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991.
992.
An attempt has been made to review and study the effect of anions (phosphate, sulfate and fluoride) on titania-silica samples. A comparative study has been made on structural characteristics and physico-chemical properties between the unmodified and anion modified titania-silica mixed oxides. The stabilisations of phase, porosity and sulphate ion at higher activation temperatures are discussed. The increase and decrease of specific surface area, acid strength and surface acid sites with respect to anions are emphasised. The effect of preparation method and conditions with specific surface area, porosity and surface acid sites are also discussed. The generation of new catalytic active sites and effect of porosity are reported towards esterification of acetic acid and mono-nitration of toluene, respectively.  相似文献   
993.
994.
New sulphides of transition metal ions [M+n = Cu+1, Cu+2 and Zn+2] have been synthesised in sunlight. XRD patterns show that these compounds are not MxSy but are mercaptyl, hydroxyl metal sulphides [M(SH)(OH)(H2O)2] which is further ascertained by I.R. spectra showing bands due to T d-symmetry. ESCA of compound of copper in solid state shows presence of Cu1+ and Cu2+ ion. The presence of hydroxyl, mercaptyl, aqua and S–2 groups has finally been confirmed with TGA, DTA and ESCA. Conductivity and Seebeck coefficient measurements show that compound of copper is p-type semiconductor and compound of zinc is n-type semiconductor. The production of these low cost materials opens an interesting area of research and development for their use in solar cell devices.  相似文献   
995.
Hydrogen gas pick-up mechanism of Al-alloy melt during Lost Foam Casting   总被引:1,自引:0,他引:1  
The hydrogen gas pick-up problem that can occur during Lost Foam Casting was investigated with reduced pressure tests and real castings.The initial hydrogen concentration of the melt and the contact time between melt and polystyrene had a main effect on the hydrogen gas pick-up of Al melt. The hydrogen gas pick-up of Al alloy depended also on pouring temperature and a proper metal front temperature gave the minimum hydrogen pick-up. At a low pouring temperature, the hydrogen went into the melt mainly from entrapped liquid product of polystyrene but at high pouring temperature it was by the gas as well as the liquid product. The mold flask evacuation down to 710 torr decreased the gas porosity down by around 0.4 vol%. The permeability of coating thickness had a great effect because it affects the filling time and the easy removal of liquid polystyrene.  相似文献   
996.
997.
998.
We summarize a continuing investigation into using ion implantation to alter the transition temperature of superconducting thin films. The primary motivation for the work presented here was to study the feasibility of using magnetic ion doping to replace the bi-layer Tc control process currently used for certain cryogenic detector applications at National Institute for Standards and Technology. The results from work with various ion species implanted into aluminum, molybdenum, titanium and tungsten host films are presented.  相似文献   
999.
NdMCr2O5 (M = Na, K, Cs) and NdMgCr2O5.5 are prepared by solid-state reactions between appropriate oxides and carbonates and are shown to have a tetragonal structure. The heat capacity of these chromites, measured from 298.15 to 673 K, exhibits sharp changes attributable to second-order phase transitions. The C p 0(T) data are represented by quadratic best fit equations. The electrical resistivity of the chromites is measured between 303 and 493 K. The results attest to semiconducting behavior of the materials in certain temperature ranges.  相似文献   
1000.
The effect of the composition of sensitizing–activating solutions on the activation efficiency and the chemical coppering of diamond powders is studied. The results demonstrate that stabilizing additives improve the stability of the solutions, influence the average coppering rate, and play a key role in determining the morphology and quality of the resultant coatings. The most effective stabilizing additive is synthamid-10, which ensures the deposition of high-quality copper coatings.  相似文献   
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