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51.
Quasi-static stress fields for a crack inclined to the property gradation in functionally graded materials 总被引:3,自引:0,他引:3
Summary. Quasi-static stress fields for a crack inclined to the direction of property gradation in functionally graded materials (FGMs)
are obtained through an asymptotic analysis coupled with Westergaard's stress function approach. The elastic modulus of the
FGM is assumed to vary exponentially along the gradation direction. The mode mixity due to the inclination of the property
gradient is accommodated in the analysis through superposition of opening and shear modes. The first four terms in the expansion
of the stress field are derived to explicitly bring out the influence of nonhomogeneity on the structure of the stress field.
Using these stress field contours of constant maximum shear stress, constant maximum principal stress, constant first stress
invariant and constant out of plane displacement are generated, and the effect of inclination of the property gradation direction
on these contours is discussed.
Received September 22, 2002
Published online: May 20, 2003
The financial support of National Science Foundation (NSF) under grant no. CMS 99000138 is gratefully acknowledged. 相似文献
52.
We have studied the effect of thermal treatment in vacuum on the optical transmission of 6H-SiC samples with a porous layer on the Si face in the visible and near infrared spectral range. An analysis of changes in the absorption coefficient shows that the process of graphitization begins at a temperature below 70°C. 相似文献
53.
Relevance of coupling effects on DRA array design 总被引:1,自引:0,他引:1
Gentili G.B. Morini M. Selleri S. 《Antennas and Propagation, IEEE Transactions on》2003,51(3):399-404
A finite-difference time-domain (FDTD) approach is proposed in order to obtain suitable criteria for the design of a four-element dielectric resonator antenna (DRA) array. The numerical analysis is focused on the study of the electromagnetic coupling phenomena arising between DRA fed by a microstrip-slot transition. Scattering parameters behavior and radiation patterns are determined by taking advantage of the geometrical symmetry of the structure, analyzing only one half or one quarter of the entire domain through two or four separate FDTD runs. 相似文献
54.
Sethuraman B.A. Rajan B.S. Shashidhar V. 《IEEE transactions on information theory / Professional Technical Group on Information Theory》2003,49(10):2596-2616
We present some general techniques for constructing full-rank, minimal-delay, rate at least one space-time block codes (STBCs) over a variety of signal sets for arbitrary number of transmit antennas using commutative division algebras (field extensions) as well as using noncommutative division algebras of the rational field /spl Qopf/ embedded in matrix rings. The first half of the paper deals with constructions using field extensions of /spl Qopf/. Working with cyclotomic field extensions, we construct several families of STBCs over a wide range of signal sets that are of full rank, minimal delay, and rate at least one appropriate for any number of transmit antennas. We study the coding gain and capacity of these codes. Using transcendental extensions we construct arbitrary rate codes that are full rank for arbitrary number of antennas. We also present a method of constructing STBCs using noncyclotomic field extensions. In the later half of the paper, we discuss two ways of embedding noncommutative division algebras into matrices: left regular representation, and representation over maximal cyclic subfields. The 4/spl times/4 real orthogonal design is obtained by the left regular representation of quaternions. Alamouti's (1998) code is just a special case of the construction using representation over maximal cyclic subfields and we observe certain algebraic uniqueness characteristics of it. Also, we discuss a general principle for constructing cyclic division algebras using the nth root of a transcendental element and study the capacity of the STBCs obtained from this construction. Another family of cyclic division algebras discovered by Brauer (1933) is discussed and several examples of STBCs derived from each of these constructions are presented. 相似文献
55.
High-efficiency LEDs of 1.6–2.4 µm spectral range for medical diagnostics and environment monitoring
N. D. Stoyanov B. E. Zhurtanov A. P. Astakhova A. N. Imenkov Yu. P. Yakovlev 《Semiconductors》2003,37(8):971-984
High efficient LED structures covering the spectral range of 1.6–2.4 μm have been developed on the basis of GaSb and its solid
solutions. The electroluminescent characteristics and their temperature and current dependences have been studied. The radiative
and nonradiative recombination mechanisms and their effect on the quantum efficiency have been investigated. A quantum efficiency
of 40–60% has been obtained in the quasi-steady mode at room temperature. A short-pulse optical power of 170 mW was reached.
__________
Translated from Fizika i Tekhnika Poluprovodnikov, Vol. 37, No. 8, 2003, pp. 996–1009.
Original Russian Text Copyright ? 2003 by Stoyanov, Zhurtanov, Astakhova, Imenkov, Yakovlev. 相似文献
56.
Several kinds of waveguide components such as curved waveguide bends, arbitrary angle waveguide bends and T-junctions have been analyzed with boundary element method in this paper. A new discretization method for the boundary element method to solve the waveguide discontinuities has been given. The numerical results obtained agree well with the experimental results and numerical results in other literature. Especially, the scattering characteristics of Forded E-, H-plane T-junctions in 3mm band have been analyzed using boundary element method and the calculation results are presented. 相似文献
57.
Chong D. Y. R. Lim B. K. Rebibis K. J. Pan S. J. Sivalingam K. Kapoor R. Sun A. Y. S. Tan H. B. 《Advanced Packaging, IEEE Transactions on》2006,29(4):674-682
The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported 相似文献
58.
This paper presents a brief overview of recent approaches to two problems in music information retrieval: query by example and automated source separation. It describes the challenges inherent in musical query by example and the systems that take very different approaches to the problem. The paper also explores approaches to source separation in a musical context, focusing on systems that take distinct approaches to the problem. Finally, it comments about the future directions for digital signal processing (DSP) research in the context of music information retrieval. 相似文献
59.
M. J. O’Sullivan C. G. Walker M. L. O’Sullivan T. D. Thompson A. B. Philpott 《Telecommunication Systems》2006,33(4):353-376
The problem of designing fibre-optic networks for local-access telecommunications generates (at least) three non-trivial subproblems.
In the first of these subproblems one must determine how many fibre-optic cables (fibres) are required at either end of a
street. In the next subproblem a minimum-cost network must be designed to support the fibres. The network must also provide
distinct paths from either end of the street to the central exchange(s). Finally, the fibre-optic cables must be placed in
protective covers. These covers are available in a number of different sizes, allowing some flexibility when covering each
section of the network. In this paper we describe a dynamic programming (DP) formulation for finding a minimum-cost (protective)
covering for the network (the third of the subproblems). This problem is a generalised set covering problem with side constraints
and is further complicated by the introduction of fixed and variable welding costs. The DP formulation selects covers along
each arc (in the network), but cannot exactly model the fixed costs and so does not guarantee optimality. We also describe
an integer programming (IP) formulation for assessing the quality of the DP solutions. The cost of the networks constructed
by the IP model is less than those designed using the DP model, but the saving is not significant for the problems examined
(less than 0.1%). This indicates that the DP model will generally give very good solutions. Furthermore, as the problem dimensions
grow, DP gives significantly better solution times than IP. 相似文献
60.
Nonlinear dynamics of crack propagation are investigated experimentally and theoretically with the goal of clarifying the nature of limiting crack velocity, the transition from steady state to branching regimes of crack dynamics, and the dynamics of crack arrest. The theoretical explanation of limiting steady-state crack velocity and the transition to a branching regime was proposed due to the study of collective behavior of a microcrack ensemble at the crack tip area. The experimental study of crack dynamics was carried out in a preloaded plate PMMA specimen using the high-speed camera coupled with the photo-elasticity method, the point stress recording with a laser system, and the failure surface roughness measurement. 相似文献