A unified diode model for circuit simulation

A new commercially available diode model is described. This unified model is capable of simulating the widest range of diode technologies of any presently available. The emphasis of this paper is on describing the model's extensive features and flexibility in the different domains of operation and is of particular interest in power applications     

E-kernel: an embedding kernel on the IBM victor V256 multiprocessorfor program mapping and network reconfiguration

We present the design of E-kernel, an embedding kernel on the Victor V256 message-passing partitionable multiprocessor, developed for the support of program mapping and network reconfiguration. E-kernel supports the embedding of a new network topology onto Victor's 2D mesh and also the embedding of a task graph onto the 2D mesh network or the reconfigured network. In the current implementation, the reconfigured network can be a line or an even-size ring, and the task graphs meshes or tori of a variety of dimensions and shapes or graphs with similar topologies. For application programs having these task graph topologies and that are designed according to the communication model of E-kernel, they can be run without any change on partitions connected by the 2D mesh, line, or ring. Further, E-kernel attempts the communication optimization of these programs on the different networks automatically, thus making both the network topology and the communication optimization attempt completely transparent to the application programs. Many of the embeddings used in E-kernel are optimal or asymptotically optimal (with respect to minimum dilation cost). The implementation of E-kernel translated some of the many theoretical results in graph embeddings into practical tools for program mapping and network reconfiguration in a parallel system. E-kernel is functional on Victor V256. Measurements of E-kernel's performance on V256 are also included     

Deformation and fracture of glass bead/ CTBN-rubber/epoxy composites

Carboxyl-terminated butadiene-acrylonitrile-rubber decreases modulus and yield stress of the studied epoxy but increases fracture toughness. The addition of glass bead compensates for the loss in modulus but has little effect on yield stress. However, it significantly contributes to the fracture toughness by providing additional mechanisms for toughening of both the unmodified and rubber-modified epoxy. For the toughened epoxies studied, fracture surfaces gave only limited information on fracture mechanisms since significant energy absorption also occurs in the material below the fracture surface. Suggestions for suitable material compositions for fiber composite matrices are given.