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201.
Synthesis of 21R AlN polytypoids was investigated using Al and ultrafine SiO2 powder in a flowing nitrogen atmosphere by means of thermal gravity (TG), differential scanning calorimeter (DSC), X-ray diffractometer (XRD) and scanning electronic microscope (SEM) linked with energy dispersive spectrometer (EDS). The results showed that the formation mechanism of AlN polytypoids was different from that in reaction sintering process using Si3N4, AlN, Al2O3 and other sintering additive as raw materials. It was suggested that firstly Al reduce SiO2 into Si and is also nitrided into AlN, then AlN, Al2O3 and SiO2 dissolve into silicon liquid until the AlN polytypoids precipitate in saturated liquid in a flowing nitrogen atmosphere at lower than 1700 °C.  相似文献   
202.
The ennoblement of corrosion potential (Ecorr) of passive metal immersed in seawater was investigated with electrochemical technology and epifluorescence microscopy. The in situ observation showed that the bacteria number increased on the metal surface according to an exponential law which was in the same way with the ennoblement of Ecorr. At the same time, the anodic polarization current of high‐Mo stainless steel decreased in the initial days. According to the mix‐potential theory and the characteristics of polarization curves of high‐Mo steel in natural seawater, the ennoblement of corrosion potential may be induced by the decrease of the passive current density.  相似文献   
203.
Industry widely uses rotary valves and blow tanks for the pneumatic conveying of products, each having their pros and cons depending on the specific application. This article shows the differing results obtained when low-velocity conveying a product through a common pipeline using both a drop-through rotary valve and a bottom-discharge blow tank feeder. A number of issues arise in the rotary valve system, the main one being rotary valve air leakage. A blow tank system, on the other hand, does not leak, as it is an enclosed system. The experimental results show dramatic differences in product throughput. Further exploration leads to a novel modification being made to the rotary valve system in an attempt to increase its capacity. The result of this modification shows a slight increase in output tonnage, but still significantly less than that obtained from the blow tank.  相似文献   
204.
Epitaxial lamellar gallium selenide (GaSe) semiconductors have been grown on trench-patterned silicon (Si) substrates by molecular beam epitaxy. An intriguing star-like patterned morphology was identified by atomic force microscopy on these epilayers. This non-trivial feature can be correlated with the accumulation of stacking faults of two concurrent epitaxial domains around self-oriented triangular pits developed earlier on the Si(111) surface by the chemical etching. Crystallographic considerations show how the stars can be formed.  相似文献   
205.
Editorial     
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206.
Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.  相似文献   
207.
This paper proposes a new computer algorithm to solve the fuzzy relation equation P/spl ogr/Q=R, where /spl ogr/ denotes max-min composition or max-product composition. This algorithm operates systematically and graphically on a matrix pattern to get all the solutions of P. Furthermore, by using MATLAB software 6.0, the algorithm is implemented in a computer program attached in the appendix of this paper. Two examples are given to illustrate the effectiveness of the proposed algorithm.  相似文献   
208.
A wafer level packaging technique has been developed with an inherent advantage of good solder joint co-planarity suitable for wafer level testing. A suitable weak metallization scheme has also been established for the detachment process. During the fabrication process, the compliancy of the solder joint is enhanced through stretching to achieve a small shape factor. Thermal cycling reliability of these hourglass-shaped, stretch solder interconnections has been found to be considerably better than that of the conventional spherical-shaped solder bumps.  相似文献   
209.
The following letter presents a study regarding GaN-based light-emitting diodes (LEDs) with p-type AlGaN electron blocking layers (EBLs) of different thicknesses. The study revealed that the LEDs could endure higher electrostatic discharge (ESD) levels as the thickness of the AlGaN EBL increased. The observed improvement in the ESD endurance ability could be attributed to the fact that the thickened p-AlGaN EBL may partly fill the dislocation-related pits that occur on the surface of the InGaN-GaN multiple-quantum well (MQW) and that are due to the strain and the low-temperature-growth process. If these dislocation-related pits are not partly suppressed, they will eventually result in numerous surface pits associated with threading dislocations that intersect the InGaN-GaN (MQW), thereby reducing the ESD endurance ability. The results of the experiment show that the ESD endurance voltages could increase from 1500 to 6000 V when the thickness of the p-AlGaN EBL in the GaN LEDs is increased from 32.5 to 130 nm, while the forward voltages and light output powers remained almost the same.  相似文献   
210.
In this paper, we analyze in some detail the manifold-mapping optimization technique introduced recently [Echeverría and Hemker in space mapping and defect correction. Comput Methods Appl Math 5(2): 107—136, 2005]. Manifold mapping aims at accelerating optimal design procedures that otherwise require many evaluations of time-expensive cost functions. We give a proof of convergence for the manifold-mapping iteration. By means of two simple optimization problems we illustrate the convergence results derived. Finally, the performances of several variants of the method are compared for some design problems from electromagnetics.  相似文献   
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