Time dependent crystal-smectic transformation in perylene-containing polyimides

The crystalline conformations of perylene polyimides (PPIs), with alkyl spacers varying in length from C₃ to C₁₂ are discussed. Although modeling of single chains would suggest the possibility that those with odd number of CH₂ groups adopt a flat helical shape, X-ray diffraction suggests that the chains with odd and even spacers have the same conformation, due to the necessity to pack the perylene units. Upon annealing, the UV-vis absorption maximum red-shifts by about 10 nm, indicating enhanced π-stacking between the perylenes. Several changes in the spectra are seen with an increase in annealing time, at a given temperature. With an increase in annealing time, X-ray diffraction patterns show changes in the number of reflections, indicative of a crystal to mesogenic transition. The time required for this transition increases with a decrease in the spacer length, and annealing temperature, suggesting that the dynamics of this transition is very slow.     

Synthesis of TiO<Subscript>2</Subscript> Hybrid Molecular Imprinted Polymer for Ethofumesate Linked by Silane Coupling Agent

TiO₂ hybrid molecular imprinted polymer (MIP) for ethofumesate using methacrylic acid (MAA) as the functional monomer and silane coupling agent 3-(trimethoxysilyl) propylmethacrylate (KH570) as organic–inorganic connective bridge was synthesized via photo-excitation method. Hydrogen bond was proved to act between MAA and ethofumesate for pre- and post-polymerization binding properties as testified by UV spectrometric method. KH570 modified TiO₂ nanoparticles were prepared via sonochemical reaction, which can accelerate hydrolysis, increase collision chance for the reactive system and improve the dispersion of the nanoparticles. Scanning electron microscope (SEM), transmission electron microscope (TEM), binding and the adsorption kinetics experiments as well as thermogravimetric analysis (TGA) were employed for characterization. The results indicated that the hybrid MIP revealed a larger surface area and more ordered imprinting cavities with improved thermal stability compared to organic-only MIP. Furthermore, faster adsorption kinetics and enhancive adsorption capacity were achieved, which made it promising in chemical sensor applications.     

Behaviors of concrete-filled steel tubular members subjected to combined loading

The present study is an investigation on the behaviors of concrete-filled thin-walled steel tubular members subjected to combined loading, such as compression and torsion, bending and torsion, compression, bending and torsion. ABAQUS software is used in this paper for the finite element analysis (FEA). A comparison of results calculated using this modeling shows generally good agreement with test results. The FEA modeling is then used to investigate the influence of important parameters that determine the ultimate strength of the composite members under combined loading, such as compression and torsion, bending and torsion, compression, bending and torsion. The parametric studies provide information for the development of formulae for calculating the ultimate strength of the composite members subjected to combined loading.     

海底管道系统失效故障树的建立及定性分析

受自然环境、管道腐蚀、第三方破坏及管理不善等因素的影响,海底管道系统在铺设及运行过程中常常会失效。文中以海底管道穿孔、凝管、断裂和设备故障等主要失效形式为顶事件建立了海底管道系统失效故障树,通过系统的定性分析得到了海底管道系统失效故障树的37个一阶最小割集,进而确定了影响海底管道系统失效的4项主要因素,并针对这些主要因素提出了相应的解决问题的措施。     

One-to-Many and Many-to-One Optical Chaos Communications Using Semiconductor Lasers

A theoretical construction of one-to-many (OTM) and many-to-one (MTO) chaos synchronization communications using semiconductor lasers is presented. One center laser provides strong injections (strong link) to other side lasers, and the side lasers also provide weak injections (weak link) to the center one. Simulation results show that the side lasers synchronize with the center laser through injection-locking. In addition, messages transmitted via the strong links or the weak links experience strong chaos pass filtering, enabling us to realize OTM and MTO communications.     

Evolving artificial neural network ensembles

Using a coordinated group of simple solvers to tackle a complex problem is not an entirely new idea. Its root could be traced back hundreds of years ago when ancient Chinese suggested a team approach to problem solving. For a long time, engineers have used the divide-and-conquer strategy to decompose a complex problem into simpler sub-problems and then solve them by a group of solvers. However, knowing the best way to divide a complex problem into simpler ones relies heavily on the available domain knowledge. It is often a manual process by an experienced engineer. There have been few automatic divide-and-conquer methods reported in the literature. Fortunately, evolutionary computation provides some of the interesting avenues to automatic divide-and-conquer methods. An in-depth study of such methods reveals that there is a deep underlying connection between evolutionary computation and ANN ensembles. Ideas in one area can be usefully transferred into another in producing effective algorithms. For example, using speciation to create and maintain diversity had inspired the development of negative correlation learning for ANN ensembles, and an in-depth study of diversity in ensembles. This paper will review some of the recent work in evolutionary approaches to designing ANN ensembles.     

基于DSP的电力数据采集平台的设计与研究

介绍了一种用于电力系统的数据采集系统.该系统采用数字信号处理器(DSP)和复杂可编程逻辑器件(CPLD)作为核心芯片,给出了主要部分的电路及其原理、功能,系统中使用CPLD实现基本逻辑,使系统有足够的冗余和灵活性,具有可靠性高、可升级等优点.     

Analyzing the performance and fairness of BitTorrent-like networks using a general fluid model

In this paper, a general fluid model is developed to study the performance and fairness of BitTorrent-like networks. The fluid model incorporates two important features previously isolated from system performance models, user settings with multiple groups and inter-group data exchange induced by the choking algorithm. Our numerical results point out some key parameters of performance, such as the staying time of seeders. Generally, selfish behavior does not receive equal performance degradation, and in some scenarios users have strong incentives of free-riding. We also find content delivery can be greatly deterred when malicious free-riders are overwhelming.     

New encapsulation development for fine pitch IC devices

The continuous reduction of chip size driven by the market demand has a significant impact on circuit design and assembly process of IC packages. Shrinking chip size and increasing I/O counts require finer bond pad pitch and bond pad size for circuitry layout. As a result, serious wire deflection during transfer molding process could make adjacent wires short, and this issue becomes more critical as a smaller wire diameter has to be applied for the finer pitch wire bonded IC devices.This paper presents a new encapsulation process development for 50 μm fine pitch plastic ball grid array package. Since reduced wire diameter decreases the bending strength of bonded wires significantly, wire deflection during molding process becomes quite serious and critical. Experiments on conventional transfer molding were conducted to evaluate wire span threshold with 23.0 μm diameter gold wire. The results show that the wire span threshold is about 4.1 mm, which is much shorter than the wire span threshold of over 5.0 mm for wire with 25.4 μm diameter. Finite element analysis shows there is a significant difference in the wire deflection between 23.0 μm gold wire and 25.4 μm gold wire diameter under the same action of mold flow. A novel encapsulation method is introduced using non-sweep solution. The wire span could be extended to over 5.0 mm with wire sweep less than 1%. Reliability tests conducted showed that all the units passed 1000 temperature cycles (−55 to 125 °C) with JEDEC moisture sensitivity level 2a (60 °C/60% relative humidity for 120 h) and 3 times reflow (peak temperature at 220–225 °C). It is believed that this solution could efficiently overcome the risk of wire short issues and improve the yield of ultra fine pitch wire bonds in high-volume production.