一种提高嵌入率的语音融合隐藏改进算法

语音信号在较高的采样率下,采样数据具有冗余度。对于秘密语音信号,冗余度越大,算法的嵌入率越低。本文结合信号抽取插值方法,对已有的语音融合隐藏算法提出进一步的改进,以减小秘密语音的冗余度,提高算法的嵌入率。利用高质量的计算机网络这一信息传输途径,进行实验仿真,并从主客观两方面对算法的性能进行评估。实验结果表明,利用本文改进算法,秘密语音的嵌入率得到提高,且恢复的秘密语音信号质量较好,PESQ打分在4.0左右,可懂度高。算法具有较高的可行性。     

ABB自控系统和传动控制系统通讯探究

文本主要以ABB AC450控制系统作为实例,对相关的网络构建硬件配置、故障判断方法以及软件设计进行简要的介绍,并对ABB自控系统和传动控制系统的数据通讯进行分析。     

一种用于天文望远镜的低噪声CCD读出电路

设计了一种用于天文望远镜的低噪声电荷耦合器件(Charge Coupled Devices,CCD)读出电路.该读出电路主要包括电容增益电路、单端转差分电路、双斜率积分电路以及缓冲器电路.CCD读出电路采用SMIC 0.18μm1P6M CMOS工艺实现.后仿真结果表明,在电源电压3.3V,输入信号67kHz,输出信号80mV峰值时,输出信号动态范围86dB,等效输入噪声2.523nV/Hz1/2,整体功耗1.25mW.     

基于激光视觉原理测量玻璃中气泡的尺寸

为了实现玻璃中气泡尺寸的在线测量,基于激光视觉原理,采用线结构激光器、线阵CCD相机和运动控制系统在实验室搭建玻璃气泡的动态测量系统。投射到玻璃表面的线结构激光光斑经变焦镜头成像在相机的光敏阵列上,相机的横向扫描与运动平台的纵向扫描配合,利用Sapera CamExpert图像采集软件获得玻璃气泡的灰度图像;理论上讨论了图像的纵向和横向精度,给出了气泡图像失真的判断依据及工作像素时钟频率与玻璃板纵向运动速率之间的匹配关系;采集了不同纵向运动速率下气泡的灰度图像,利用Sapera Architect软件测量气泡图像的横向和纵向像素数,通过理论计算得出气泡的横向和纵向尺寸,并与直尺测量结果比较,发现纵向尺寸相对误差为0.18,横向尺寸相对误差为0.05。结果表明,在相机工作距离、焦距和像元尺寸确定的情况下在误差允许的范围内该系统可以用来测量气泡的横向尺寸。     

FeO0.7F1.3/C Nanocomposite as a High‐Capacity Cathode Material for Sodium‐Ion Batteries

Searching high capacity cathode materials is one of the most important fields of the research and development of sodium‐ion batteries (SIBs). Here, we report a FeO_0.7F_1.3/C nanocomposite synthesized via a solution process as a new cathode material for SIBs. This material exhibits a high initial discharge capacity of 496 mAh g^?1 in a sodium cell at 50 °C. From the 3^rd to 50^th cycle, the capacity fading is only 0.14% per cycle (from 388 mAh g^?1 at 3^rd the cycle to 360 mAh g^?1 at the 50^th cycle), demonstrating superior cyclability. A high energy density of 650 Wh kg^?1 is obtained at the material level. The reaction mechanism studies of FeO_0.7F_1.3/C with sodium show a hybridized mechanism of both intercalation and conversion reaction.     

High‐Performance Transition Metal Dichalcogenide Photodetectors Enhanced by Self‐Assembled Monolayer Doping

Most doping research into transition metal dichalcogenides (TMDs) has been mainly focused on the improvement of electronic device performance. Here, the effect of self‐assembled monolayer (SAM)‐based doping on the performance of WSe₂‐ and MoS₂‐based transistors and photodetectors is investigated. The achieved doping concentrations are ≈1.4 × 10¹¹ for octadecyltrichlorosilane (OTS) p‐doping and ≈10¹¹ for aminopropyltriethoxysilane (APTES) n‐doping (nondegenerate). Using this SAM doping technique, the field‐effect mobility is increased from 32.58 to 168.9 cm² V^?1 s in OTS/WSe₂ transistors and from 28.75 to 142.2 cm² V^?1 s in APTES/MoS₂ transistors. For the photodetectors, the responsivity is improved by a factor of ≈28.2 (from 517.2 to 1.45 × 10⁴ A W^?1) in the OTS/WSe₂ devices and by a factor of ≈26.4 (from 219 to 5.75 × 10³ A W^?1) in the APTES/MoS₂ devices. The enhanced photoresponsivity values are much higher than that of the previously reported TMD photodetectors. The detectivity enhancement is ≈26.6‐fold in the OTS/WSe₂ devices and ≈24.5‐fold in the APTES/MoS₂ devices and is caused by the increased photocurrent and maintained dark current after doping. The optoelectronic performance is also investigated with different optical powers and the air‐exposure times. This doping study performed on TMD devices will play a significant role for optimizing the performance of future TMD‐based electronic/optoelectronic applications.     

Interconnection Technology Based on InSn Solder for Flexible Display Applications

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than 150°C. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than 150°C. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip‐chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a 20 μm pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at 130°C.     

Physical-layer network coding in k-users MIMO-Y two-way relay channels

In order to exchange information among k users using the technology of physical-layer network coding in the multiple input multiple output Y two-way relay channels,the GSA-GSA scheme was proposed,using the technology of general signal alignment during the uplink and the downlink.The signals were exchanged between every source node align in a transformed subspace,rather than the direct subspace.This was realized by jointly designing the precoding matrices at all source nodes and the processing matrix at the relay.The constraints of the number of sending and receiving antennas and the sum rate of proposed scheme were analyzed.In simulation,it can figure out that the proposed scheme needs fewer antennas in the whole system and can improve the achievable system sum rate under the same SNR and degrees of freedom.     

计算机辅助教学CAI课件程序设计中的若干方法和技巧

结合研制开发的部分大学物理CAI课件,系统地介绍了计算机辅助教学CAI课件程序设计过程中的一些有效方法和技巧,包括CAI课件的开发环境,大型程序设计技术,图形及动画设计方法,西文软件中实现汉字信息提示的方法,调试技巧等。正确地采用这些方法和技巧可以显著地提高CAI课件的质量和研制开发效率。