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81.
The Sn–3.5 wt%Ag alloy considered as a good alternative to Pb–Sn alloys. This study aims to investigate the effects of Cu or Sb additions by 3 or 5 wt% to melt-spun Sn–3.5%Ag alloy. Ternary melt-spun Sn–Ag–Cu and Sn–Ag–Sb alloys investigated using X-ray diffractions (XRD), Scanning electron microscope (SEM), Dynamic resonance technique (DRT), Instron machine, Vickers hardness tester and Differential scanning calorimetry (DSC). The results revealed that the microstructures of the β-Sn phase, Ag3Sn and Cu3Sn intermetallic compounds (IMCs) in the solder matrices were refined due to the effect of Cu additions and melt-spun process. Moreover, increasing Cu content promotes Ag3Sn intermetallic compound (IMC) formation. Consequently, the addition of “3 wt%” of Cu reduced the creep rate ? from (3.79?×?10?3) to (1.65?×?10?3) and delayed the fracture point. The tensile results showed an improvement in Young’s modulus by 47% (30.3 GPa), ultimate tensile strength (UST) by 11.6% (23.9 MPa), and in toughness by 20.5% (952.32 J/m3) compared to the eutectic Sn–Ag alloy. Vickers hardness has improved by 3.3% (136.71 MPa) and thermal activation energy by 54% (90.40 KJ/mol) when compared with that of eutectic Sn–Ag alloy. Those improvements are related to the lack of lattice strain from 7.56?×?10?4 without “3 wt%” of Cu to 5.26?×?10?4 with “3 wt%” of Cu. Its melting temperature (Tm) increased by 3 °C due to Ag3Sn IMC increased and Cu3Sn formation, but the pasty rang (mushy zone) decreased by 4 °C with “3 wt%” of Cu. The small lattice strains resulted with “3 wt%” of Cu made the electrical resistivity of this alloy more stable at elevated temperatures. The mechanical, thermal and electrical improvements of Sn93.5–Ag3.5–Cu3 alloy provide good physical performance for soldering process and electronic assembly.  相似文献   
82.
In this paper, we considered the Length-biased weighted Lomax distribution and constructed new acceptance sampling plans (ASPs) where the life test is assumed to be truncated at a pre-assigned time. For the new suggested ASPs, the tables of the minimum samples sizes needed to assert a specific mean life of the test units are obtained. In addition, the values of the corresponding operating characteristic function and the associated producer’s risks are calculated. Analyses of two real data sets are presented to investigate the applicability of the proposed acceptance sampling plans; one data set contains the first failure of 20 small electric carts, and the other data set contains the failure times of the air conditioning system of an airplane. Comparisons are made between the proposed acceptance sampling plans and some existing acceptance sampling plans considered in this study based on the minimum sample sizes. It is observed that the samples sizes based on the proposed acceptance sampling plans are less than their competitors considered in this study. The suggested acceptance sampling plans are recommended for practitioners in the field.  相似文献   
83.
Wireless Personal Communications - In most scenarios of wireless sensor networks (WSNs), different traffic types have specific service requirements. None of the previous MAC schemes has been able...  相似文献   
84.
We propose a novel hybrid model that exploits the strength of discriminative classifiers along with the representation power of generative models. Our focus is on detecting multimodal events in time varying sequences as well as generating missing data in any of the modalities. Discriminative classifiers have been shown to achieve higher performances than the corresponding generative likelihood-based classifiers. On the other hand, generative models learn a rich informative space which allows for data generation and joint feature representation that discriminative models lack. We propose a new model that jointly optimizes the representation space using a hybrid energy function. We employ a Restricted Boltzmann Machines (RBMs) based model to learn a shared representation across multiple modalities with time varying data. The Conditional RBMs (CRBMs) is an extension of the RBM model that takes into account short term temporal phenomena. The hybrid model involves augmenting CRBMs with a discriminative component for classification. For these purposes we propose a novel Multimodal Discriminative CRBMs (MMDCRBMs) model. First, we train the MMDCRBMs model using labeled data by training each modality, followed by training a fusion layer. Second, we exploit the generative capability of MMDCRBMs to activate the trained model so as to generate the lower-level data corresponding to the specific label that closely matches the actual input data. We evaluate our approach on ChaLearn dataset, audio-mocap, as well as the Tower Game dataset, mocap-mocap as well as three multimodal toy datasets. We report classification accuracy, generation accuracy, and localization accuracy and demonstrate its superiority compared to the state-of-the-art methods.  相似文献   
85.
The filtered orthogonal frequency division multiplexing (F-OFDM) system has been recommended as a waveform candidate for fifth-generation (5G) communications. The suppression of out-of-band emission (OOBE) and asynchronous transmission are the distinctive features of the filtering-based waveform frameworks. Meanwhile, the high peak-to-average power ratio (PAPR) is still a challenge for the new waveform candidates. Partial transmit sequence (PTS) is an effective technique for mitigating the trend of high PAPR in multicarrier systems. In this study, the PTS technique is employed to reduce the high PAPR value of an F-OFDM system. Then, this system is compared with the OFDM system. In addition, the other related parameters such as frequency localization, bit error rate (BER), and computational complexity are evaluated and analyzed for both systems with and without PTS. The simulation results indicate that the F-OFDM based on PTS achieves higher levels of PAPR, BER, and OOBE performances compared with OFDM. Moreover, the BER performance of F-OFDM is uninfluenced by the use of the PTS technique.  相似文献   
86.
Diazotized aryl amines were coupled with 2-aminothiazoles 1 and 2 to give the corresponding thiazolylazo dyes 3 and 4, respectively. 2-Amino-5-arylazothiazoles 5 reacted with chloroacetyl chloride to afford the chloro-acetamide derivatives 6 which further reacted with 2-mercaptobenzothiazole to furnish a new series of 5-arylazothiazolyl dyes 7. The azo structure of the dyes (rather than the tautomeric hydrazo structure) was assessed by ab initio DFT calculations at the B3LYP/6-31G* level. These dyes were applied to polyester fabric as disperse dyes and their fastness properties were evaluated.  相似文献   
87.
The stable Euler-number-based image binarization has been shown to give excellent visual results for images containing high amount of image noise. Being computationally expensive, its applications are limited mostly to general-purpose processors and in application specific integrated circuits. In this paper a modified stable Euler-number-based algorithm for image binarization is proposed and its real-time hardware implementation in a Field Programmable Gate Array with a pipelined architecture is presented. The proposed modifications to the algorithm facilitate hardware implementation. The end result is a design that out-performs known software implementations. The amount of noisy pixels introduced during the binarization process is also minimized. Despite the stable Euler-number-based image binarization being computationally expensive, our simulations show that the proposed architecture gives accurate results and this in real time and without consuming all chip resources.  相似文献   
88.
This article aims to reduce the melting temperature of lead-free solder alloy and promote its mechanical properties. Eutectic tin-silver lead-free solder has a high melting temperature 221 °C used for electronic component soldering. This melting temperature, higher than that of lead–tin conventional eutectic solder, is about 183 °C. The effect of the melt spinning process and copper additions into eutectic Sn-Ag solder enhances the crystallite size to about 47.92 nm which leads to a decrease in the melting point to about 214.70 °C, where the reflow process for low heat-resistant components on print circuit boards needs lower melting point solder. The results showed the presence of intermetallic compound Ag3Sn formed in nano-scale at the Sn-3.5Ag alloy due to short time solidification. The presence of new intermetallic compound, IMC from Ag0.8Sn0.2 and Ag phase improves the mechanical properties, and then enhances the micro-creep resistance especially at Sn-3.5Ag-0.7Cu. The higher Young’s modulus of Sn-3.5Ag-0.5Cu alloy 55.356 GPa could be attributed to uniform distribution of eutectic phases. Disappearance of tin whiskers in most of the lead-free melt-spun alloys indicates reduction of the internal stresses. The stress exponent (n) values for all prepared alloys were from 4.6 to 5.9, this indicates to climb deformation mechanism. We recommend that the Sn95.7-Ag3.5-Cu0.7 alloy has suitable mechanical properties, low internal friction 0.069, low pasty range 21.7 °C and low melting point 214.70 °C suitable for step soldering applications.  相似文献   
89.
This work reports the photodeposition of Ag nanoparticles onto mesoporous TiO2 (m-TiO2) pre-formed by the evaporation-induced self-assembly method. Photoanodes of Ag/m-TiO2 assembled by electrophoretic disclose a superior photoelectrochemical (PEC) performance for water oxidation reaction related to m-TiO2. The photoanodes physicochemical investigations witness the even arrangement of m-TiO2 nanospheres particles over the substrates. The PEC study displays a steady photocurrent density of 1 mAcm?2 at ?1.0 V vs SCE was attained for Ag/m-TiO2 photoanodes in visible light illumination and it is nearly twofold enhancements in comparison with m-TiO2 photoanodes. The observed superior PEC nature was attributed to the reduced band-gap energy and charge recombination that caused from the incorporation of plasmonic photodeposited Ag nanoparticles on m-TiO2 nanospheres photoanodes.  相似文献   
90.
In the current research, a highly controllable system operating at low temperatures and for short reaction times is employed for the surface sulfonation of low‐density polyethylene. This system provides the advantages of short reaction times and low reaction temperatures, as compared with previous methods of surface sulfonation. Low‐density polyethylene films were sulfonated at 40°C for time periods ranging from 5 to 30 min. Subsequently, all films were analyzed by SEM, EDX, horizontal ATR–FTIR, surface roughness, and dynamic contact‐angle measurements. Sulfonation was effected at all reaction times. The degree of surface sulfonation increased through 10 min and reached a maximum between 10‐ and 30‐min reaction times with concomitant changes in the physicochemical properties of the material. At 30 min, the film topography changed substantially, indicating that sulfonation was no longer limited to a strictly surface reaction. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 76: 1865–1869, 2000  相似文献   
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