340 GHz固定调谐分谐波混频器

基于最新研制的小阳极结反向并联肖特基二极管芯片,设计和制造了320~360 GHz固定调谐分谐波混频器。混频器的结构采用的是传统电场（E）面腔体剖分式结构:将二极管芯片倒装焊粘在石英基片上,再用导电银胶将石英电路悬置粘结在混频器下半个腔体上。电路设计采用场路相结合的方法:用场仿真软件建立混频电路各个功能单元的S参数模型,将它们代入非线性电路仿真软件中与二极管结相结合进行混频器性能整体仿真优化。最终测试结果表明,谐波混频器的双边带在4~6 mW的本振功率驱动下,在320~360 GHz超过12%带宽范围内,双边带变频损耗均小于9 dB;混频器在310~340 GHz频带范围内,双边带噪声温度最低为780 K。声温度最低为780 K。     

Comparison for the carrier mobility between the III-V nitrides and AIGaAs/GaAs heterostructure field-effect transistors

Using the measured capacitance-voltage curves ofNi/Au Schottky contacts with different areas and the current-voltage characteristics for the A1GaAs/GaAs, A1GaN/A1N/GaN and InoAsA10.szN/A1N/GaN heterostructure field-effect transistors （HFETs） at low drain-source voltage, the two-dimensional electron gas （2DEG） electron mobility for the prepared HFETs was calculated and analyzed. It was found that there is an obvious difference for the variation trend of the mobility curves between the Ⅲ-V nitride HFETs and the A1GaAs/GaAs HFETs. In the III-V nitride HFETs, the variation trend for the curves of the 2DEG electron mobility with the gate bias is closely related to the ratio of the gate length to the drainto-source distance. While the ratio of the gate length to the drainto-source distance has no effect on the variation trend for the curves of the 2DEG electron mobility with the gate bias in the A1GaAs/GaAs HFETs. The reason is attributed to the polarization Coulomb field scattering in the Ⅲ-V nitride HFETs.