基于振动实测的非均质地层钻头失效分析与对策

四川盆地作为国内页岩气开发的重点区域,通过近几年的不断攻关和实践,机械钻速得到了提高,但由于受地层复杂、可钻性差、非均质性强等地质因素的影响,导致井下钻柱系统不良振动剧烈,容易出现钻头损坏严重、钻速较低等问题,严重影响了钻井时效。为了解决上述难题,以该盆地涪陵工区上二叠统龙潭组—中二叠统茅口组为例,采用井下振动高频测量工具的实测手段,测量了钻头—钻柱系统的动态振动加速度参数,结合地层的岩性和矿物组分分析,研究钻头失效原因与对策,并开展了现场试验。研究结果表明:①在非均质地层中钻进的钻头—钻柱系统产生了大于40 m/s~2的高幅值瞬时冲击振动,高幅值的瞬时冲击是导致钻头先期失效的主要原因;②提出了抑制高幅值的瞬时冲击振动采用"减振+增压"工具组合和避免井下工具共振的钻井参数;③采用钻井新参数的试验井比邻井的高幅值瞬时振动降低了17%,单只钻头进尺增加24%,钻头工作环境得到了较大的改善,钻头使用数量减少。结论认为,该研究成果能够有效地改善钻头—钻柱系统的振动状态,有利于达成延长钻头使用寿命的目标。     

煤气化废水处理工艺探讨

煤气化废水的特点是温度高、硬度高、NH3-N高、有机物含量相对不足。针对这些特点引起的运行不稳定,逐一提出解决方案,并形成一套完整的针对煤气化废水的处理工艺。     

Anticancer activity of flavonoids accompanied by redox state modulation and the potential for a chemotherapeutic strategy

Since researchers began studying the mechanism of flavonoids’ anticancer activity, little attention has been focused on the modulation of redox state in cells as a potential chemotherapeutic strategy. However, recent studies have begun identifying that the anticancer effect of flavonoids occurs both in their antioxidative activity which scavenges ROS and their prooxidative activity which generates ROS. Against this backdrop, this study attempts to achieve a comprehensive analysis of the individual and separate study findings regarding flavonoids’ modulation of redox state in cancer cells. It focuses on the mechanism behind the anticancer effect, and mostly on the modulation of redox potential by flavonoids such as quercetin, hesperetin, apigenin, genistein, epigallocatechin-3-gallate (EGCG), luteolin and kaempferol in both in vitro and animal models. In addition, the clinical applications of and bioavailability of flavonoids were reviewed to help build a treatment strategy based on flavonoids’ prooxidative potential.     

On the performance of band-limited asynchronous DS-CDMA over nakagami-m channels

In this paper we investigated the BER performance of DS-CDMA using various chip-waveforms, which include three time-limited chip-waveforms and two band-limited chip-waveforms. Closed-form formulae were derived for evaluating the achievable bit-error rate performance with the aid of the standard Gaussian approximation, when communicating over a Nakagami-m channel. The time-limited waveforms impose a low implementational complexity, since they maybe over sampled and read from a look-up table. However, they are outperformed by the frequency-domain raised-cosine waveform as well as the optimum waveform specifically designed by Cho and Lehnert for achieving the lowest possible bit error rate     

最大塑性功原理在烧结体上限分析中的应用

最大塑性功原理又称第二塑性变分原理，在致密体塑性变形分析叶l是运用能量法进行变形力能计算的基础。本文从分析Drucker公设的亢要条件出发，证明了烧结体塑性变形最大塑性功原理的存在，片在该原理的荩础卜，推导出塑性变形的上限功率表达式，并以平面挤压条件下的上限法应用作为实例加以说明。     

关于天然气水合物钻采工艺技术进展的研究

目前全球正面临着前所未有的能源危机，天然气水合物由于储量大、能量密度高而将成为一种诱人的新型能源。天然气水合物主要存在于冻土带和海洋，在地下处于低温和高压状态，以现有的技术，钻井和开采都存在很大的困难。简要介绍了天然气水合物的性质及储量，阐述了天然气水合物钻井的六个挑战及目前国外天然气水合物的两种钻探方法；同时阐述了以热力法、降压法和化学试剂注入法为主的天然气水合物开采方法，并针对天然气水合物钻采技术现状指出了下一步的研究方向。     

LNG冷量优化集成利用技术

我国将相继在沿海地区建成多个LNG接收站，每年将进口数以千万吨计的LNG，同时携带数着巨额冷量，而这些冷量可用于发电、空气分离、制造干冰、低温冷库等众多领域。基于国外LNG冷量利用现状，指出我国即将展开和实施此项技术还存在着：过程火用损较大，缺乏系统、全面的LNG冷量利用技术的研发指导机制，以及宏观调控力度薄弱等问题，进而提出了发展LNG冷量的集成利用方案，可为此类技术的研发利用提供新思路。以福建即将进口的LNG为例，模拟了空气分离与干冰制备的集成工艺流程，结果表明：福建每年进口的260×10⁴t LNG可以冷却290×10⁴t空气，相当于60000 m³/h的氧气制备规模，还可以生产100×10⁴t的干冰，其过程火用损较小；其剩余的高温位冷量可应用于低温冻结库或冰灯等项目，这对主体装置的实施效果和过程火用损的影响较小。该技术的优点在于可灵活控制冷却空气的液化率，基本不用冷却循环水，流程简单，设备投资少，能耗低等。     

空气钻井技术在普光气田的应用

普光气田是四川盆地已发现的最大天然气田。普光气田已钻井实践表明,常规钻井液钻井技术机械钻速低,钻井周期长,钻井复杂及事故多,无法满足普光气田开发要求。为了提高钻井速度,缩短钻井周期,加快普光气田的开发进程,在PD-1井、P2-2井、PA-2井、P4-2井、P6-3井等5口井进行了空气钻井试验。文中分析了普光气田进行空气钻井的可行性,介绍了空气钻井技术在普光气田的实践情况,并对空气钻井的效果进行了评价,分析了空气钻井技术在普光气田进一步应用需要重视和解决的问题,并提出了今后的研究方向。     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported