased the sensitivity of pitting corrosion and increased the tendency toward general (or uniform) corrosion. The capacitance, the charge transfer resistance, and the polarization resistance of the corrosion product scale decrease with increasing temperature from 90 to 120 °C, and thus the corrosion is a thermal activation controlled process. Charge transfer through the scale is difficult and the corrosion is controlled by a diffusion process at a temperature of 150 °C. Resistance charge transfer through the corrosion product layer is higher than that in the passive film.     

Trusted Integrated Circuits: The Problem and Challenges

Hardware security has become more and more important in current information security architecture. Recently collected reports have shown that there may have been considerable hardware attacks prepared for possible military usage from all over the world. Due to the intrinsic difference from software security, hardware security has some special features and challenges. In order to guarantee hardware security, academia has proposed the concept of trusted integrated circuits, which aims at a secure circulation of IC design, manufacture and chip using. This paper reviews the main problems of trusted integrated circuits, and concludes four key domains of the trusted IC, namely the trusted IC design, trusted manufacture, trusted IP protection, and trusted chip authentication. The main challenges in those domains are also analyzed based on the current known techniques. Finally, the main limitations of the current techniques and possible future trends are discussed.