适配器强度有限元分析

使用有限元程序ＳＡＰ５对某新型导弹发射筒内的适配器的强度进行了计算。通过结果分析，找出了适配器危险应力点的分布规律，它对结构选型设计具有指导意义。     

Prix de la SCP 1987 honorant une contribution hors-pair á la psychologie en tant que profession.

Announces that Dr. Stephanie Dudek, Professor of Psychology at the University of Montreal, is this year's recipient of the CPA Award for Distinguished Contributions to Psychology as a Profession. Dr. Dudek has contributed to our profession as a brilliant clinician, inspiring teacher and creative researcher, unifying these three roles into a remarkable and outstanding career. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Leopold Bellak.

Since 1979, Professional Awards have been presented to individual members of the Association whose distinguished contributions have served to advance psychology as a profession in the areas of knowledge, professional practice, and public service. In 1992, Leopold Bellak received the award for Distinguished Professional Contributions to Knowledge. His professional career as psychologist, psychiatrist, and psychoanalyst encompassed seminal contributions to the fields of psychopathology, psychoanalysis, psychological testing, brief psychotherapy, and community mental health. The author of more than 200 publications, he is perhaps best known to psychologists for his work with the Thematic Apperception Test (TAT) and the development of the Children's Apperception Test. A citation and biography are presented for Bellak, along with a selected bibliography of his work. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Marcia K. Johnson: 2006 Award for Distinguished Scientific Contributions.

Presents the citation to Marcia K. Johnson, who received the Award for Distinguished Scientific Contributions "for raising and illuminating fundamental questions about the cognitive and neural processes that constitute the subjective experience of mental life." A brief profile and a selected bibliography, as well as Johnson's award address, entitled Memory and Reality (see record 2006-21079-028), accompany the citation. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

Summary report of journal operations: 1984.

Provides the summary report for the American Psychological Association's journal operations. The summary here is compiled from the 1984 annual reports of the Council of Editors and from Central Office records. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

低负荷维氏硬度法的负荷选择

本文按照维氏硬度测定的技术条件,将基本公式H_v=1854P/D~2加以变换,从而得到一些较为简单的数学关系式.利用这些关系式,可以对不同金属薄带材料,很容易计算出较合理的负荷大小,既能保证不被"打穿",也使视场内有一个适合观测的压痕图象.     

超滤在明胶生产中的应用

本文研究了超滤在明胶生产中的应用,超滤作为初级浓缩是可行的。同时,对超滤设备、超滤膜与工艺条件作了讨论。     

仿瓷胶粘剂的研究

本文介绍一种仿瓷环氧胶粘剂,该胶耐酸耐碱,可室温固化,在室温下粘接不锈钢试样,其剪切强度可达30.7MPa;而在130℃时其剪切强度为1.7MPa。可用于修复搪瓷,粘接金属和陶瓷等。     

Solders development and application process for a micro chip-camera

Nowadays, micro components have to fulfill rising optical requirements for different scientific and industrial fields like astronomy, medicine or multimedia. For this purpose, advanced miniaturized chip-cameras are produced for the microsystems engineering market. The assembly and joining technologies play a very important role in the production of these micro components. Several challenges are associated with the joining of chip-cameras. In this study, the application of the soldering technology has been considered in order to face these challenges. Two joining technologies have been investigated: active soldering and transient liquid phase (TLP) bonding. Both soldering processes have shown a big potential for hybrid microsystems joining in previous studies. For both processes, soldering alloys and parameters have been conceived in order to fulfill the joining requirements of the micro camera components. For instance, the joining temperature represents a major challenge because the chip-camera consists of a plastic material, polymethyl methacrylate (PMMA). Therefore, particular attention has been directed to the soldering as well as to the coating temperature. The experimental investigations concerning the solders application through physical vapor deposition (PVD) have been supported by finite element method (FEM) simulations. The analysis of  the temperature distribution in the micro components during the coating process was the focus of  the calculations. Possible undesirable local overheated areas of the chip-camera components can be detected through simulation.

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