Supermedia-enhanced Internet-based telerobotics

This paper introduces new planning and control methods for supermedia-enhanced real-time telerobotic operations via the Internet. Supermedia is the collection of video, audio, haptic information, temperature, and other sensory feedback. However, when the communication medium used, such as the Internet, introduces random communication time delay, several challenges and difficulties arise. Most importantly, random communication delay causes instability, loss of transparency, and desynchronization in real-time closed-loop telerobotic systems. Due to the complexity and diversity of such systems, the first challenge is to develop a general and efficient modeling and analysis tool. This paper proposes the use of Petri net modeling to capture the concurrency and complexity of Internet-based teleoperation. Combined with the event-based planning and control method, it also provides an efficient analysis and design tool to study the stability, transparency, and synchronization of such systems. In addition, the concepts of event transparency and event synchronization are introduced and analyzed. This modeling and control method has been applied to the design of several supermedia-enhanced Internet-based telerobotic systems, including the bilateral control of mobile robots and mobile manipulators. These systems have been experimentally implemented in three sites test bed consisting of robotic laboratories in the USA, Hong Kong, and Japan. The experimental results have verified the theoretical development and further demonstrated the stability, event transparency, and event synchronization of the systems.     

TEM Studies of High Temperature Corrosion Behaviour of TiAl Intermetallics with Surface Modifications

The oxidation/sulphidation behaviour of a Ti‐46.7Al‐1.9W‐0.5Si alloy with a TiAl₃ diffusion coating was studied in an environment of H₂/H₂S/H₂O at 850^oC. The kinetic results demonstrate that the TiAl₃ coating significantly increased the high temperature corrosion resistance of Ti‐46.7Al‐1.9W‐0.5Si. The SEM, EDX, XRD and TEM analysis reveals that the formation of an Al₂O₃ scale on the surface of the TiAl₃‐coated sample was responsible for the enhancement of the corroison resistance. The Ti‐46.7Al‐1.9W‐0.5Si alloy was also modified by Nb ion implantation. The Nb ion implanted and as received sampels were subjected to cyclic oxidation in an open air at 800^oC. The Nb ion implantation not only increased the oxidation resistance but also substantially improved the adhesion of scale to the substrate.     

Reliability studies of MOCVD TiSiN and EnCoRe Ta(N)/Ta

Passivated single damascene copper SiO₂ damascene lines were evaluated in combination with TiSiN and Ta(N)/Ta diffusion barriers. Leakage current, breakdown and time-dependent dielectric breakdown properties were investigated on a wafer level basis for temperatures ranging between room temperature and 150 °C. It is found that the leakage performance of the wafers with a TiSiN barrier is better at room temperature, but at 150 °C the performance levels out with Ta(N)/Ta. Time-dependent dielectric breakdown measurements at 150 °C show that the lifetime of the interconnect is higher with the selected Ta(N)/Ta barrier than for TiSiN.     

Comparison of total and faecal coliforms as faecal indicator in eutrophicated surface water.

The aim of this study was to evaluate the use of total coliforms (TC) and faecal coliforms (FC) using a membrane filtration method for precise monitoring of faecal pollution in Korean surface water. The samples were collected in Korea from both main rivers and their tributaries. Presumptive TC * FC were enumerated. The ratios of presumptive FC to TC were not constant, but varied widely, and TC were difficult to enumerate because of overgrowth by background colonies. For FC this was not the case. Seven hundred and three purified strains of presumptive TC * FC and their background colonies were biotyped using API 20E. Among 272 presumptive TC, non-faecal related species, Aeromonas hydrophila dominated (34.6%) and E. coli accounted for only 5.1%. In contrast, E. coli made up 89% of the 209 presumptive FC. Furthermore, of 164 background colonies on Endo Agar LES, 54.9% was A. hydrophila, while background colonies on m-FC Agar were few (58 strains), and despite their atypical colony appearance, most of them were biotyped as enteric bacteria. These results reveal that the detection of FC rather than TC using m-FC Agar is more appropriate for faecal pollution monitoring in eutrophicated surface water located in a temperate region.     

Self-reflective segmentation of human bodily motions using recurrent neural networks

For realizing a naturalistic collaboration between the human and the robot, we have to establish the intention sharing from the series of motion data that are observed and exchanged between the human and the machine. In a word, this is a problem to detect "meanings" out of the digitized data stream. In this paper, we propose a novel approach based on semiosis, and present a method of interpreting bodily motions using recurrent neural networks called Elman networks. We made some experiments using the raw data acquired while a human performs a simple task of fetching objects by stretching and folding his/her arm, and demonstrate that the network can learn invariant features of the generalized motion concepts, classify the motion by referring to self-organized memory structure, and understand a task structure of the observed human bodily motion. These capabilities are essential for machine intelligence to establishing the human-robot shared autonomy, a new style of human-machine collaboration proposed in the area of robotics.     

Second harmonic generation from a ferroelectric film

We derive an expression for transmittivity (T_SHG) of second harmonic generation (SHG) signals from a ferroelectric (FE) film. Intensities of up and down fields in the medium are investigated in relation to T_SHG. The derivations are made based on undepletion of input fields and nonlinear wave equation derived from the Maxwell equations. We present two cases: film without mirrors and with partial mirrors. Expressions for the newly derived nonlinear susceptibility coefficients of SHG for real crystal symmetry [J. Opt. Soc. Am. B 19 (2002) 2007] are used to get more realistic results. Variations in T_SHG with respect to film thickness are illustrated.     

Adaptive agents and multiagent systems

New information systems and recent applications (grid computing, Web Services, and so on) are often distributed, large-scale, open, heterogeneous, and characterized by a dynamic environment. To model these complex systems, researchers have spent much effort during the last few years on multiagent systems. The aim is to model complex distributed systems as a set of (possibly organized) software agents that interact in a common environment. The decomposition of a system into a number of agents lets the system react and adapt better in a changing environment. Moreover, organized structures ("social" structures) can emerge from interactions between agents, which in turn constrain and coordinate the agents' behavior. A multiagent system takes its metaphors of interaction from social systems rather than using the metaphor of the isolated thinker that early artificial intelligence researchers preferred. An important issue when dealing with this increasing complexity is to build adaptive agents and multiagent systems. Agents and multiagent systems must be aware of their own capabilities and of changes to other agents and their environment. To remain effective, agents must be able to adapt their structures and knowledge while they execute.     

Evaluation and optimization of package processing and design through solder joint profile prediction

Solder joints are generated using a variety of methods to provide both mechanical and electrical connection for applications such as flip-chip, wafer level packaging, fine pitch, ball-grid array, and chip scale packages. Solder joint shape prediction has been incorporated as a key tool to aid in process development, wafer level and package level design and development, assembly, and reliability enhancement. This work demonstrates the application of an analytical model and the Surface Evolver software in analyzing a variety of solder processing methods and package types. Bump and joint shape prediction was conducted for the design of wafer level bumping, flip-chip assembly, and wafer level packaging. The results from the prediction methodologies are validated with experimentally measured geometries at each level of design.