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101.
Chih-Wea Wang Chi-Feng Wu Jin-Fu Li Cheng-Wen Wu Tony Teng Kevin Chiu Hsiao-Ping Lin 《Journal of Electronic Testing》2002,18(6):637-647
In this paper we propose a novel built-in self-test (BIST) design for embedded SRAM cores. Our contribution includes a compact and efficient BIST circuit with diagnosis support and an automatic diagnostic system. The diagnosis module of our BIST circuit can capture the error syndromes as well as fault locations for the purposes of repair and fault/failure analysis. In addition, our design provides programmability for custom March algorithms with lower hardware cost. The combination of the on-line programming mode and diagnostic system dramatically reduces the effort in design debugging and yield enhancement. We have designed and implemented test chips with our BIST design. Experimental results show that the area overhead of the proposed BIST design is only 2.4% for a 128 KB SRAM, and 0.65% for a 2 MB one. 相似文献
102.
Wen-Yan Yin Le-Wei Li Tat-Soon Yeo Mook-Seng Leong Pang-Shyan Kooi 《Electromagnetic Compatibility, IEEE Transactions on》2002,44(2):329-337
The direct integral equation is formulated for describing the current on the multiple perfectly conducting strips in cylindrical geometries for an E-polarization plane wave of normal incidence. By using the Galerkin's method, the surface currents on the conducting strips are expanded in the form of a series of Chebyshev polynomials of the first kind, while the unknown expanding coefficients are solved by a set of matrix equations of finite order with a fast convergence rate and a high accuracy. Furthermore, numerical results are presented to demonstrate the variation of the penetrated near-zone field in the presence of one, two, three, four and six cylindrical apertures, and the hybrid effects of both aperture number and aperture angular widths on the penetrated fields are investigated in detail 相似文献
104.
105.
Mingjun Li Kosuke Nagashio Ph.D. Kazuhiko Kuribayashi 《Metallurgical and Materials Transactions A》2002,33(8):2677-2683
A mullite (3Al2O3·2SiO2) sample has been levitated and undercooled in an aero-acoustic levitator, so as to investigate the solidification behavior
in a containerless condition. Crystal-growth velocities are measured as a function of melt undercoolings, which increase slowly
with melt undercoolings up to 380 K and then increase quickly when undercoolings exceed 400 K. In order to elucidate the crystal
growth and solidification behavior, the relationship of melt viscosities as a function of melt undercoolings is established
on the basis of the fact that molten mullite melts are fragile, from which the atomic diffusivity is calculated via the Einstein-Stokes equation. The interface kinetics is analyzed when considering atomic diffusivities. The crystal-growth
velocity vs melt undercooling is calculated based on the classical rate theory. Interestingly, two different microstructures are observed;
one exhibits a straight, faceted rod without any branching with melt undercoolings up to 400 K, and the other is a feathery
faceted dendrite when undercoolings exceed 400 K. The formation of these morphologies is discussed, taking into account the
contributions of constitutional and kinetic undercoolings at different bulk undercoolings. 相似文献
106.
Interfacial segregation of Ti in the brazing of diamond grits onto a steel substrate using a Cu-Sn-Ti brazing alloy 总被引:1,自引:0,他引:1
Wen-Chung Li Shun-Tian Lin Cheng Liang 《Metallurgical and Materials Transactions A》2002,33(7):2163-2172
Diamond grits were brazed onto a steel substrate using a prealloyed Cu-10Sn-15Ti (wt pct) brazing alloy at 925 °C and 1050
°C. Due to the relatively high concentration of Ti in the brazing alloy, the braze matrix exhibited a composite structure,
composed of β-(Cu,Sn), a Cu-based solid solution, and various intermetallic compounds with different morphologies. The reaction of Ti with
diamond yielded a continuous TiC layer on the surfaces of the diamond grits. On top of the TiC growth front, an intermetallic
compound, composed of Sn and Ti, nucleated and grew into a randomly interwoven fine lacey structure. An interfacial structure
developed as the interwoven fine lacey phase was semicoherently bonded to the TiC layer, with the Cu-based braze matrix filling
its interstices. The thickness of such a composite layer was increased linearly with the square root of isothermal holding
time at 925 °C, complying with the law of a diffusion-controlled process. However, at 1050 °C, the segregation behavior of
Ti and Sn to the interfaces between the TiC layer and the braze matrix diminished, due to the increased solubility of Ti in
the Cu-based liquid phase. The enhanced dissolution of Ti in the Cu-based liquid phase at 1050 °C also caused the precipitation
of rod-like CuTi with an average diameter of about 0.2 μm during cooling. SnTi3 was the predominant intermetallic compound and existed in three different forms in the braze matrix. It existed as interconnected
grains of large size which either floated to the surface of the braze matrix or grew into faceted grains. It also exhibited
a nail-like structure with a mean diameter of about 1 μm for the rod section and a lamellar structure arising from a eutectic reaction during cooling. 相似文献
107.
软X射线不仅能引起红细胞表面电荷的变化,同时也能导致淋巴细胞和血小板表面电荷下降,表现为照射后它们的电泳率下降。低剂量范围内,这种电荷的变化是暂时性的,照后4小时降到最低点,24小时后恢复到对照的水平。细胞电泳率的下降与辐射剂量相关。淋巴细胞是一个复杂的细胞群,正常状态下,按细胞在电场中泳动速度的快慢,可分为两个组分:快峰为T细胞,慢峰为B细胞。软X射线照射以后,T和B细胞的电泳率皆减慢,频数分布峰值下降,离散度加大。血小板成分单一,电泳率较一致。 从照射浓集的血小板再加回自身血浆中电泳率的下降较照射血浆再加到血小板中的电泳率下降大得多;受照射的血小板在磷酸缓冲液中电泳率下降较在血浆悬液中严重得多;2000 rad照后,悬浮于血浆中的血小板电泳率能恢复,而悬浮于磷酸缓冲液中则不能恢复,三个方面来看,血浆中可能存在抗辐射因子。超氧化物岐化酶能有效地预防血小板电泳率的下降,从而可阻止血小板的凝聚。 相似文献
108.
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