Fabrication of a highly bendable LCD with an elastomer substrate by using a replica‐molding method

Abstract— A highly bendable liquid‐crystal display was fabricated by using a multi‐functional elastomer substrate of self‐aligning LC molecules without any surface treatment. One of the two substrates is a plastic substrate while the other is a multi‐functional elastomer substrate produced by a replica‐molding technique. The multi‐functional elastomer substrate has pixel‐encapsulating walls that serve as spacers and provide mechanical stability and reproducibility against bending deformations. The highly bendable LCD demonstrates great flexibility, durability, and excellent electro‐optic performances in a highly bent state.     

TEM studies of strain-induced martensitic formation in fatigued Fe-18Mn alloy

Austenitic Fe-18Mn alloy was cyclically deformed at various total strain amplitudes. The structural changes induced by cyclic straining in Fe-18Mn alloy were investigated by transmission electron microscopy. At a low strain amplitude of 0.4%, the formation ofε-martensite associated with deformation twins and stacking faults was observed in this alloy. As the applied strain amplitude was increased to 1.0%,α′-martensite embryos were induced in the alloy investigated. These embryos coalesce into a lath structure upon subsequent cyclic deformation.     

Optical backplane system using waveguide-embedded PCBs and optical slots

As discussed in this paper, a practical optical backplane system was demonstrated, using a waveguide-embedded optical backplane board, processing boards, and optical slots for board-to-board interconnection. A metal optical bench was used as a packaging die for the optical devices and the integrated circuit chips in both the transmitter and the receiver processing boards. The polymer waveguide was produced by means of a hot-embossing technique and was then embedded following a conventional lamination processes. The average propagation loss of these waveguides was approximately 0.1 dB/cm at 850 nm. The dimension and optical properties of the waveguide in an optical backplane board were unchanged after lamination. As connection components between transmitter/receiver processing boards and an optical backplane board, optical slots were used for easy and repeatable insertion and extraction of the boards with a micrometer-scale precision. A 1/spl times/4 850-nm vertical-cavity surface-emitting laser array was used with 2 dBm of output power for the transmitter and a p-i-n photodiode array for the receiver. This paper successfully demonstrates 8 Gb/s of data transmission between the transmitter processing board and the optical backplane board.     

可见光激光二极管开发现状与市场——市场状况

本文是可见光激光二极管开发现状与市场的最后部分,主要介绍器件应用领域,产销量,价格与趋势.     

Determination of attenuation-velocity products in a layered homogeneous medium

Attenuation imaging has the promise to become a measurement technique for ultrasound imaging systems more sophisticated than those we currently possess; however, the difficulties in using the presently available methods tend to limit this potential for the non-specialist. In our recent work, we have investigated the attenuation imaging problem, and have had some success with an alternative technique, namely, attenuation-velocity product imaging. In certain cases this can be an acceptable substitute for purely attenuation imaging, particularly for the soft tissues encountered in some diagnostic medical situations where the acoustic velocities of the various layers are all of approximately the same value. This article discusses our technique in detail, beginning with fundamental considerations. We make no unreasonable assumptions about the object under study, and yet are able to show the uniqueness of the solution and also deal effectively with the problem of multiple reflections. The data encountered in this experimental configuration have several intriguing properties, which allow us to draw some conclusions about acoustic imaging in general.     

In-situ cleaning and passivation of oxidized Cu surfaces by alkanethiols and its application to wire bonding

The treatment of oxidized Cu surfaces using an alkanethiol as a reducing agent has been investigated. Exposure to a dilute solution of 1-decanethiol resulted in the complete removal and/or conversion of CuO and subsequent formation of a passivating thiolate film, a so-called self-assembled monolayer (SAM), on the underlying Cu/Cu₂O surface as evidenced by x-ray photoelectron spectroscopy (XPS) analysis. Morphological changes, monitored by scanning electron microscopy (SEM) and atomic force microscopy (AFM), revealed transformation of the rough, porous CuO layer into a comparatively smooth Cu/Cu₂O surface. Experiments performed on integrated circuit back-end-of-line (BEOL) die structures, comprising Cu/SiO₂ bond pads used as substrates for Cu wire bonding, demonstrate the potential application of a thiol-based in-situ cleaning-passivation procedure in microelectronics.     

Integer lapped transforms and their applications to image coding

This paper proposes new integer approximations of the lapped transforms, called the integer lapped transforms (ILT), and studies their applications to image coding. The ILT are derived from a set of orthogonal sinusoidal transforms having short integer coefficients, which can be implemented with simple integer arithmetic. By employing the same scaling constants in these integer sinusoidal transforms, integer versions of the lapped orthogonal transform (LOT), the lapped biorthogonal transform (LBT), and the hierarchical lapped biorthogonal transform (HLBT) are developed. The ILTs with 5-b integer coefficients are found to have similar coding gain (within 0.06 dB) and image coding performances as their real-valued counterparts. Furthermore, by representing these integer coefficients as sum of powers-of-two coefficients (SOPOT), multiplier-less lapped transforms with very low implementation complexity are obtained. In particular, the implementation of the eight-channel multiplier-less integer LOT (ILOT), LBT (ILBT), and HLBT (IHLBT) require 90 additions and 44 shifts, 98 additions and 59 shifts, and 70 additions and 38 shifts, respectively.