A novel cyclic process using CaSO4/CaS pellets for converting sulfur dioxide to elemental sulfur without generating secondary pollutants: Part II. Hydrogen reduction of calcium-sulfate pellets to calcium sulfide

The reduction of calcium sulfate to produce calcium sulfide is a part of the cyclic process for converting sulfur dioxide to elemental sulfur that is described in Part I. The kinetics of the hydrogen reduction of nickel-catalyzed calcium-sulfate pellets were investigated using a thermogravimetric analysis (TGA) technique at reaction temperatures between 1023 and 1088 K and hydrogen partial pressures between 12.9 and 86.1 kPa. The reactivity of nickel-catalyzed calcium-sulfate pellets was demonstrated by the conversion of 70 pct fresh nickel-catalyzed calcium sulfate to calcium sulfide in 20 minutes at 1073 K under a hydrogen partial pressure of 86.1 kPa. Furthermore, the reactivity remained relatively intact after ten cycles of reactions and regenerations. This observed characteristic of the pellets is important because the solids must be reusable for repeated cycles to avoid generating secondary pollutants. The nucleation and growth rate expression was found to be useful in describing the kinetics of the reaction, which had an activation energy of about 167 kJ/mol (∼40 kcal/mol) in all reaction cycles except for the first regenerated samples that were lower at 146 kJ/mol (35 kcal/mol). The reaction order with respect to hydrogen partial pressure was 0.22 in all cycles with the exception of the first regenerated sample for which it was 0.37.     

Laboratory study of property-modified prebaked carbon anode and application in large aluminum electrolysis cells

A kind of complex additive mainly containing Al, Mg, F, and O was prepared. The synthetical performances of the property-modified prebaked anodes containing additives were tested in laboratory. On the basis of ideal testing results obtained, a large number of industrial prebaked property-modified anodes are prepared in a large-scale aluminum company. Further more, they are all used in 160 kA prebaked anode aluminum electrolysis cells. The statistic result show that, compared with common anodes, the property-modified ones enhance current by 11.6 kg per ton aluminum averagely.     

高温预析出对Al-Zn-Mg系铝合金时效硬化和应力腐蚀的影响

研究了高温固溶后降温处理工艺对中强可使预析出LC52和7039铝合金的组织、时效硬化和应力腐蚀的影响。金相观察发现,高温预析出可优先在晶界处产生,并提高随后时效状态下晶界析出相的不连续分布程度,温度降低到一定程度晶内和晶界产生大量析出。合金拉伸性能和应力腐蚀结果表明,预析出在保持强度和塑性的同时,可提高抗应力腐蚀性能。而预析出温度降低,合金强度呈下降趋势。     

Effect of Tongmai Decoction on expression of NF-κB in ox-LDL injured endothelial cells

Objective Study on the effect of NF-κB in ox-LDL injured HUVEC-304 and the intervention with the serum of Tongmai Decoction. Methods Tongmai Decoction herbage-contained serum was made by the serum pharmacology methods, then the HUVEC-304 cells were divided into 5 groups and incubated for 24 h: 1) normal group;2) fetal calf serum group; 3) ox-LDL group; 4) simvastatin group; 5) Tongmai Decoction group. RT-PCR was used to determine the mRNA of NF-κB in the cells, Western Blot Assay was used to determine the protein content of NF-κB in the cells. Results 1) Compared with the cells in normal group and serum control group , the endothelial cells in ox-LDL group are seriously injured, while those in Tongmai Decoction group grow better; 2) Compared with the cells in normal group and fetal calf serum group, the expressions of NF-κB gene and protein are up-regulated in ox-LDL group(P＜0.05, P＜0.01); 3) Compared with the cells in ox-LDL group, the expression of NF-κB gene and protein in Tongmai Decoction group are significantly down-regulated, there is no difference between Tongmai Decoction group and simvastatin group(P＞0.05). Conclusion Tongmai Decoction can protect the injured endothelial cells, up-regulate the expressions of NF-κB gene and protein content.     

An experimental study of carrier heating on channel noise in deep-submicrometer NMOSFETs via body bias

In this paper, RF noise in 0.18-mum NMOSFETs concerning the contribution of carrier heating and hot carrier effect is characterized and analyzed in detail via a novel approach that modulates the channel carrier heating and number of hot carriers using body bias. We confirm qualitatively a negligible role of hot carrier effect on the channel noise in deep-submicrometer MOSFETs. For a device under reverse body bias (V_b), even though the increase in hot carrier population is clearly characterized by dc measurements, the device high-frequency noise is found to be irrelevant to the increase in the channel hot carriers. Experimental results show that the high-frequency noise is slightly reduced with the increase in |V_b|, and can be qualitatively explained by secondary effects such as the suppression of nonequilibrium channel noise and substrate induced noise. The reduction of NF_min and R_n with the increase in |V_b| may provide a possible methodology to finely adjust the device high-frequency noise performance for circuit design     

在不断创新中开创新的百年——水口山有色金属集团有限公司110年创新发展历程和展望

回顾了水口山有色金属集团有限公司的发展历程，概述了取得的技术进步和主要成就．提出了企业今后的发展方向。     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.