Technology Scapegoats and Policy Saviors

IEEE Security & Privacy's associate editor in chief discusses technology's role in identity fraud and identity theft.     

The stiffness matrix in elastically articulated rigid-body systems

Discussed in this paper is the Cartesian stiffness matrix, which recently has received special attention within the robotics research community. Stiffness is a fundamental concept in mechanics; its representation in mechanical systems whose potential energy is describable by a finite set of generalized coordinates takes the form of a square matrix that is known to be, moreover, symmetric and positive-definite or, at least, semi-definite. We attempt to elucidate in this paper the notion of “asymmetric stiffness matrices”. In doing so, we show that to qualify for a stiffness matrix, the matrix should be symmetric and either positive semi-definite or positive-definite. We derive the conditions under which a matrix mapping small-amplitude displacement screws into elastic wrenches fails to be symmetric. From the discussion, it should be apparent that the asymmetric matrix thus derived cannot be, properly speaking, a stiffness matrix. The concept is illustrated with an example.     

Multiphysics modeling and optimization of mechatronic multibody systems

Modeling mechatronic multibody systems requires the same type of methodology as for designing and prototyping mechatronic devices: a unified and integrated engineering approach. Various formulations are currently proposed to deal with multiphysics modeling, e.g., graph theories, equational approaches, co-simulation techniques. Recent works have pointed out their relative advantages and drawbacks, depending on the application to deal with: model size, model complexity, degree of coupling, frequency range, etc. This paper is the result of a close collaboration between three laboratories, and aims at showing that for “non-academic” mechatronic applications (i.e., issuing from real industrial issues), multibody dynamics formulations can be generalized to mechatronic systems, for the model generation as well as for the numerical analysis phases. Model portability being also an important aspect of the work, they must be easily interfaced with control design and optimization programs. A global “demonstrator”, based on an industrial case, is discussed: multiphysics modeling and mathematical optimization are carried out to illustrate the consistency and the efficiency of the proposed approaches.     

Etching behavior of CVD zinc selenide in inorganic acid solutions

Chemical interaction between polished surfaces of polycrystalline zinc selenide and inorganic acid solutions of various concentrations has been studied.     

Electromagnetic wave reflection from Fe/Cr nanostructures

The reflection of electromagnetic waves in the millimeter wave band from Fe/Cr nanostructures has been studied. It is established that the giant magnetoresistance (GMR) in the nanostructure leads to an increase in the reflection and a decrease in the transmission of microwaves, while the magnetic resonance leads to a decrease in both the reflection and transmission coefficients.     

High-temperature oxidation of intermetallics formed by group IV transition metals with chromium

We have studied the oxidation resistance of chromium intermetallics: TiCr₂, HfCr₂, and ZrCr₂, in the temperature interval 873–1473 K with isothermal holding of the specimens for up to 20 h. We have shown that the intermetallics TiCr₂ and HfCr₂ are oxidized 2–3 times more slowly than pure titanium and hafnium, but more than 1–2 orders of magnitude faster than chromium at T≤1273 K and 4–6 times faster at 1473 K. In this temperature interval, the intermetallic ZrCr₂ is rapidly oxidized at an increasing rate as the heating temperature rises. The scaling resistance of intermetallics of Group IV d metals with chromium is determined by formation of scales in which the major role is played by the oxides TiO₂, HfO₂, and ZrO₂, with weak protective properties.     

New encapsulation development for fine pitch IC devices

The continuous reduction of chip size driven by the market demand has a significant impact on circuit design and assembly process of IC packages. Shrinking chip size and increasing I/O counts require finer bond pad pitch and bond pad size for circuitry layout. As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.This paper presents a new encapsulation process development for 50 μm fine pitch plastic ball grid array package. Since reduced wire diameter decreases the bending strength of bonded wires significantly, wire deflection during molding process becomes quite serious and critical. Experiments on conventional transfer molding were conducted to evaluate wire span threshold with 23.0 μm diameter gold wire. The results show that the wire span threshold is about 4.1 mm, which is much shorter than the wire span threshold of over 5.0 mm for wire with 25.4 μm diameter. Finite element analysis shows there is a significant difference in the wire deflection between 23.0 μm gold wire and 25.4 μm gold wire diameter under the same action of mold flow. A novel encapsulation method is introduced using non-sweep solution. The wire span could be extended to over 5.0 mm with wire sweep less than 1%. Reliability tests conducted showed that all the units passed 1000 temperature cycles (−55 to 125 °C) with JEDEC moisture sensitivity level 2a (60 °C/60% relative humidity for 120 h) and 3 times reflow (peak temperature at 220–225 °C). It is believed that this solution could efficiently overcome the risk of wire short issues and improve the yield of ultra fine pitch wire bonds in high-volume production.     

Some perspectives on the analysis and control of complementarity systems

This paper is devoted to presenting controllability and stabilizability issues associated to a class of nonsmooth dynamical systems, namely complementarity dynamical systems. The main existing results are summarized, and some possible research directions are provided. Convex analysis and complementarity problems are claimed to be the main analysis tools for control related studies. This paper mainly focuses on mechanical applications.