Dynamic investigation of microbial activity in microbial enhanced oil recovery (MEOR)

The activity of reservoir microorganism is essential to Microbial enhanced oil recovery (MEOR). This present paper investigates the relationship between the microbial activity and production performance by means of long-scale & long-term experiments. The six rounds of nutritional injection was carried out in 135 days. During the microbial flooding experiment was performed recovering additional oil (10.44% Original Oil in Place, OOIP) after first water flooding. There is a positive correlation between water content and shannon index. And the fourth round of nutritional injection causes a considerable reduction in water content, while the concentration of Methyl-coenzyme reductase subunit alpha (mcrA) reaches peak value. In microbial flooding and reference water flooding, the concentration of mcrA maintained higher level with the low concentration of acetic acid. There are intimate correlation between water content and mcrA concentration & bacterial diversity (shannon index), which can be consider the symbol to guide the MEOR filed test.     

稠油热化学驱过程中影响因素及其交互作用对采收率的影响

为了研究稠油热化学驱时温度、驱油剂、润湿性及其交互作用对采收率的影响,采用响应曲面法设计稠油热化学驱实验方案并对实验结果进行分析,明确了各影响因素及其交互作用对稠油热化学驱采收率的影响程度。以自定义的影响权重为指标定量说明各影响因素及其交互作用对稠油热化学采收率的贡献大小,温度对稠油热化学驱采收率的影响权重为58%,驱油剂对采收率的影响权重为23.3%,两者的交互作用对采收率的影响权重为11.4%,三者是稠油热化学驱提高采收率的主要机理。定量研究各影响因素及交互作用对采收率的影响使得稠油热化学驱过程中热与化学剂的协同效果更加明确,进一步深入分析了稠油热化学驱机理。     

永通公司大比例配加镜铁矿的生产实践

介绍了永通公司大比例使用镜铁矿烧结的生产实践,针对镜铁矿成球性和可烧性差的特性,提出了高镜铁矿配比条件下强化烧结过程的有效技术措施,在保证烧结矿产量和质量的前提下,实现了烧结矿成本的降低。     

Design and achievement of a complete bottom-up electroless copper filling for sub-micrometer trenches

The bottom-up filling of electroless copper usually depends on inhibiting the Cu deposition at the surface or accelerating the Cu deposition in the bottom of trenches to achieve a relative high deposition rate of electroless copper in the bottom of trenches. In this paper, a complete bottom-up filling of electroless copper, in which the deposition rates of the electroless copper were not only inhibited at the surface of the substrate, but also were accelerated in the bottom of the trenched, was designed and achieved in the plating bath with an addition of bis (3-sulfopropyl) disulfide (SPS) and polyethylene glycol (PEG). The cross-sectional SEM observation of trenches indicated that all trenches with different widths ranging from 100 to 290 nm were filled completely by electroless copper, and no void was found. This was attributed to three factors, the electroless Cu deposition was accelerated markedly by an addition SPS only; but it was suppressed sharply by a combination addition SPS and PEG-4000; the large molecular weight and lower diffusion coefficient of PEG-4000 resulted in concentration gradient of PEG-4000 in the trenches. The effects of PEG-4000 and SPS on the polarization behaviors of the electroless copper plating bath were investigated by the linear sweep voltammetry method and mixed potential theory.     

美国猪肉产业前景美好

世界肉类组织第三届猪肉会议将于2005年4月27至30日在美国华盛顿召开，以下是美国国家养猪协会首席执行官Steve Murohv对美国猪肉产业的评论：     

铝在新型稀土镁基AB3型贮氢电极合金中的作用研究

借助于自制的开口式H型玻璃三电极测试体系，并在大量的前期实验工作基础上，研究了新型稀土镁基AB3型贮氢电极合金的性能以及添加Al的作用。发现用适量Al替代Ni可降低稀土镁基AB3型合金La0.7Mg0.3（Ni0.85Co0．15）3.5的氢化反应焓变和气态放氢平台压力，使合金氢化物变得更稳定；同时，使合金电化学循环100周期的容量保持率从63．8％提高到90．6％，有效解决了合金放电容量迅速衰减的难题；但Al的添加也降低了合金的最大放电容量、倍率放电性能和活化性能。     

Characterization of sputtered tungsten nitride film and its application to Cu electroless plating

In this study, W and tungsten nitride films were fabricated by reactive sputtering in a N₂/Ar atmosphere, the native oxide growth on the surface of the tungsten nitride films was investigated by X-ray photoelectron spectroscopy (XPS). It was found that tungsten nitride films were the mixture of W and W₂N sputtered in atmospheres of 3 mTorr argon and at the N₂ partial pressure from 0.1 to 2.0 mTorr. The ratio of W and W₂N in films was changed with the nitrogen partial pressure in sputtered chamber. Surface oxidations of the W film and tungsten nitride films advanced with time. Electrochemical measurement shows that all reduction-oxidation (redox) potentials of tungsten and tungsten nitrides were lower than that of copper film in electroless copper solution. And so, electroless-plated copper could be deposited on the surface of tungsten nitride films when the substrates were immersed into electroless copper plating solution without any pretreatment. Tungsten nitride films are appropriate for ULSI Cu interconnections using electroless Cu deposition.     

有机畜禽的国际市场在发展

本文简要介绍了近十年来国际有机肉类产销的发展概况,指出了阻碍有机市场发展存在的问题     

微生物采油数学模型发展现状

综述了目前国内外描述微生物采油的几种数学模型，分析了微生物采油数学模型存在的问题，指出描述各种增产机理和生物特性的实验参数是制约微生物驱油数学模型现场应用的关键，并给出了一个比较完善的数学模型和一套取得相关参数的方法。