Fabrication of Cu(In,Ga)Se2 thin films by ion beam sputtering deposition from a quaternary target at different substrate temperatures

Cu(In, Ga)Se₂ (CIGS) thin films were fabricated by ion beam sputtering deposition from a single quaternary target at different substrate temperatures (T _sub). The thin films were characterized with X-ray diffractometry, scanning electron microscopy, energy-dispersive X-ray spectroscopy and four-point probe technique to study the microstructures, surface morphology, composition and electrical properties, respectively. The results show that the films grown above 400?°C are of chalcopyrite structure. Cu(In_0.7Ga_0.3)Se₂ thin film was obtained when T _sub is 550?°C. The Cu and Se atomic percentage when T _sub is above 500?°C is higher than when T _sub is below 500?°C. With the increase in T _sub, the surfaces morphology of the films is denser and the resistivity of the films decreases.     

Influence of phosphorus on iron-based friction material prepared directly from vanadium-bearing titanomagnetite concentrates

In situ selective carbothermic reactions and vacuum sintering were used to prepare iron-based friction material directly from vanadium-bearing titanomagnetite c...     

Microstructure and mechanical property of laser melting deposition (LMD) Ti/TiAl structural gradient material

This article presents fabrication, microstructure and mechanical properties study of Ti/TiAl functional gradient material. Ti–47Al–2.5V–Cr/Ti–6Al–2Zr–Mo–V gradient material was successfully fabricated by the laser melting deposition (LMD) manufacturing process. Microstructure and chemical composition was characterized by OM, SEM, TEM and EPMA. The Vickers hardness and room-temperature tensile property was evaluated on longitudinal direction. Results showed that fully lamellar (FL) microstructure consisted of γ-TiAl and α₂-Ti₃Al was formed on the Ti–47Al–2.5V–Cr side, while coarse basket weave microstructure was formed on the Ti–6Al–2Zr–1Mo–1V side. No cracking was found in the gradient zone after aging at 800 °C for 48 h. The room-temperature tensile strength of the as-deposited specimen is up to approximately 1198.8 MPa in the longitudinal direction, while the tensile elongation is approximately 0.4%, indicating a typical brittle fracture.     

25英寸700线彩色显像管偏转线圈的优化设计

在组合法计算彩色显像管偏转系统的基础上，对25英寸700线彩色显像管所用偏转线圈进行了优化设计。选取荧光屏光栅结点上的像差作为优化目标函数，选取线圈调制极上绕线密度的傅里叶展开系数作为优化参数，采用分步阻尼法优化设计出了25英寸700线彩色显像管用偏转线圈。根据实际的实验条件，绕制了25英寸700线彩色显像管用垂直偏转线圈，并与已有的25英寸同类彩色显像管所用偏转线圈进行了比较和分析。     

Analysis of the drude model in metallic films

A method, believed to be new, to simulate Drude parameters for collective oscillation of the free carriers in metallic films is proposed. Plasma resonance frequency and relaxation were simulated simultaneously from both the real and the imaginary parts of the dielectric function of a metallic film after consideration of their correlation in the Drude model. As examples, the contributions of the electrons in Ag films and of the free carriers in metallic silicide, NbSi(2) and TaSi(2), films have been studied.     

热声系统内交变流动特性的数值模拟

对热声系统中交变流动的声场与流场分布进行了数值模拟,得到了热声谐振管和回热器(板叠)内的压力和速度分布及二者之间的相位关系.数值模拟表明:在谐振管内,在模拟的边界条件下,径向速度分布出现"环形效应",流动分为核心区的完全湍流流动和湍流边界层内的粘性流动;对于水力半径和粘性渗透层深度相当的热声板叠,其内速度分布逐步出现"环形效应",流动介于层流和湍流的过渡区,为过渡态流动,在流道的大部分区域压力和速度振荡的相位差趋向于π/2;对于水力半径和粘性渗透层深度之比较小的热声回热器,其内交变流动的流动特性与稳态流动的相似,速度的径向分布为抛物线形,类似于定常流动的层流速度分布.     

人工水晶的压痕断裂行为及其 K_(1c)测量

藉助于声发射技术,研究了在 Vickers 钻石压头作用下人工水晶的压痕断裂行为。压头对角线与晶体试样的相对取向是,使得水晶Ⅰ和水晶Ⅱ的压痕诱发径向/中位断裂,分别沿着(10(?)0)/(1(?)10)和(11(?)0/(1(?)00)晶面对发展。压痕断裂过程中的声发射特征表明,除了随着压痕特征参数的发展所引起的准静态—声发射外,有三个相互独立的,与径向/中位裂纹的成核、径向/中位裂纹突入试样表面、以及裂纹分岔或侧向裂纹萌生等过程相关的声发射效应。以 Vickers 压痕技术测得 K_(c2)的结果与以一般力学法及 Knoop 压痕技术的测试结果作了比较。断裂韧性与晶体学取向的关系亦作了分析。实验表明,水晶Ⅰ和水晶Ⅱ具有相同的 K_(1c)值。其原因是,两种试样的径向/中位裂纹实际上沿着同样的{1100}/{1120}晶面对扩展。至于从缺口梁法或 Knoop 压痕技术得到的 K_(1c)值,由于水晶Ⅰ和水晶Ⅱ的主裂纹分别沿着(1(?)10)和(1(?)00)晶面扩展;它们的 K_(1c)值与断裂能随着晶体学取向而变有关,因而也就各不相同。     

中煤龙化KDON-30000/24000型空分设备工程建设总结

简介中煤龙化KDON-30000/24000型空分设备的工艺流程和主要技术参数,阐述在空分工程建设及试压过程中出现的问题和处理办法,从仪控组态和管道设计两方面对空分设备工程设计提出了建议,最后总结空分设备工程建设经验。     

全层片状TiAl基合金断裂过程的原位观察

利用ＳＥＭ拉伸台，研究了Ｔｉ－３３Ａｌ－３Ｃｒ－０．５Ｍｏ合金的室温拉伸断裂动态过程。试验结果表明，具有全层片状显微组织的ＴｉＡｌ合金室温断裂韧性较高，归因于合金拉伸过程中裂纹尖端发生分叉致使应力松弛而使裂纹钝化；在变形过程中，主裂纹尖端附近的微裂纹之间形成剪切韧带，剪切韧带韧化是ＴｉＡｌ合金的一种韧化机理。