Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

Exposed pad packages were introduced in the late 1980s and early 1990s because of their excellent thermal and electrical performance. Despite these advantages, the exposed pad packages experience a lot of thermo-hygro-mechanical related reliability problems during qualification and testing. Examples are die lift, which occurs predominantly after moisture sensitivity level conditions, and die-attach to leadframe delamination leading to downbond stitch breaks during temperature cycling. In this chapter, nonlinear finite element (FE) models using fracture mechanics based J-integral calculations are used to assess the reliability problems of the exposed pad package family. Using the parametric FE models any geometrical and material effects can be explored to their impact on the occurrence diepad delamination, and dielift. For instance the impact of diepad size is found to be of much less importance as the impact of die thickness is. Using the fracture mechanics approach, the starting location for the delamination from thermo-hygro-mechanical point of view is deducted. The results indicate that when diepad delamination is present, cracks are likely to grow beneath the die and dielift will occur. The interaction between dielift and other failure modes, such as lifted ball bonds, are not found to be very significant. The FE models are combined with simulation-based optimization methods to deduct design guidelines for optimal reliability of the exposed pad family.     

Investigation of Mechanical and Electrical Characteristics for Cracked Conductive Particle in Anisotropic Conductive Adhesive (ACA) Assembly

In an anisotropic conductive adhesive (ACA) assembly, the electrical conduction is usually achieved with the conductive particles between the bumps of integrated circuit (IC) and corresponding conductive tracks on the glass substrate. Fully understanding of the mechanical and electrical characteristics of ACA particles can help to optimize the assembly process and improve the reliability of ACA interconnection. Most conductive particles used in the ACA assembly are with cracks in the metal coating of the particles after the ACA bonding. This paper introduced the fracture analysis by applying the cohesive elements in the numerical model of the nickel-coated polymer particle and further simulating the cracks initiation and propagation in the nickel coating during the ACA bonding. The simulation results showed that the stress distribution on the nickel-coated particle with cracks was significantly different from that on the nickel-coated particle without crack, indicating that the stress analysis by taking the crack into consideration is very important for the reliability assessment of the ACA interconnection. The stress analysis of cohesive elements indicated that the cracks initiated at the central area of the nickel coating and propagated to the polar area. Furthermore, by the introduction of a new parameter of the virtual resistance, a mathematical model was established to describe the electrical characteristics of the nickel-coated particle with cracks. The particle resistance of the nickel-coated particle with cracks was found to be much higher than that of the particle without crack in the optimized bonding pressure range, indicating that it is necessary to take the crack into consideration for the particle conduction analysis as well. Therefore, the fracture analysis on the conductive particle by taking the crack into consideration could accurately evaluate the reliability of ACA interconnection and avoid serious reliability issues.     

Collision-Free Interleaver Composed of a Latin Square for Parallel-Architecture Turbo Codes

In parallel-architecture turbo codes, the constituent interleavers must avoid memory collision. This paper proposes a collision-free interleaver structure composed of a Latin square (LS) and pre-designed interleavers. Our proposed interleavers can be easily optimized for various information block sizes and for various degrees of parallelism. Their performances were evaluated by computer simulation.     

烧结成品运输自动控制系统的改进

对烧结成品运输自控系统不稳定性因素进行了分析，提出了采取优化硬件外围工作环境，完善软件保护程序等改进措施。改进后的自控系统稳定性明显提高。     

Effects of Y and Ce on Microstructures and Properties of Nb-Si System Composites

The effects of yttrium and cerium on microstructures and properties of Nb-Si system composites were investigated by scanning electron microscopy( SEM), energy dispersive spectrum(EDS), X-ray diffraction(XRD) and high temperature oxidation experiments.It is found that the coarse primary silicide phase became finer and more homogeneous with Y and Ce addition.The results of high temperature oxidation experiments show that the oxidation rates of NbSi system composites with an appropriate amount of Y and Ce decrease compared with those of alloys without Y or Ce addition, and oxidation products mainly distribute along the phase boundaries between the Nb solid solution and silicide.     

The Simulation of Impact Loads on Beam-type Structures using a Pseudo-dynamic Procedure

Abstract:  This study proposes an alternate method for the analysis of beams with solid cross-section or built as a framed structure and subjected to transverse impact loads from an external striker. The procedure used in the analysis is a combination of two essential tools using pseudo-dynamic techniques. The method reported here involves only one degree of freedom for the structure modelling and assumes an elastic contact between an external striker and the beam structure, which in reality does not happen. As only one degree of freedom is considered in the analysis, some important limitations are inherent to the method proposed here. Essentially, there is the difficulty of modelling the displacement field associated with the transient structure behaviour accurately, as a consequence of fast-rate impact loads. Another difficulty faced by the method refers to a local structure behaviour associated with contact loads. The present method can deal with large displacements in transversely loaded beams associated to a collapse mechanism having a simple geometry and defined with precision from a single parameter. This ensures reasonable accuracy in the evaluation of the strain energy absorbing capacity of transversely impacted beam structures using a single degree of freedom model in a pseudo-dynamic procedure.     

国产螺旋槽密封在进口压缩机上的应用

介绍了国产螺旋槽密封在进口压缩机上的应用，分析了原进口机械-浮环组合密封的失效原因，叙述了改造后国产浮环螺旋槽组合密封的结构和特点。     

Grain refinement of Al-7Si alloys and the efficiency assessment by recognition of cooling curves

Under sand cup solidification condition, the influence of Ti, B concentration, and holding time on the grain size of a high-purity Al-7Si alloy has been systematically studied. It is found that the grain size decreases rapidly at lower Ti or B additions, and is almost constant at the higher concentrations. For Al-3B refined Al-7Si alloys, the grain size increases at the initial period of holding time, and then rapidly becomes independent of holding time; while for Al-7Si alloys refined with Al-5Ti-1B, the grain size increases with holding time throughout. To evaluate the refinement efficiency, a new method named “intelligent evaluating of melt quality by pattern recognition of thermal analysis cooling curves” has also been introduced in this article. The results show that comparing the cooling curve of the evaluated melt with those in a database to find the most similar one to it can precisely assess the grain refinement efficiency of the measured Al-7Si alloy. In addition, the influence of Ti, B addition levels, and pouring temperatures on some characteristic parameters of cooling curve has also been discussed.     

Mixed anaclitic-introjective psychopathology in treatment-resistant inpatients undergoing psychoanalytic psychotherapy.

Utilizing data from the Riggs-Yale Project, 45 male and 45 female 18-29-year-old treatment-resistant inpatients undergoing intensive psychoanalytically oriented treatment were studied. Twenty-seven mixed-type anaclitic-introjective inpatients were compared with 29 "pure" anaclitic and 34 "pure" introjective inpatients. At intake, mixed-type inpatients were more clinically impaired (i.e., were more symptomatic, cognitively impaired, and thought disordered) and more vulnerable (i.e., less accurate object representations and more frequently used maladaptive defense mechanisms) in comparison with clearly defined anaclitic and introjective patients. Mixed-type patients, however, improved significantly more in the course of psychoanalytically oriented treatment, in terms of clinical functioning (i.e., symptoms, cognitive functioning) and psychological vulnerability (i.e., utilization of more adaptive defense mechanisms). (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

10?30 GHz monolithic GaAs travelling-wave divider/combiner

A four-way monolithic GaAs travelling-wave power divider/combiner has been designed, fabricated and evaluated. With a design centre frequency of 20 GHz, a bandwidth of from 10 GHz to 30 GHz has been measured. The insertion loss per dividing or combining action is less than 0.5 dB, with isolation between ports no worse than 20 dB. The input/output VSWRs are better than 2:1 across the same band. This divider/combiner can readily be used with monolithic GaAs power FET amplifiers to produce a several-fold increase in output powers over the 10 to 30 GHz frequency range.