Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

基于MPEG-2文件的合并

介绍了具有相同音频、视频编码方式的MPEG - 2节目流如何合并成一个节目流。合并后的文件播放流畅并且时间显示正确 ,它包括PATPMT表的重写 ,系统头部分相关字段的更改 ,PCR值的修改 ,解码时间标签 (DTS)和显示时间标签 (PTS)的重新确定 ,传送速率的修改以及添加相应的空包     

Organization and Management of Deep knowledge Resources for Product Innovation

Product innovation,for a truly strong solution,needs deep knowledge.Based on this point,the authors draw a conclusion that patents are the main resource of deep technique knowledge.There are five levels of newly organized patents.The main results of the studies on patents are various tech-nique effects.The database of effects is organized and managed according to the form of function-effect structure.     

区域分割法辅助计算复杂图像面积

介绍计算具有复杂边缘轮廓的图像面积的区域分割法。采用鼠标多边形作图法近似圈定待处理的图像区域。本文由格林定理出发得到有限连续边界与其包围区域面积之间的函数关系,并且应用这一函数关系得出多边形与其包围区域面积的数学关系,近似得到图像区域面积。文中以烟幕图像为例对上述结论进行了验证。文章最后给出了在VC++环境下实现多边形分割的部分源代码。     

抽油机减速箱缺油保护系统的研制

抽油机减速箱损坏的主要原因之一是减速箱润滑油不足。目前,没有对抽油机减速箱内的油量进行实时监测,减速箱缺油后,抽油机不能立即停机,使减速箱在缺油状态下长期运转,造成齿轮、轴承损坏,甚至报废。为解决这一问题,研制了一种实时报警装置,当油量少于设定的最小值时,可以在现场发出报警信号,并对抽油机采取强制停机措施,起到保护减速箱的作用。     

一种有效减少ADI-FDTD数值色散的方法

ADI—FDTD算法的数值色散效应较为明显，本文的研究表明一种通过添加各向异性媒质来修正相速误差，从而减少FDTD数值色散的方法，同样适用于ADI-FDTD，且收效更为显著。数值运算结果证明该方法能够简单有效地去除较宽频带范围内的色散。     

聚合物分散液晶(PMMA:5CB:C60)光折变特性的实验研究

用溶致相分离方法制备了3种不同组分的聚合物分散液晶薄膜(PMMA：5CB：C60)，C60作为敏化剂。利用二波耦合实验测量了不同样品的衍射效率和响应时间等光折变特性，实验发现，液晶含量不同的薄膜光学性质有很大的不同。     

微机械可调谐滤波器的研制

利用 Ga As/Al Ga As分布反馈 Bragg反射镜在 Ga As衬底上制作了一个微机械的调谐滤波器 .该器件在 7V调谐电压下调谐范围达28nm     

Measurement Method of the Thickness Uniformity for Polymer Films

Several methods for investigating the thickness uniformity of polymer thin films are presented as well their measurement principles.A comparison of these experimental methods is given.The cylindrical lightwave feflection method is found to can obtain the thickness distribution along a certain direction.It is simple and suitable method to evaluate the film thickness uniformity.     

1.8 V千兆以太网接收器模拟前端预均衡电路

介绍了一种用于1.8 V电源电压下的千兆以太网接收器的模拟前端预均衡电路。电路分为三个部分:预处理电路、基带漂移补偿电路和可变增益放大电路,主要实现回波消除、基带漂移补偿和电路增益自动控制等功能。为了与百兆模式兼容,提出了一种预处理电路。仿真结果表明,该电路可以很好地实现回波消除的功能,能够对由于基带漂移引起的信号失真给以补偿,可以提供16级不同的增益,并进行频率补偿。电路采用0.18μm标准CMOS工艺实现。