从ACM／ICPC看计算机算法设计教学改革

美国计算机协会（ACM）国际大学生程序设计竞赛是全球大学生计算机程序能力竞赛活动中最有影响力的一项赛事。通过参加ACM活动可以对计算机专业学生的算法设计教学起到极大的促进作用。     

新型的Sol-gel法制备Ba0.6Sr0.4TiO3铁电陶瓷

采用新型的Sol-gel工艺制备了Ba0.6Sr0.4TiO3(BST)超细粉体,将BST粉体进行压制和烧结,获得了晶粒尺寸在1μm以内的BST陶瓷块体.观察了BST陶瓷块体的结晶情况并测定了其电学性能.在Sol-gel工艺中,加入了有机大分子量聚乙烯吡咯烷酮(polyvinyl pyrrolidone,PVP)制备BST前驱体.实验结果表明:PVP的加入可有效增加前驱体的稳定性和分散性,降低BST陶瓷的预烧温度约250℃,并在1200℃获得晶粒细小、致密的BST陶瓷.BST陶瓷,显示弥散相变特征.     

Propulsive performance of a fish-like travelling wavy wall

Summary. A numerical simulation is performed to investigate the viscous flow over a smooth wavy wall undergoing transverse motion in the form of a streamwise travelling wave, which is similar to the backbone undulation of swimming fish. The objective of this study is to elucidate hydrodynamic features of the flow structure over the travelling wavy wall and to get physical insights to the understanding of fish-like swimming mechanisms in terms of drag reduction and optimal propulsive efficiency. The effect of phase speed, amplitude and Reynolds number on the flow structure over the wavy wall, the drag force acting on the wall, and the power consumption required for the propulsive motion of the wall is investigated. The phase speed and the amplitude, which are two important parameters in this problem, predicted based on the optimal propulsive efficiency agree well with the available data obtained for the wave-like swimming motion of live fish in nature.     

Designing reliability information flows

It is well-known [Reliab. Eng. Syst. Saf. 75 (2002) 295] that in modern development processes it is essential to have an information flow structure that facilitates fast feedback from product users (customers) to departments at the front end, in particular development and production. As information is only relevant if it is used when taking decisions, this paper presents a guideline for building field feedback information flows that facilitate the decision taking during the product creation and realisation process. The guideline takes into consideration that the type of decisions depends on the span-of-control, therefore following Parsons [Structure and Process in Modern Societies (1990)] the span-of-control is subdivided into the following three levels: strategic, tactic, and executive. The guideline is illustrated with a case in which it is used for analysing the quality of existing field feedback flows.     

Tl2Ba2CaCu2O8 thin films on 2 in. LaAlO3(0 0 1) substrates

High quality Tl₂Ba₂CaCu₂O₈ (Tl-2212) superconducting thin films are prepared on both sides of 2 in. LaAlO₃(0 0 1) substrates by off-axis magnetron sputtering and post-annealing process. XRD measurements show that these films possess pure Tl-2212 phase with C-axis perpendicular to the substrate surface. The thickness unhomogeneity of the whole film on the 2 in. wafer is less than 5%. The superconducting transition temperatures T_cs of the films are around 105 K. At zero applied magnetic field, the critical current densities J_cs of the films on both sides of the wafer were measured to be above 2 × 10⁶ A/cm² at 77 K. The microwave surface resistance R_s of film was as low as 350 μΩ at 10 GHz and 77 K. In order to test the suitability of Tl-2212 thin films for passive microwave devices, 3-pole bandpass filters have been fabricated from double-sided Tl-2212 films on LaAlO₃ substrates.     

Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability

Solder joint fatigue failure is a serious reliability concern in area array technologies, such as flip chip and ball grid array packages of integrated-circuit chips. The selection of different substrate materials could affect solder joint thermal fatigue life significantly. The reliability of solder joints in real flip chip assembly with both rigid and compliant substrates was evaluated by the accelerated temperature cycling test and thermal mechanical analysis. The mechanism of substrate flexibility on improving solder joint thermal fatigue lifetime was investigated by fracture mechanics methods. Two different methods (crack tip opening displacement, CTOD and virtual crack closure technique, VCCT) are used to determine the crack tip parameters which are considered as the indices of reliability of solder joints, including the strain energy release rate and phase angle for the different crack lengths and temperatures. It was found that the thermal fatigue lifetime of solder joints in flip chip on flex assembly (FCOF) was much longer than that of flip chip on rigid board assembly (FCOB). The flex substrates could dissipate energy that otherwise would be absorbed by solder joints, that is, substrate flexibility has a great effect on solder joint reliability and the reliability improvement was attributed to flex buckling or bending during thermal cycling.     

Vertical spinal electronic device with large room temperature magnetoresistance

We report experimental transport measurements of a vertical hybrid ferromagnetic (FM)/III-V semiconductor (SC)/ferromagnetic(FM) type structure, i.e., Cr(20ML)/Co(15ML)/GaAs(50 nm, n-type)/Al/sub 0.3/Ga/sub 0.7/As(200 nm, n-type)/FeNi(30 nm). The current-voltage (I-V) characteristics reveal Schottky/tunneling type behavior in the direction of FeNi/Semiconductor/Co and observed to be dependent on external magnetic field. The magnetoresistance (MR) behavior shows a strong dependence on the measured current and field. At low fields no significant change in MR has been observed with increasing current. However, at high fields the MR initially increases with increasing current and becomes stable beyond a critical current of 10 /spl mu/A. A maximum of 12% change in the MR has been observed at room temperature, which is far larger than that of the conventional AMR effect. This property of the device could be utilized as field sensors or magnetic logic devices.     

基于JCZ型传感器的扭矩和转速测量方法

讨论了基于JCZ型扭矩转速传感器的扭矩和转速测量方法;介绍了相位差检测电路,对相位差检测电路中各结点的信号波形和检测电路输出波形进行了分析;提出了基于P89LPC932单片机的等精度测量的信号处理方法,该方法有效地消除转速对扭矩检测的影响,提高了测量精度。     

国产32位S698处理器的嵌入式教学平台

介绍一种基于S698处理器的嵌入式系统教学平台,平台针对嵌入式系统开放式、设计型教学的特点进行设计;详细描述教学平台的硬件系统设计和软件实现。该教学平台具有易学习,简洁美观,方便实用等特点。     

快速浮点加法器的FPGA实现

讨论了3种常用的浮点加法算法，并在VirtexⅡ系列FPGA上实现了LOP算法。实验结果表明在FPGA上可以实现快速浮点加法器，最高速度可达152MHz，资源占用也在合理的范围内。