Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications

The effect of misalignment on the electrical properties of anisotropic conductive film (ACF) joints is investigated in this work. It is found that along with the increase of misalignment, the connection resistance of ACF joints increases. When the misalignment in x-direction is less than 5 μm, the increase rate of connection resistance is quite large. Then, along with the severity of misalignment, the increase rate becomes smaller. Finally, when the misalignment is close to 20 μm, the increase rate rises again. The Holm's electric contact theory is used for understanding the connection resistance variation. On the other hand, with the increase of misalignment in x-direction, the insulation resistance between ACF joints decreases. If the misalignment exceeded 10 μm, the decrease is prominent for the Ni particle ACF joints. This phenomenon can be explained by the effect of dielectric damage of the epoxy.Computer programs are also developed to calculate the variation of the probability of open and shorting after misalignment and predicate the maximum misalignment tolerance. The results show that the open and shorting probability increase abruptly after misalignment. On the view of pad parameters, the open probability is mainly related to the pad area, while the pads gap is critical to the shorting probability. Large pads gap (small pad width) can reduce the shorting probability obviously. On the other hand, enlarging the pad area by increasing pad length decreases the open probability significantly. So comparing to square shape pad, rectangle shape pad can reduce the failure probability greatly.     

Structural acrylic adhesives for the sheet steel fabrication industries

Recent developments in rubber-toughened structural acrylic adhesives now offer sheet steel fabricators the opportunity to replace conventional metal fastening techniques such as spot welding with lower cost, durable, more versatile structural adhesive bonding. These developments, in particular much improved ability to bond oily/waxy surfaces common to the motor car industry and improved retention of fracture toughness after exposure to paint stoving temperatures, are discussed in this paper.     

Eliminating memory for fragmentation within partitionable SIMD/SPMDmachines

Efficient data layout is an important aspect of the compilation process. A model for the creation of perfect memory maps for large-scale parallel machines capable of user-controlled partitionable single-instruction-multiple data/single-program-multiple data (SIMD/SPMD) operation is developed. The term perfect implies that no memory fragmentation occurs and ensures that the memory map size is kept to a minimum. A major constraint on solving this problem is based on the single program nature of both the SIMD and SPMD modes of parallelism. It is assumed that all processors within the same submachine used identical addresses to access corresponding data items in each of their local memories. Necessary and sufficient conditions are derived for being able to create perfect memory maps, and results are applied to several partitionable interconnection networks     

Design criterion for low-loss optical coupler tapers

A criterion for the local taper angle of a low-loss single-mode fibre coupler is established by considering the dominant mode coupling in the coupler taper. Effects due to structure parameters, such as cladding/core thickness ratio, corecladding index difference and core separation, are investigated. It is found that the criterion for the coupler taper can be well approximated by that for the single-mode fibre taper with the same structure parameters.     

The evolution of RFID security

As RFID technology progresses, security and privacy threats also evolve. By examining RFID's history, we can learn from past mistakes, rediscover successful solutions, and inspire future research.