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61.
As a solid state joining process, ultrasonic spot welding has been proven to be a promising technique for joining copper alloys. However, challenges still remain in employing ultrasonic spot welding to join copper alloys. This article comprehensively reviews the current state of ultrasonic spot welding of copper alloys with a number of critical issues including materials flow, plastic deformation, temperature distribution, vibration, relative motion, vertical displacement, interface friction coefficient, online monitoring technique, coupled with the macrostructure and microstructure, the mechanical properties and electrical conductivity. In addition, the future trends in this field are provided.  相似文献   
62.
Wireless Personal Communications - In the fusion experiment, sensitive radio frequency signal diagnostic instruments need to be protected against high power stray radiation coming from the Electron...  相似文献   
63.
Sustainable and efficient food supply chain has become an essential component of one’s life. The model proposed in this paper is deeply linked to people's quality of life as a result of which there is a large incentive to fulfil customer demands through it. This proposed model can enhance food quality by making the best possible food quality accessible to customers, construct a sustainable logistics system considering its environmental impact and ensure the customer demand to be fulfilled as fast as possible. In this paper, an extended model is examined that builds a unified planning problem for efficient food logistics operations where four important objectives are viewed: minimising the total expense of the system, maximising the average food quality along with the minimisation of the amount of CO2 emissions in transportation along with production and total weighted delivery lead time minimisation. A four objective mixed integer linear programming model for intelligent food logistics system is developed in the paper. The optimisation of the formulated mathematical model is proposed using a modified multi-objective particle swarm optimisation algorithm with multiple social structures: MO-GLNPSO (Multi-Objective Global Local Near-Neighbour Particle Swarm Optimisation). Computational results of a case study on a given dataset as well as on multiple small, medium and large-scale datasets followed by sensitivity analysis show the potency and effectiveness of the introduced method. Lastly, there has been a scope for future study displayed which would lead to the further progress of these types of models.  相似文献   
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Puzanov  A. S.  Obolenskiy  S. V.  Kozlov  V. A. 《Semiconductors》2020,54(8):946-950
Semiconductors - On the basis of the Monte Carlo algorithm, a method for calculating the energy spectrum of hot nonequilibrium electrons and holes in the track of a primary recoil atom after being...  相似文献   
66.
Effective thermal management of electronic integrated devices with high powder density has become a serious issue, which requires materials with high thermal conductivity (TC). In order to solve the problem of weak bonding between graphite and Cu, a novel Cu/graphite film/Cu sandwich composite (Cu/GF/Cu composite) with ultrahigh TC was fabricated by electro-deposition. The micro-riveting structure was introduced to enhance the bonding strength between graphite film and deposited Cu layers by preparing a rectangular array of micro-holes on the graphite film before electro-deposition. TC and mechanical properties of the composites with different graphite volume fractions and current densities were investigated. The results showed that the TC enhancement generated by the micro-riveting structure for Cu/GF/Cu composites at low graphite content was more effective than that at high graphite content, and the strong texture orientation of deposited Cu resulted in high TC. Under the optimizing preparing condition, the highest in-plane TC reached 824.3 W·m−1·K−1, while the ultimate tensile strength of this composite was about four times higher than that of the graphite film.  相似文献   
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To increase the efficiency of designing systems intended for monitoring surface cracks in aluminum structures during their working life, we have analyzed a two-dimensional symmetric problem on uniaxial extension of an Al-polyimide-Cu layered structure with ideal adhesion between layers and a model crack in the aluminum base. The problem has been first solved for a sample with the crack modeled by a zero-thickness notch using the ANSYS engineering simulation program package. It is shown that this setting of the problem can lead to inadequate results as manifested, in particular, by significantly overstated mechanical stresses in aluminum in the region of crack emergence on the surface. In order to eliminate this difficulty, we propose to use the structure with a model defect in the form of a notch of nonzero thickness in the initial unstressed state of the structure. Recommendations for selecting the thickness of a notch used in the model structure are given.

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