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71.
With the creation of balancing authorities by the North American Reliability Council that span large portions of the North American interconnection, and stringent requirements for real time monitoring of power system evolution, faster and more accurate state estimation algorithms that can efficiently handle systems of very large sizes are needed in the present environment. This paper presents a distributed state estimation algorithm suitable for large-scale power systems. Synchronized phasor measurements are applied to aggregate the voltage phase angles of each decomposed subsystem in the distributed state estimation solution. The aggregated state estimation solution is obtained from the distributed solution using a sensitivity analysis based update at chosen boundary buses. Placement of synchronized phasor measurements in the decomposed subsystems is also investigated in this paper. Test results on the IEEE 118-bus test bed are provided  相似文献   
72.
The cooling and solidification of melted drops during their movement in an immiscible cooling medium is widely employed for granulation in the chemical industry, and a study of these processes to provides a basis for the design of the granulation tower height and the temperature of the cooling medium is reported. A physical model of the cooling and solidification of the drop is established and the numerical calculation is performed. The influences of the key factors in the solidification, i.e., Bi number, drop diameter, temperature of the cooling medium, etc. are presented. The cooling and solidification during wax granulation in a water‐cooling tower and during urea granulation in an air‐cooling tower (spraying tower) are described in detail. Characteristics of the solidification and temperature distribution within the particle at different times are shown. The model and calculations can be used for structure design of the granulation tower and optimization of the operation parameters.  相似文献   
73.
Carboxyl‐terminated butadiene‐acrylonitrile rubber (CTBN) has often been used to improve the toughness of cyanate ester (CE) resin while sacrificing modulus and thermostability. In this paper, the addition of the appropriate amount of epoxy resin (EP) to the CE/CTBN system is shown to not only increase the modulus and thermostability of the blend, but also improve the toughness. The values of impact strength showed a maximum for the CE/CTBN/EP 100/5/5 blend. The temperature of 10 % weight loss (T10) improves from 376 °C for CE/CTBN 100/5 to 407 °C for the CE/CTBN/EP 100/5/2.5 blend. It is proposed that addition of the appropriate amount of EP can decrease the mobility and increase the stability of CTBN via the reaction between the terminal carboxyl group of CTBN and the hydroxyl group of EP. But a very high EP concentration will decrease the crosslinking density of CE, consequently reducing the mechanical properties and thermostability of the blends. Copyright © 2004 Society of Chemical Industry  相似文献   
74.
Poly[2‐methoxy‐5‐(2′‐ethyl‐hexyloxy)‐para‐phenylene vinylene] (MEH‐PPV)/silica nanoparticle hybrid films were prepared and characterised. Three kinds of materials were compared: parent MEH‐PPV, MEH‐PPV/silica (hybrid A films), and MEH‐PPV/coupling agent MSMA/silica (hybrid B films), in which MSMA is 3‐(trimethoxysilyl) propyl methacrylate. It was found that the hybrid B films could significantly prevent macrophase separation, as evidenced by scanning electron and fluorescence microscopy. Furthermore, the thermal characteristics of the hybrid films were largely improved in comparison with the parent MEH‐PPV. The UV‐visible absorption spectra suggested that the incorporation of MSMA‐modified silica into MEH‐PPV could confine the polymer chain between nanoparticles and thus increase the conjugation length. The photoluminescence (PL) studies also indicated enhancement of the PL intensity and quantum efficiency by incorporating just 2 wt% of MSMA‐modified silica into MEH‐PPV. However, hybrid A films did not show such enhancement of optoelectronic properties as the hybrid B films. The present study suggests the importance of the interface between the luminescent organic polymers and the inorganic silica on morphology and optoelectronic properties. Copyright © 2004 Society of Chemical Industry  相似文献   
75.
ProKappa is an expert system tool kit developed by IntelliCorp in C using X-Windows for graphical interface. The SUN 3 or 4 version costs $9995/£7000 and $2595/£1800 for the interactive C environment.
This review covers ProKappa version 1.1, installed on a colour SUN SPARC Station 1 with the minimum recommended values of 12 Mb of memory and 30 Mb of swap space.
IntelliCorp can be contacted in the USA at 1975 El Camino Real West, Mountain View, CA 94040-2216 (+1 (415) 965-5500) and in the UK at 10 Jewry Street, Winchester, Hampshire SO23 8RZ (+44 (0)962 735348).  相似文献   
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77.
We present measurements of the electron, positive ion, and photon emission accompanying the fracture in vacuum of poly-crystalline 95/5 lead zirconate-titanate. The intensities of the charged-particle components of this fractoemission are shown to depend strongly on the direction (relative to the direction of fracture) and magnitude of polarization. The most intense emission is observed when the fracture surfaces are perpendicular to the polarization direction. The emission intensity increases monotonically with polarization. These results are interpreted in terms of a model involving charge separation on the fracture surfaces leading to a microdischarge during fracture. Implications to the interpretation of triboluminesence effects are discussed.  相似文献   
78.
The influence of liquid penetration at grain boundary regions on the rate of advance of the solid-liquid interface during isothermal solidification of transient liquid phase (TLP) brazed nickel joints has been examined. The test samples used in this study were Ohno-cast nickel with a grain size of >4 mm and a fine-grained nickel with a grain size of around 40 μm. Both Ni-base materials had the same chemical composition. The rate of isothermal solidification was greater when fine-grained nickel was employed during TLP brazing using Ni-11 wt pct P filler metal at 1200 °C. Liquid penetration at grain boundaries accelerates the isothermal solidification process by increasing the effective solid-liquid interfacial area and increasing the rate of solute diffusion into the base material. An analysis of electron channeling patterns has confirmed that random high-angle boundaries have a greater influence on the rate of isothermal solidification than ordered boundaries including small-angle or twin boundaries. Formerly Visiting Scientist, Department of Metallurgy and Materials Science, University of Toronto. Formerly Postdoctoral Fellow, Department of Metallurgy and Materials Science, University of Toronto  相似文献   
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