Structure observations by high-resolution electron microscopy of Ni-B melt-spun alloys (B<30 at%)

The microstructure of a series of Ni-B alloys (15 at%3B phase (a=0.44 nm,b=0.52 nm,c=0.66 nm) is expected. High-resolution electron microscopy images of Ni-25 at% B rapidly quenched indicate that a two-phase structure is observed. A metastable phase is observed with a periodicity of 1.0 nm. HREM images and EELS analyses led us to propose the structure of this metastable phase. This phase (Ni₅B₂) is correlated with the monoclinic Hägg carbide Fe₅C₂. Depending on the velocity of the substrate and on the boron concentration, a variety of microstructures has been observed from a faulted to a semi-amorphous structure. The structures are related to the solidification behaviour and the heat flow in the undercooled melt. Particular attention was paid to the eutectic Ni-Ni₃B composition.     

Interfacial strength and chemistry of additive-free silicon nitride ceramics brazed with aluminium

Two kinds of additive-free silicon nitride ceramics were brazed with aluminium; one was with as-ground faying surfaces and the other was with faying surfaces heat-treated at 1073K for 1.8 ksec in air. The heat-treatment of the silicon nitride ceramics formed a silicon oxynitride layer on the faying surfaces and increased the brazing strength of the joints. A silica-alumina non-crystalline layer and a β′-sialon layer were formed successively from the aluminium side at the interface of the joints. The heat-treatment which made the former layer thicker is a necessary process in making reliable, strong brazed joints.     

Grain boundary resistivity in Y-TZP materials as a function of thermal history

Grain-boundary resistivity in yttria-containing tetragonal zirconia polycrystalline (Y-TZP) materials dominates the total resistivity. Impedance measurements combined with microstructural studies suggest that post-sintering heat treatments (in particular the cooling rate) influence the location of the grain-boundary phase which, in turn, has a significant effect on the grain-boundary resistivity. Higher cooling rates from the sintering temperature lead to reduction in the grain-boundary resistivity. In both alumina-containing and relatively pure tetragonal zirconia polycrystals, post-sintering heat treatments have a less conspicuous effect. The activation energy associated with the grain-boundary resistivity was independent of the post-sintering heat treatments but was 25 to 30 kJ mol^–1 higher than that for the oxygen-ion conduction within the grains at low temperatures.     

Craze yielding and fracture mechanism in PE/PS/PE laminated films

The change in polystyrene (PS) layer thickness, which has been simultaneously determined during post-yield deformation, shows that crazing is the basic mechanism of toughening in all laminated films, and that shear deformation supplements the contribution of crazing especially for samples with high polyethylene (PE) volume fractions. Crazes formed in PS layers in the laminated films are slender and regular compared with the short and lenticular crazes formed in bulk PS film. When PE volume fraction increased, craze advance speed decreased because of the reduction of the stress concentration effect at craze tips. The life-time of the first mature craze to be formed at a given strain rate increased with PE volume fraction because the PE supporting the mature crazes could effectively inhibit craze rupture and blunt out the propagating crack by absorbing the stored elastic energy in the PS layer that would have been dissipated as fracture surface energy.