On high explosive launching of projectiles for shock physics experiments

The hydrodynamic operation of the "Forest Flyer" type of explosive launching system for shock physics projectiles was investigated in detail using one and two dimensional continuum dynamics simulations. The simulations were numerically converged and insensitive to uncertainties in the material properties; they reproduced the speed of the projectile and the shape of its rear surface. The most commonly used variant, with an Al alloy case, was predicted to produce a slightly curved projectile, subjected to some shock heating and likely exhibiting some porosity from tensile damage. The curvature is caused by a shock reflected from the case; tensile damage is caused by the interaction of the Taylor wave pressure profile from the detonation wave with the free surface of the projectile. The simulations gave only an indication of tensile damage in the projectile, as damage is not understood well enough for predictions in this loading regime. The flatness can be improved by using a case of lower shock impedance, such as polymethyl methacrylate. High-impedance cases, including Al alloys but with denser materials improving the launching efficiency, can be used if designed according to the physics of oblique shock reflection, which indicates an appropriate case taper for any combination of explosive and case material. The tensile stress induced in the projectile depends on the relative thickness of the explosive, expansion gap, and projectile. The thinner the projectile with respect to the explosive, the smaller the tensile stress. Thus if the explosive is initiated with a plane wave lens, the tensile stress is lower than that for initiation with multiple detonators over a plane. The previous plane wave lens designs did, however, induce a tensile stress close to the spall strength of the projectile. The tensile stress can be reduced by changes in the component thicknesses. Experiments verifying the operation of explosively launched projectiles should attempt to measure porosity induced in the projectile: arrival time measurements are likely to be insensitive to porous regions caused by damaged or recollected material.     

Monolithic heteroepitaxial PbTe-on-Si infrared focal plane arraywith 96×128 pixels

A two-dimensional (2-D) infrared focal plane array in a heteroepitaxial narrow gap semiconductor layer has been realized for the first time on a Si substrate containing the read-out electronics. The infrared-sensitive layer (PbTe for the 3-5 μm wavelength range) is grown by molecular beam epitaxy at temperatures below 415°C, allowing fully processed and tested Si chips to be employed. Individual pixels are obtained by mesa-etching, and photovoltaic sensors are fabricated with standard photolithographic techniques. Within the >97% operational pixels, high quantum efficiencies and differential resistances at zero bias up to several 100 kΩ at 95 K are observed