Thermal Boundary Resistance in GaN Films Measured by Time Domain Thermoreflectance with Robust Monte Carlo Uncertainty Estimation

In this work, we investigate the thermal boundary resistance and thermal conductivity of GaN layers grown on Si with 100 nm AlN transition layers using time domain thermoreflectance (TDTR). The GaN layers ranged from 0.31 to 1.27 μm. Due to the challenges in determining the thermal boundary resistance of the buried interfaces found in this architecture, a new data reduction scheme for TDTR that utilizes a Monte Carlo fitting method is introduced and found to dramatically reduce the uncertainty in certain model parameters. The results show that the GaN thermal conductivity does not change significantly with layer thickness, whereas the resistance of the AlN layer decreases slightly with GaN thickness.     

Anomalies in Hall-Petch strengthening for nanocrystalline Au-Cu alloys below 10 nm grain size

The mechanical behavior of an electrodeposited nanocrystalline alloy is assessed with regards to the experimentally measured strain-rate sensitivity. Foils are characterized with grain sizes as small as 3 nm, a nano-scale regime that has previously gone without detailed experimental examination. It is found from micro-scratch measurements that hardness, hence strength, approaches ideal values as the grain size decreases to 7 nm. Below 7 nm, softening in strength and departure from Hall-Petch behavior is related to an increase in the activation volume for deformation as grain size decreases further.     

Synthesis,characterization and comparative OFET behaviour of indenofluorene–bithiophene and terthiophene alternating copolymers

The synthesis of alternating copolymers of tetraalkylindenofluorene with bithiophene and terthiophene using Suzuki polycondensation route is reported. We report on the optical and electrochemical properties of these copolymers. AFM analysis of the microscopic morphology of thin deposits showed that the copolymer with terthiophene units produced the more ordered films, with well-defined fibrillar structures, resulting from highly-regular dense packing due to strong π–π interchain interactions, in contrast to the amorphous bithiophene copolymer. Upon testing these materials in FETs the terthienyl copolymers displayed the higher charge mobilities among the studied compounds, with values of over 10^?4 cm² V^?1 s^?1 being obtained.     

Evaluation of surface/interface quality,microstructure and mechanical properties of hybrid additive-subtractive aluminium parts

A disadvantage of selective laser melting (SLM) processes for the manufacture of large parts is their slow build time per unit volume. A hybrid route is to generate core simple shapes traditionally, for example by machining, followed by adding final features by SLM. Here the mechanical integrity of such hybrid parts is studied, choosing the building of AlSi10Mg by SLM on a machined AA6082 base, in the shape of a tensile test piece, as a simple example. These materials are chosen for their relevance to lightweight parts. As-built parts fail at the SLM/machined interface but standard heat treatments transfer failures to the machined material. Optimised SLM processing conditions and microstructures of the SLM and interfacial regions are reported.     

Silver–polyimide nanocomposite membranes: Macromolecular‐matrix‐mediated metallization of an aromatic,fluorinated polyimide yielding highly reflective films at low metal concentrations

Highly reflective, surface‐metalized, flexible polyimide films were prepared by the incorporation of a soluble silver‐ion complex, (hexafluoroacetylacetonato)silver(I) (AgHFA), into dimethylacetamide solutions of poly(amic acid) prepared from 2,2‐bis(3,4‐dicarboxyphenyl)hexafluoropropane dianhydride and 2,2‐bis[4‐(4‐aminophenoxy)phenyl]hexafluoropropane. The thermal curing of solution‐cast silver(I)–poly(amic acid) films to 300°C led to cycloimidization of the amic acid with concomitant silver(I) reduction and the formation of a reflective, air‐side‐silvered surface at very low (2 wt % and 0.3 vol %) silver concentrations. The reflective surface evolved only when the cure temperature reached about 275°C, although X‐ray diffraction showed metallic silver in the hybrid film by 200°C. After a maximum specular reflectivity greater than 80% was achieved for the 2 wt % silver film, the specular reflectivity diminished sharply with further heating at a constant temperature of 300°C. Incorporating the AgHFA complex into the soluble, fully imidized form of poly{(1,3‐dihydro‐1,3‐dioxo‐2H‐isoindole‐2,5‐diyl)[2,2,2‐trifluoro‐1‐(trifluoromethyl)ethylidene](1,3‐dihydro‐1,3‐dioxo‐2H‐isoindole‐5,2‐diyl)‐1,4‐phenyleneoxy‐1,4‐phenylene[2,2,2‐trifluoro‐1‐(trifluoromethyl)ethylidene]‐1,4‐phenyleneoxy‐1,4‐phenylene} gave films that were 25% less reflective than those beginning with poly(amic acid). Though highly reflective, the films were not electrically conductive. The metalized membranes were thermally stable and maintained mechanical properties similar to those of the parent polyimide. Transmission electron microscopy revealed an air‐side, near‐surface layer of silver that was about 40 nm thick; the interior of the film had well‐dispersed metal particles with diameters mostly less than 2 nm. The near‐surface silver layer maintained its integrity because of physical entrapment of the metal nanoparticles beneath a thin layer of polyimide; that is, the practical adhesion of the metal layer was good. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 2409–2418, 2007     

氟橡胶与金属黏接的研究进展

介绍了氟橡胶与金属的黏接机理,综述了氟橡胶与金属黏接用硅烷偶联剂、有机硅胶黏剂和含增黏组分胶浆的研究进展状况,指出简便实用、效果良好的黏接工艺是今后的发展方向。     

A theoretical study of solvent effects on Kolbe-Schmitt reaction kinetics

A theoretical DFT study was employed to confirm the Kolbe-Schmitt reaction mechanism and investigate solvent effects on this reaction. The use of a solvent in the Kolbe-Schmitt reaction is desirable to facilitate a homogeneous reaction mixture and potentially improve the reaction rate. The candidate solvents were designed using computer aided molecular design (CAMD) and tested using DFT solvation calculations. The results from the quantum mechanical calculations were then used to determine the rate constants for each elementary step, the overall reaction yields and the corresponding residence time. The methodology was tested on the reaction without solvent, with solvents reported in the literature, and with the designed solvents. The study revealed that in the presence of solvents with high dielectric constant the reaction becomes reversible, leading to low product yields.