Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

On the effect of spatial variances in historical rainfall time series to CSO performance evaluation.

Historical, high-resolution rain series are the backbone of modern combined sewer overflow (CSO) structure design. These rain series are the input to the computational estimation of the performance of the measures with respect to CSO pollution abatement. However, those historical precipitation measurements are available at only a few locations. Frequently rain series have to be used from gauging stations at a significant distance. In order to judge and to compensate for this influence an estimate between rain characteristics and combined sewer outflow (CSO) performance indicators would be useful. In this paper such correlations have been sought for a collection of 37 rain series covering large areas of Europe. It was found that the mean annual rain volume can explain most of the variances for the performance indicators Number of overflows and CSO volume. For explaining the spatial differences in the efficiency of the CSO structure another rain characteristic, i.e. the maximum event with a return period of one year, is to be used.     

径向水平井弯曲转向机构影响因素仿真研究

针对径向水平井钻进中钻杆弯曲转向前进运动困难的问题,通过建立弯曲转向机构仿真有限元模型,对其主要影响因素:滑道轨迹曲率、间隙、工作压力、滚轮形状与位置和钻杆壁厚等用ANSYS软件进行仿真研究。研究表明:影响截面变形的主要因素是滑道曲率的改变和滑道摩擦因数,钻井失败时钻杆所受阻力的增大不是因为升高工作压力导致截面变形过大与滑道干涉所致,钻杆经校直段,钻头中轴线与校直中心线存在一定的角度,即钻杆的前进轨迹就会偏离理论值,或与地层干涉,或可能再次发生弯曲变形;另一主要原因是转向器滑道工作恶化。增加钻杆壁厚,降低工作压力和滑道摩擦因数,设计合理弯曲转向机构是解决问题的关键。     

A novel compact ring dual-mode filter with adjustable second-passband for dual-band applications

In this letter, a novel compact ring dual-mode with adjustable second-passband for dual-band applications are presented. A ring resonator with two different geometric dimensions are derived and designed to have identical fundamental and the first higher-order resonant frequencies, and to establish appropriate couplings in the structure. Moreover, the proposed filter has smaller size as compared with the basic topology of stopband filters and stepped-impedance-resonator (SIR) filters. The measured filter performance is in good agreement with the simulated response.     

水泥砂浆衬里在输水钢管内壁防腐中的应用

结合工程实例,阐述了在输水水质腐蚀性不大的情况下,输水钢管的内壁防腐采用水泥砂浆衬里的必要性和优点,并介绍了设计要点和安装施工注意事项。     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

Blind estimation of OFDM carrier frequency offset via oversampling

Blind deterministic estimation of the orthogonal frequency division multiplexing (OFDM) frequency offset via oversampling is proposed in this paper. This method utilizes the intrinsic phase shift of neighboring sample points incurred by the frequency offset that is common among all subcarriers. The proposed method is data efficient - it requires only a single OFDM symbol to achieve reliable estimation, hence making it more suitable to systems with stringent delay requirement and mobility-induced channel variation. The proposed scheme is devised to perfectly retrieve frequency offset in the absence of noise. Quite remarkably, we show that in the presence of channel noise, this intuitive scheme is indeed the maximum likelihood estimate of the carrier frequency offset. The possible presence of virtual carriers are also accommodated in the system model, and some interesting observations are obtained. The Cramer-Rao lower bound is derived for the oversampling-based signal model, and we show through numerical simulation that the proposed algorithm is efficient. Practical issues such as identifiability, the front-end filter bandwidth, and the possible presence of correlated noises are also carefully addressed.     

笼形团簇材料

近年来,在原子、分子和凝聚态两层次之间出现了原子团簇这一重要的学科领域。本文介绍了笼形团簇材料的国内外最新研究进展,分析了笼形团簇材料的研究现状,并对其未来的发展方向进行了展望。     

Field Static Load Test on Kao-Ping-Hsi Cable-Stayed Bridge

Field load testing is an effective method for understanding the behavior and fundamental characteristics of a cable-stayed bridge. This paper presents the results of field static load tests on the Kao-Ping-Hsi cable-stayed bridge, the longest cable-stayed bridge in Taiwan, before it was open to traffic. A total of 40 loading cases, including the unit and distributed bending and torsion loading effects, were conducted to investigate the bridge behavior. The atmospheric temperature effect on the variations of the main girder deflections was also monitored. The results of static load testing include the main girder deflections, the flexural strains of the prestressed concrete girder, and the variations of the cable forces. A three-dimensional finite-element model was developed. The results show that the bridge under the planned load test conditions has linear superposition characteristics and the analytical model shows a very good agreement with the bridge responses. Further discussion of deflection and cable forces of the design specifications for a cable-stayed bridge is also presented.