全封闭Ar气保护电渣重熔GH4169合金

上海五钢采用ALD 5t全封闭Ar气保护电渣重熔炉 ESR(Ar)冶炼了GH4 16 9合金锭 ,分析结果表明 ,ESR(Ar)电渣锭氧、硫含量和锭头尾碳、铝、钛之差远低于一般ESR工艺 ;VIM(真空感应熔炼 ) +ESR(Ar)工艺冶炼合金中平均氧含量 6× 10 - 6 远低于VIM +VAR(真空电弧重熔 )工艺冶炼合金中平均氧含量 13× 10 - 6 ,所以ESR(Ar)工艺脱氧效果优于VAR工艺     

使用地热能的吸收式制冷系统

吸收式制冷系统可以利用低品位的热源来制冷，相对于常见的蒸汽压缩式制冷系统而言在这方面具有优势。我国是一个地热资源很丰富的国家，为了充分利用这一资源，我们有必要对以地热为热源的吸收式制冷系统进行研究。本文着重分析了使用地热资源的溴化锂吸收式制冷系统。     

汽车空调制冷系统中应用R407C的分析

本文对混合工质R407C与R12的物理和热力性质进行了比较分析，并针对汽车空调制冷系统的特点，对两种工质在变工况下进行了制冷系统的理论循环分析，阐明了在汽车空调制冷系统中使用R407C的可行性。     

Metal micromolding: further experiments and preliminary finite element analysis

We report results of instrumented microscale compression molding experiments on Al with Ta mold inserts. The Ta inserts have high-aspect-ratio microscale structures fabricated by micro-electrical-discharge-machining. These microscale structures were further surface engineered by electrochemical polishing, followed by deposition of a conformal amorphous hydrogenated carbon based coating. The molding response of Al, in terms of molding force versus insert displacement, was measured in situ with a high-vacuum, instrumented, compression molding apparatus, and rationalized with a simple model on the mechanics of molding. Molding response was further studied numerically through finite element analysis.     

玻璃与金属封接用杜美丝

利用ＡＥＳ、ＷＤＳ和ｘ－射线衍射等方法，研究了杜美丝表面层、铁镍芯与覆铜层界面的微观结构与特性。结果表明：良好的表面层应由Ｃｕ２Ｏ和非晶态的硼砂构成；玻璃与杜美丝的润湿性决定于表面层的净化程度和构成及加热条件。     

On modeling the design of cellular manufacturing systems

A new optimization model is discussed for the design of cellular manufacturing systems. It is based on an integer programming formulation that updates some other models by eliminating redundant machine assignment and cost coefficients dependent on cell configuration. To reduce computational burdens, a simplified integer programming model and a decomposition algorithm are proposed. Several computer solutions were performed to evaluate the performance of the new model. The computational results are discussed.     

Cr/SiO_2界面还原反应研究

利用俄歇电子能谱研究了Cr／SiO2薄膜在热处理过程中的界面扩散反应机理、界面反应动力学过程及界面反应产物。研究结果表明，Cr／SiO2体系的界面还原反应主要是Cr与SiO2的反应，其还原反应产物是CrSix和Cr2O3物种。界面还原反应的速度与反应时间的平方根成正比，其界面还原反应过程受Cr向SiO2层的扩散过程所控制，界面还原反应的表观活化能为72．5kJ／mol（约0．75eV）。