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91.
A coupled finite-element model, CON2D, has been developed to simulate temperature, stress, and shape development during the
continuous casting of steel, both in and below the mold. The model simulates a transverse section of the strand in generalized
plane strain as it moves down at the casting speed. It includes the effects of heat conduction, solidification, nonuniform
superheat dissipation due to turbulent fluid flow, mutual dependence of the heat transfer and shrinkage on the size of the
interfacial gap, the taper of the mold wall, and the thermal distortion of the mold. The stress model features an elastic-viscoplastic
creep constitutive equation that accounts for the different responses of the liquid, semisolid, delta-ferrite, and austenite
phases. Functions depending on temperature and composition are employed for properties such as thermal linear expansion. A
contact algorithm is used to prevent penetration of the shell into the mold wall due to the internal liquid pressure. An efficient
two-step algorithm is used to integrate these highly nonlinear equations. The model is validated with an analytical solution
for both temperature and stress in a solidifying slab. It is applied to simulate continuous casting of a 120 mm billet and
compares favorably with plant measurements of mold wall temperature, total heat removal, and shell thickness, including thinning
of the corner. The model is ready to investigate issues in continuous casting such as mold taper optimization, minimum shell
thickness to avoid breakouts, and maximum casting speed to avoid hot-tear crack formation due to submold bulging. 相似文献
92.
Jokerst N.M. Gaylord T.K. Glytsis E. Brooke M.A. Cho S. Nonaka T. Suzuki T. Geddis D.L. Shin J. Villalaz R. Hall J. Chellapa A. Vrazel M. 《Advanced Packaging, IEEE Transactions on》2004,27(2):376-385
This paper explores design options for planar optical interconnections integrated onto boards, discusses fabrication options for both beam turning and embedded interconnections to optoelectronic devices, describes integration processes for creating embedded planar optical interconnections, and discusses measurement results for a number of integration schemes that have been demonstrated by the authors. In the area of optical interconnections with beams coupled to and from the board, the topics covered include integrated metal-coated polymer mirrors and volume holographic gratings for optical beam turning perpendicular to the board. Optical interconnections that utilize active thin film (approximately 1-5 /spl mu/m thick) optoelectronic components embedded in the board are also discussed, using both Si and high temperature FR-4 substrates. Both direct and evanescent coupling of optical signals into and out of the waveguide are discussed using embedded optical lasers and photodetectors. 相似文献
93.
94.
介绍了一种新的探测雷达最小作用距离的方法,打破了传统的最小跟踪距离受发射脉宽局限的限制,重点介绍对发射线性调频信号的雷达的近距离探测方法,并给出了仿真计算结果。 相似文献
95.
96.
Kee S. Moon M. Levy Yong K. Hong H. Bakhru S. Bakhru 《Ferroelectrics Letters Section》2003,30(3):47-57
Advances in the fabrication of solid-solution single crystal relaxor ferroelectrics have made it possible to produce highly efficient piezoelectric crystals, and have attracted renewed interest in the use of these crystals for a new generation of piezoelectric transducers, actuators and sensors. Of particular interest is their incorporation into micro-electromechanical systems (MEMS). In this paper we report on the laser-induced wet chemical etching of lead zinc niobate-lead titanate (PZN-PT) in hydrochloric acid (HCl). Argon-ion laser radiation at power levels up to 4 W is focused to a spot diameter of about 15μm and results in the chemical etching of grooves at patterning speeds up to 5μm/sec. Crystal ion slicing, an ion-implant-based film separation technique, is used in combination with laser etching to form 5 to 10μm-thick patterned and freestanding films for incorporation into micro-electromechanical devices. 相似文献
97.
Atsushi Narumi Kosei Kawasaki Harumi Kaga Toshifumi Satoh Naoya Sugimoto Toyoji Kakuchi 《Polymer Bulletin》2003,49(6):405-410
Summary
The potato phosphorylase-catalyzed polymerization of α-D-glucose-1-phosphate (G-1-P) onto poly[styrene-block-(4-vinylbenzyl maltohexaoside)] (1) was performed at the molar ratios of [G-l-P]0 and [maltohexaose]0 of 35, 80, and 250. The product was found to be soluble in dimethyl sulfoxide, which was a good solvent for amylose, and
showed the complex-formation with iodine, indicating that the product was assignable to poly[styrene-block-(styrene-graft-amylose)] (2). The quantitative analysis of the liberated phosphoric acid gave the average degree of polymerization o f the glucose unit
(n) as 27, 5 1, and 180 for 2-I, 2-II, and 2-III, respectively.
Received: 29 November 2002/Accepted: 22 December 2002
Correspondence to Toyoji Kakuchi 相似文献
98.
From its foundation until 2004, ETRI has registered over 1,000 US patents. This letter analyzes the characteristics of these patents and addresses the explanatory factors affecting their citation counts. For explanatory variables, research team related variables, invention specific variables, and geographical domain related variables are suggested. Zero‐altered count data models are used to test the impact of independent variables. A key finding is that technological cumulativeness, the scale of invention, outputs in the electronic field, and the degree of dependence on the US technology domain positively affect the citation counts of ETRI‐invented US patents. The magnitude of international presence appears to negatively affect the citation counts of ETRI‐invented US patents. 相似文献
99.
100.