Analysis of Restart Mechanisms in Software Systems

Restarts or retries are a common phenomenon in computing systems, for instance, in preventive maintenance, software rejuvenation, or when a failure is suspected. Typically, one sets a time-out to trigger the restart. We analyze and optimize time-out strategies for scenarios in which the expected required remaining time of a task is not always decreasing with the time invested in it. Examples of such tasks include the download of Web pages, randomized algorithms, distributed queries, and jobs subject to network or other failures. Assuming the independence of the completion time of successive tries, we derive computationally attractive expressions for the moments of the completion time, as well as for the probability that a task is able to meet a deadline. These expressions facilitate efficient algorithms to compute optimal restart strategies and are promising candidates for pragmatic online optimization of restart timers     

Haptic two-finger contact with textiles

Real-time cloth simulation involves many computational challenges to be solved, particularly in the context of haptic applications, where high frame rates are necessary for obtaining a satisfying experience. In this paper, we present an interactive cloth simulation system that offers a compromise between a realistic physics-based simulation of fabrics and a haptic application meeting high requirements in terms of computation speed. Our system allows the user to interact with the fabric using two fingers. The required performance of the system is achieved by introducing an intermediate layer responsible for the simulation of the small part of the surface being in contact with the fingers. Additionally we separate the possible contact situations into different cases, each being individually handled by a specialised contact algorithm.

Electrical and stability properties and ultrasonic microscope characterisation of low temperature co-fired ceramics resistors

This paper presents systematic investigations of electrical and stability properties of various low temperature co-fired ceramics (LTCC) resistors. One of the goals of this work was to check the compatibility of LTCC materials (tapes, resistive and conductive inks) from various manufacturers. Three commercially available green tapes and three LTCC resistor/conductor systems were examined. The resistive inks with 1 kΩ/sq. nominal sheet resistance were used. Buried (inside) and surface resistors were laminated and fired according to the tape manufacturers’ recommendations. The influence of dimensional effect on sheet resistance and hot temperature coefficient of resistance, the temperature dependence of resistance in a wide temperature range (from −180°C to +130°C), long-term stability of thermally aged as-fired resistors (150°C, 500 h) and durability to high-voltage micro- or nanosecond pulses (50 ns pulses with 4000 V/mm maximum electric field or 10 μs ones with 700–1000 V/mm electrical field) were carried out for electrical and stability characterisation of LTCC resistors. Non-destructive scanning acoustic microscope diagnostics was applied for structure investigation and estimation of lamination and cofiring process quality of buried LTCC resistors.     

Creep of thermally aged SnAgCu-solder joints

The creep behaviour of Sn96.5Ag3.5- and Sn95.5Ag3.8Cu0.7-solder was studied specifically for its dependence on technological and environmental factors. The technological factors considered were typical cooling rates and pad metallizations for solder joints in electronic packaging. The environmental factors included microstructural changes as a result of thermal aging of solder joints. Creep experiments were conducted on three types of specimens—flip–chip joints, PCB solder joints and bulk specimens. flip–chip specimens were altered through the selection of various under bump metallizations (Cu vs. NiAu), cooling rates (40 K/min vs. 120 K/min), and thermal storage (24 h, 168 h, and 1176 h at 125 °C). PCB solder joints were studied by using a copper pin soldered into a thru-hole connection on a printed circuit board having a NiAu metallization. Bulk specimens contained the pure alloys. The creep behaviour of the SnAg and SnAgCu solders varied in dependence of specimen type, pad metallization and aging condition. Constitutive models for SnAg and SnAgCu solders as they depend on the reviewed factors are provided.     

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

The paper presents creep data, that was gained on specimens of different microstructures. The three specimen types have been flip chip solder joints, pin trough hole solder joints and standard bulk solder specimens. The bulk solder specimen was a dog-bone type specimen (diameter=3 mm, LENGTH=117 mm). The pin trough hole solder joint consisted on a copper wire that was soldered into a hole of a double sided printed circuit board (thickness 1.5 mm). The flip chip solder joint specimen consisted of two silicon chips (4 mm × 4 mm), which were connected by four flip chip joints (one on each corner). SnAg and SnAgCu flip chip bumps (footprint 200 μm × 200 μm, joint height 165–200 μm, centre diameter 90…130 μm) were created by printing solder paste.Constant–load creep tests were carried out on all three specimen types at temperatures between 5 and 70 °C. Creep data was taken for strain rates between 10⁻¹⁰ and 10⁻³ s⁻¹. The specimens were tested in “as cast” condition and after thermal storage.The microstructural properties of the bulk specimens and real solder joints were examined using metallographic sectioning, optical microscopy techniques, and SEM-microprobe analysis. The results of the microstructural analysis were related to the investigated mechanical properties of the solders. Models of SnAg3.5 and SnAg4Cu0.5, that can be used with the ANSYS FEM software package, will be presented.     

The effect of downscaling the dimensions of solder interconnects on their creep properties

The creep behaviour of solders is an important input for accurate material models for FE-analysis of electronic assemblies. Usually the mechanical behaviour of solders has been determined by tensile tests on bulk solder specimens. Although performing these tests is not complicated and the results are easy to interpret, one of the key problems lies in the fact that solder joints are very small and, therefore, cannot be represented by large tensile specimens. The paper describes the attempts to gain deformation data on ultra small solder joints. It compares creep data that was experimentally gained on bulky samples and on small solder joints.     

Structure–Property Relationships in Aligned Electrospun Barium Titanate Nanofibers

Barium titanate nanofibers were uniaxially aligned by electrospinning onto a rotating copper wire drum and alignment was maintained during calcination of the fibers. Two methods for maintaining alignment during calcination were tested, by either using carbon tape or a peeling off method to remove the aligned fibers from the mandrel followed by calcination. The carbon tape removal method led to the formation of shorter aligned nanowires while the peeling off method resulted in longer nanofibers. Additionally, the effects of calcination temperature and time on crystal structure were also examined. The degree of tetragonality in the barium titanate nanofibers increased at higher calcination temperatures and times. Piezoelectricity was confirmed in the nanofibers calcined using piezoeresponse force microscopy, yielding a d₃₃ value of 15.5 pm/V. Using the methods presented here, large quantities of aligned piezoelectric barium titanate and other ceramic fibers or wires can be produced to fulfill their demand in novel microelectronics.     

How Phosphorous Flame Retardant Additives Affect Benzoxazine-Based Monomer and Polymer Properties

The phosphorous-based flame retardant additives poly(m-phenylene methylphosphonate) (PMP) and resorcinol bis(diphenyl phosphate) (RDP) are reacted with bisphenol F and aniline–based benzoxazine (BF-a). DSC, rheological analysis, FT-IR, and soxhlet extraction reveal the covalent incorporation of both FR additives—initiating phenols in PMP structure as well as free phenols generated via transesterification reaction in the case of RDP. In contrast to PMP, RDP elongates the processing window but decreases the thermo–mechanical properties. Both additives increase the resistance in reactions against small flames with solely a phosphorous loading of 0.3 wt%, resulting in a V-0 rating and an improvement in the OI value by up to 2% for RDP and 4% for PMP. Both FRs reduce the heat release rate but increase the smoke production and the smoke toxicity in the case of RDP.     

Homoserine Lactones,Methyl Oligohydroxybutyrates,and Other Extracellular Metabolites of Macroalgae‐Associated Bacteria of the Roseobacter Clade: Identification and Functions

Twenty‐four strains of marine Roseobacter clade bacteria were isolated from macroalgae and investigated for the production of quorum‐sensing autoinducers, N‐acylhomoserine lactones (AHLs). GC/MS analysis of the extracellular metabolites allowed us to evaluate the release of other small molecules as well. Nineteen strains produced AHLs, ranging from 3‐OH‐C10:0‐HSL (homoserine lactone) to (2E,11Z)‐C18:2‐HSL, but no specific phylogenetic or ecological pattern of individual AHL occurrence was observed when cluster analysis was performed. Other identified compounds included indole, tropone, methyl esters of oligomers of 3‐hydroxybutyric acid, and various amides, such as N‐9‐hexadecenoylalanine methyl ester (9‐C16:1‐NAME), a structural analogue of AHLs. Several compounds were tested for their antibacterial and antialgal activity on marine isolates likely to occur in the habitat of the macroalgae. Both AHLs and 9‐C16:1‐NAME showed high antialgal activity against Skeletonema costatum, whereas their antibacterial activity was low.     

Very High Volume Aerosol Sampling with a Novel Drum Centrifuge

For chemical analysis of trace compounds, comparatively large amounts of dust have to be collected. If good time resolution is required, very high sampling flow rates are mandatory. The operating principle of the drum centrifuge built to cope with these requirements is based on particle deposition on the inner surface of a porous rotating drum. Due to the rotation, a pressure gradient draws the aerosol into the bore of the axis and from there radially outward through a number of holes into the drum. The aerosol then moves to the periphery of the double-walled drum, which consists of two 0.15-mm-thick metal sheets with 1-mm spacing. Each of these metal sheets is perforated by several rows of small slits resulting in porosity of 16%. The slits in the inner and outer sheet are displaced, so that the particles will be strongly deflected on their way out of the rotating drum. Under the combined action of centrifugal forces and strong streamline deflection in the displaced slits of the two thin-walled drums, the particles are deposited. Flow rate as a function of rpm and collection efficiency as a function of particle size were determined experimentally. For simplicity, only the flow field of two (nonrotating) displaced slits was mathematically analyzed. The resulting 2-D solution of the Navier-Stokes equation was used for deterministic limiting trajectory calculations in the case of large particles. Diffusional motion of small particles was allowed for by Monte Carlo trajectory calculation. The calculated deposition efficiencies agree satisfactorily with the experimental results. At 3000 rpm a flow rate of 1200 m³/hr and efficiencies of 91% for 2.1-μm particles, 75% for 0.6-μm particles, and 48% for 0.04-μm particles were obtained. For easy extraction of the collected particulate matter, the device is equipped with an ultrasonic cleaning bath.