超声冲击诱发表面纳米化及其对表面完整性的影响

采用不同超声冲击参数处理SMA490BW钢,研究了冲击后试样在低、高倍下的微观组织特征、残余应力及硬度分布等表面完整性能的变化。实验结果表明,经过超声冲击表面处理后,样品表面层晶粒细化为纳米晶,平均晶粒尺寸约为30nm;并在试样表层引入残余压应力,数值最大约为255.5MPa;超声冲击对SMA490BW钢表面能够起到明显的强化作用,与未经处理的试样相比,处理后试样表面硬度最大提高了约66.7%。超声冲击强化处理改善SMA490BW钢的表面完整性的效果与冲击电流、冲击时间之间的关系不遵循单调变化规律,超声冲击参数为20min/1.5A时,试样具有较好的表面完整性,冲击影响层深度约为320μm。     

Preliminary Study on Quantitative Research Methods of Discussion-based Teaching: CAD/CAM Course

Computer-aided design and manufacturing,or CAD/CAM,in a narrow sense,is the use of a computer for component design and machining. As a specialized course for students,CAD/CAM course is a required course for undergraduates majoring in mechanical engineering and related engineering majors and also the core technical skills to be mastered during the undergraduate study. Based on the teaching practices of CAD/CAM course,this paper tries to introduce the discussion-based method in curriculum design and the implementation of the course,and enhance the interaction between teachers and students through using new information interaction tools such as We Chat group and course homepage to stimulate students' interest,and also expand the learning space and time. Thus,the problems students have will be solved in real time. In this study,for the first time,the statistical methods are used to record detailed the speaking time,keywords and the frequency of teachers and students' interaction,and also carries out quantitative analysis in order to explore the interactive patterns between teacher and students in discussion-based teaching,so as to improve communication and learning efficiency between teacher and students. Meanwhile,this paper also discussed the advantages and the disadvantages of using discussion-based teaching in the hope that it can provide reference for the following discussion-based teaching of CAD/CAM course in mechanical or related engineering majors.     

Aggregation-induced emission luminogen-assisted stimulated emission depletion nanoscopy for super-resolution mitochondrial visualization in live cells

Nano Research - Aggregation-induced emission luminogens (AIEgens) are fluorescent agents that are ideal for bioimaging and have been widely used for organelle targeting, cellular mapping, and...     

Monitored high-dose azathioprine treatment reduces acute rejection episodes after renal transplantation

A novel complex mutation consisting of a small deletion/insertion (3958del5ins4) was found in the breast cancer-1 gene (BRCA-1) in three unrelated French breast and/or ovarian cancer families. These mutations occurred at the same nucleotide position of the 3' end of exon 11. The wild-type sequence, CTCAG, was deleted and replaced by AGGC in the three families. The consequence is the generation of a stop codon, TAG, resulting in a truncated protein. We propose two different mechanisms to explain the generation of this complex mutation: (i) the simultaneous occurrence of a deletion and an insertion in a stem-loop structure and (ii) the abortive integration of a human transposable element (Tigger 1) that deleted 5 nucleotides and inserted a 4-nucleotide "scar", corresponding to the 5' extremity of the transposon.     

基于无线网络技术的燃气集抄系统设计

针对燃气行业人工抄表费时费力等问题,提出一种基于GPRS和无线多跳网络技术的燃气无线抄表系统,在分析传统抄表系统的结构以及传输方式优缺点的基础上介绍了系统的总体结构、工作原理以及各部分组成和功能。采用计算机网络和数据库等技术,使得该系统具有功能强大、使用方便、可扩展性好等特点,可实现对整个燃气输配系统的监控,有效提高燃气公司的管理水平和服务效率。     

CAN总线网络测试研究

介绍了CAN总线网络开发方法,搭建了CAN总线集成开发测试环境,对实际网络进行了测试,给出了位定时参数计算方法,比较了不同模拟终端电阻下的总线的报文正确率和总线负载率等性能指标.     

三维面心立方网格下的直线生成算法

以菱形十二面体为体素构成的三维面心立方(Face-Centered Cubic,FCC)网格是六角网格在三维的一种推广,直线生成算法在三维图形和图像应用中是一个非常重要和基础的算法.文中首先研究了二维六角网格下基于附属菱形空间的直线生成算法,然后将其推广至三维FCC网格,得到了一种FCC网格下的直线生成算法,该算法在三维方形网格下的Bresenham算法的基础上,利用附属平行六面体空间的平行六面体与FCC网格空间的体素之间的一一对应关系生成直线.该算法应用简单的判断公式,一步最多可生成3个体素,且只涉及到整数运算,因而没有累计误差.     

略谈平面设计中的触觉体验

本文通过对触觉设计这一设计理念的论述,探讨材质在平面设计中的表现以及如何在平面设计中合理的运用触觉感受来传达信息,提高设计品质。     

A new strategy for defect inspection by the virtual inspection in semiconductor wafer fabrication

The defect of process equipments is a major factor that impairs the yields in the mass production of semiconductor wafer fabrication and it is a main supervision means to use high-resolution defect inspection tools to detect and monitor the defect damage. Due to the high investment costs of these inspection tools and the resulting decrease in the throughput, how to improve the sampling rate is an important issue for the associated inspection strategy. This paper proposes a new concept and implementation of virtual inspection (VI) to enhance the detection and monitoring of defect in semiconductor production process. The underlying theory of the VI concept is that the state variables identifications (SVIDs) of process equipments can reflect the process quality effectively and loyally. The approach of VI is to combine the application of the fault detection and classification (FDC), and the defect library and the re-engineering of inspection procedure to reach the full-scope of strategic objective. VI enables the defect monitoring to enter a new era by promoting the monitoring level of defect inspection from the previous lot-sampling basis to the wafer-sampling level, and hence upgrades the sampling strategy from random-sampling to full and right-sampling. In this study, various typical defect cases are utilized to illustrate how to create VI models and verify the reliability of the proposed approach. Furthermore, a feasible architecture of the VI implementation for mass production in semiconductor factory is presented in the paper.