Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters

The work presented in part 1 of this study focuses on identifying the effects of thermal cycling test parameters on the lifetime of ball grid array (BGA) component boards. Detailed understanding about the effects of the thermal cycling parameters is essential because it provides means to develop more efficient and meaningful methods of reliability assessment for electronic products. The study was carried out with a single package type (BGA with 144 solder balls), printed wiring board (eight-layer build-up FR4 structure), and solder interconnection composition (Sn-3.1Ag-0.5Cu) to ensure that individual test results would be comparable with each other. The effects of (i) temperature difference (ΔT), (ii) lower dwell temperature and lower dwell time, (iii) mean temperature, (iv) dwell time, and (v) ramp rate were evaluated. Based on the characteristic lifetimes, the thermal cycling profiles were categorized into three lifetime groups: (i) highly accelerated conditions, (ii) moderately accelerated conditions, and (iii) mildly/nonaccelerated conditions. Thus, one might be tempted to use the highly accelerated conditions to produce lifetime statistics as quickly as possible. However, to do this one needs to know that the failure mechanisms do not change from one lifetime group to another and that the failure mechanisms correlate with real-use failures. Therefore, in part 2 the observed differences in component board lifetimes will be explained by studying the failure mechanisms that take place in the three lifetime groups.     

Optical scattering of nanocrystalline Pb(ZrxTi1−x)O3 films

Optical characterization methods, like spectrophotometry at UV–vis-NIR wavelengths and prism-coupler method, were applied to polycrystalline Pb(Zr_xTi_1?x)O₃ thin films at various thicknesses. Thin films were deposited at room temperature by pulsed laser deposition on MgO (1 0 0) substrates and post-annealed at different temperatures. X-ray diffraction and atomic force microscopy were used to characterize the crystal structure and surface morphology of the thin films, respectively.Well oscillating transmission with a sharp fall near the absorption edge was found in films with high orientation and low surface roughness. Changes in the surface morphology and crystal orientation were found to modulate optical interference maxima and minima of the transmittance spectra and to increase the width of the TE₀ mode (Δβ ≈ 0.06) indicating an increase in the scattering losses of the films. Single-phase oriented films had sharpest coupling values (Δβ ≈ 0.005) of the TE₀ mode.     

Characterization of Submillimeter Wave Absorbers from 200–600 GHz

This paper presents measurements of both specular and non-specular scattering from several submillimeter wave absorber materials designed for antenna testing and from low-cost carpet materials. The frequency range is 200–600 GHz in specular scattering, and 300–400 GHz in non-specular scattering measurements. The constructed bistatic test bench allows testing of the full continuous angular range of 0°–90°. The measurement results show large differences in performance of different materials. It is shown that reflectivities below ?50 dB over limited angular ranges are possible with a correct alignment of the material. Also, low-cost carpet materials have lower than ?15 dB reflectivities in most angles, and may be useful in non-critical parts of the antenna test range. The results can be used to optimise the absorber placement inside an antenna range, concerning both best performance and lowest cost.     

The Reliability of Microalloyed Sn-Ag-Cu Solder Interconnections Under Cyclic Thermal and Mechanical Shock Loading

In this study, the performance of three microalloyed Sn-Ag-Cu solder interconnection compositions (Sn-3.1Ag-0.52Cu, Sn-3.0Ag-0.52Cu-0.24Bi, and Sn-1.1Ag-0.52Cu-0.1Ni) was compared under mechanical shock loading (JESD22-B111 standard) and cyclic thermal loading (40 ± 125°C, 42 min cycle) conditions. In the drop tests, the component boards with the low-silver nickel-containing composition (Sn-Ag-Cu-Ni) showed the highest average number of drops-to-failure, while those with the bismuth-containing alloy (Sn-Ag-Cu-Bi) showed the lowest. Results of the thermal cycling tests showed that boards with Sn-Ag-Cu-Bi interconnections performed the best, while those with Sn-Ag-Cu-Ni performed the worst. Sn-Ag-Cu was placed in the middle in both tests. In this paper, we demonstrate that solder strength is an essential reliability factor and that higher strength can be beneficial for thermal cycling reliability but detrimental to drop reliability. We discuss these findings from the perspective of the microstructures and mechanical properties of the three solder interconnection compositions and, based on a comprehensive literature review, investigate how the differences in the solder compositions influence the mechanical properties of the interconnections and discuss how the differences are reflected in the failure mechanisms under both loading conditions.     

赫尔辛基海员中心

精选理由在自然景观和元素的簇拥下,作为此地唯一的公共建筑物,它让远道而来的海员们休息和放松,结合其柔和的体量,将其定位为一个小型的多功能建筑。这里既有抚慰人心的精神食粮,也提供了咖啡     

From geotechnical maps to three-dimensional models

It is generally preferable to store geotechnical and geological investigation material for possible future use. Old material may be even more valuable than new results in some cases. If the location data for site investigations cannot be identified reliably, it is usually advisable to refrain from using the data at all. Quaternary maps compiled by the Geological Survey of Finland are available for the entire country. Some municipalities in areas where foundation conditions play a prominent part in the safety and economy of building have worked up their own foundation survey materials into regional geotechnical maps. The use of geotechnical data for planning has always required a three-dimensional viewpoint. 3D analysis requires a joint GIS-type database. These still generally consist of binary files, although a relational database solution is recommended for the management of large bodies of data in particular. The general principle as regards old investigations is that their costs have already been covered, whereas overwise separate search and maintenance costs will be involved. Data users are themselves responsible for the results of older site investigations. One important feature is that geotechnical data can be combined with information obtained from other systems.     

600 MHz direct modulation of short external cavity wavelength-tunable diode laser

The current modulation characteristics of a short external cavity tunable laser are presented. The 1540 nm Fabry-Perot diode laser is wavelength-tuned by the electrostatically controlled silicon micromachined Fabry-Perot interferometer device. The measured -3 dB cutoff frequency of 600 MHz is the widest reported direct modulation bandwidth of the external cavity tunable laser.     

Improving the Accuracy of Structural Hot‐spot Stress Approach

A method for extending the applicability of the structural hot‐spot stress method for fatigue assessment of welded structures is discussed. The structural hot‐spot stress method for plate structures, as currently presented in commonly used design guidance documents, cannot account for the effect of weld size, and load carrying fillet welds are assessed using a different S‐N curve as compared to non‐load carrying fillet welds. This paper presents a proposal to linearize the local stress distribution through the plate thickness in the plane of the weld toe. This proposal considers the forces transmitted by the weld itself. A bilinear stress distribution, which partially captures the local effect of the weld, is derived from the non‐linear stress distribution. The non‐linear distribution is based on equilibrium and the stress in the fillet weld. A simple procedure is presented to determine the bilinear curve from the nominal weld stress. This is a great advantage in finite element analysis when only nominal base plate stress and nominal weld stresses need to be determined. When compared to the more conventional structural stress approach, the new method also has the advantage that extrapolation is not required. The same weld stresses can also be used in the analysis of the root cracks. The proposed method was scaled to correspond to the traditional structural hot‐spot stress method using detailed linear elastic fracture mechanics simulations. The method is only applied to fully load‐carrying welds here but can also be used for partial load‐carrying welds. A symmetric splice plate having a fully loaded fillet weld is presented as an example case. The influence of base plate thickness is studied as well.